News & Events


Micro Systems Engineering, Inc. celebrates its 40th anniversary

Lake Oswego, July 24, 2019 – Micro Systems Engineering, Inc. (MSEI), an MST company and leading specialist in high-reliability medical microelectronics including development & design, system integration, and manufacturing celebrated its 40th anniversary in June 2019.


World’s smallest active NFC sensor module

DYCONEX has developed a novel approach to miniaturized, hermetic and highly reliable smart sensor modules with diameters down to 6 millimeters. The modules are ideal for use in medical, food processing, pharmaceutical, chemical or industrial applications.

DYCONEX at PCB West 2019


PCB Industry
September 10, 2019
Convention Center, Santa Clara, CA, USA
Booth# 203

Micro Systems Engineering GmbH (MSE) at EMPC | European Microelectronics and Packaging Conference 2019


September 17, 2019, 2:55 - 3:20 pm
Conference Center, Pisa, Italy

Presentation by Dr. Rainer Dohle:
New Assembly Technology for VCSEL arrays comprising ultra-thin diodes

MST at IMAPS Microelectronics Symposium 2019 - USA

October 1 - 2, 2019
Hynes Convention Center, Boston, MA, USA
Booth# 315

MST at European Microwave Week 2019


Microwave, RF, Wireless & Radar
October 1 - 3, 2019
Paris Expo Porte de Versailles, France
Booth# 2085

MST at EIPC & FED Technical Snapshot Workshop 2019


PCB and Electronics Manufacturing
October 8, 2019
Fraunhofer IZM, Berlin, Germany

Presentation (in German) by Daniel Schulze:
Mehr Funktionalität durch ultradünne Materialien
Tuesday, October 8, 2019 at 2:15 pm


Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.