News & Events

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04.09.2018

DYCONEX introduces automated final inspections

DYCONEX AG now offers customers automated final inspections to further optimize testing of their printed circuit boards.

 

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01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

 

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22.08.2017

LITRONIK accomplishes EN ISO 13485:2016 certification

LITRONIK, an MST company and a specialist in the development and manufacture of compact, ultra reliable batteries for active implants, has successfully completed EN ISO 13485:2016 certification, the international standard for quality management systems for medical devices.

MST at IMAPS Advanced Packaging for Medical Microelectronics 2019 - USA

IMAPS
Technology Workshop on Advances in Medical Microelectronics
January 22 - 23, 2019
The Handlery Hotel, San Diego, CA, USA

Presentation by Susan Bagen:
Fully Organic Packaging for Applications with Liquid Exposure

MST at MD&M West Anaheim 2019

MD&M West

Medical Design & Manufacturing
February 5 - 7, 2019
Convention Center Anaheim, CA, USA
Booth# 610, Hall E

MST at IMAPS Device Packaging 2019

IMAPS
Device Packaging
March 5 - 6, 2019
We-Ko-Pa Resort & Conference Center, Scottsdale/Fountain Hills, AZ, USA
Booth# 5

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.