News & Events

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Redefining thinness of PCBs

Tiny medical implants improve patients’ comfort, smart phones are now build into a watch: Made possible by flexible and rigid ultra-thin base materials for highly reliable and thinner PCBs.

MST at IMAPS Device Packaging 2020

IMAPS
Device Packaging
March 3 - 4, 2020
WeKoPa Resort & Conference Center, Scottsdale/Fountain Hills, AZ, USA
Booth# 57

MST at RF & Microwave 2020

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Radiofrequencies, microwaves, wireless and optical fibre
March 18 - 19, 2020
Paris Expo - Porte de Versailles, Paris, France
Booth# J5

MST at Bodensee Aerospace Meeting

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New trends in aviation and aerospace industry
March 25, 2020
Kongress am Park, Augsburg, Germany

MST at IMAPS New England 2020 - USA

IMAPS
Microelectronics & Packaging
May 12, 2020
Boxboro Regency Hotel, Boxborough, MA, USA

MST at SMTconnect 2020

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Electronic assemblies & systems
May 5 - 7, 2020
Messezentrum Nuremberg, Germany
Booth# 5-114

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.