News & Events

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24.07.2019

Micro Systems Engineering, Inc. celebrates its 40th anniversary

Lake Oswego, July 24, 2019 – Micro Systems Engineering, Inc. (MSEI), an MST company and leading specialist in high-reliability medical microelectronics including development & design, system integration, and manufacturing celebrated its 40th anniversary in June 2019.

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19.03.2019

World’s smallest active NFC sensor module

DYCONEX has developed a novel approach to miniaturized, hermetic and highly reliable smart sensor modules with diameters down to 6 millimeters. The modules are ideal for use in medical, food processing, pharmaceutical, chemical or industrial applications.

MST at MikroSystemTechnik Kongress 2019

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Mikro System Technik
October 28 - 30, 2019
ESTREL Hotel, Berlin, Germany
Booth# 20

Presentation by Zoran Ostojic:
Verkapselung von elektronischen Modulen für aggressive Medien
Wednesday, October 30, 2019, 10:50 am, Saal A

MST at IEEE COMCAS 2019

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International Conference on Microwaves, Communications, Antennas and Electronic Systems
November 4 - 6, 2019
David Intercontinental Hotel, Tel Aviv, Israel 
Booth# 79

MST at COMPAMED 2019

COMPAMED

High tech solutions for medical technology
November 18 - 21, 2019
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.