News & Events

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Redefining thinness of PCBs

Tiny medical implants improve patients’ comfort, smart phones are now build into a watch: Made possible by flexible and rigid ultra-thin base materials for highly reliable and thinner PCBs.

MST at IMAPS Advanced Packaging for Medical Microelectronics 2020 - USA

IMAPS
Advanced Technology Workshop
January 28 - 29, 2020
Westgate Hotel, San Diego, CA, USA

Presentation by Susan Bagen:
Update on Development Progress of Biocompatible LCP Electrodes and Catheters

MST at 16. Leiterplatten-Forum

Logo Bayern Innovativ
Die Leiterplatte als Systemintegrator
January 30, 2020
Haus der Bayerischen Wirtschaft, Munich, Germany

Presentation by Dr. Sebastian Schweiger:
Die Vielseitigkeit der flexiblen Leiterplatte

MST at Southern Manufacturing & Electronics

SME

The most comprehensive annual industrial exhibition in the UK
February 11 - 13, 2020
International Exhibition Center, Farnborough, UK
Booth# J70

MST at MD&M West Anaheim 2020

MD&M West

Medical Design & Manufacturing
February 11 - 13, 2020
Convention Center Anaheim, CA, USA
Booth# 610, Hall E

MST at IMAPS Device Packaging 2020

IMAPS
Device Packaging
March 3 - 4, 2020
WeKoPa Resort & Conference Center, Scottsdale/Fountain Hills, AZ, USA
Booth# 57

MST at Bodensee Aerospace Meeting

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New trends in aviation and aerospace industry
March 25, 2020
Kongress am Park, Augsburg, Germany

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.