News & Events

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Redefining thinness of PCBs

Tiny medical implants improve patients’ comfort, smart phones are now build into a watch: Made possible by flexible and rigid ultra-thin base materials for highly reliable and thinner PCBs.

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24.07.2019

Micro Systems Engineering, Inc. celebrates its 40th anniversary

Lake Oswego, July 24, 2019 – Micro Systems Engineering, Inc. (MSEI), an MST company and leading specialist in high-reliability medical microelectronics including development & design, system integration, and manufacturing celebrated its 40th anniversary in June 2019.

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19.03.2019

World’s smallest active NFC sensor module

DYCONEX has developed a novel approach to miniaturized, hermetic and highly reliable smart sensor modules with diameters down to 6 millimeters. The modules are ideal for use in medical, food processing, pharmaceutical, chemical or industrial applications.

MST at IMAPS Advanced Packaging for Medical Microelectronics 2020 - USA

IMAPS
Advanced Technology Workshop
January 28 - 29, 2020
Westgate Hotel, San Diego, CA, USA

MST at 16. Leiterplatten-Forum

Logo Bayern Innovativ
Die Leiterplatte als Systemintegrator
January 30, 2020
Haus der Bayerischen Wirtschaft, Munich, Germany

Presentation by Dr. Sebastian Schweiger:
Die Vielseitigkeit der flexiblen Leiterplatte

MST at MD&M West Anaheim 2020

MD&M West

Medical Design & Manufacturing
February 11 - 13, 2020
Convention Center Anaheim, CA, USA
Booth# 610, Hall E

MST at IMAPS Device Packaging 2020

IMAPS
Device Packaging
March 3 - 4, 2020
WeKoPa Resort & Conference Center, Scottsdale/Fountain Hills, AZ, USA
Booth# tbc

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.