News & Events

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19.03.2019

World’s smallest active NFC sensor module

DYCONEX has developed a novel approach to miniaturized, hermetic and highly reliable smart sensor modules with diameters down to 6 millimeters. The modules are ideal for use in medical, food processing, pharmaceutical, chemical or industrial applications.

MST at IMS / International Microwave Symposium 2019

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Microwave Technology
June 4 - 6, 2019
Boston Convention Center, Boston, MA, USA
Booth# 1332

MST at Swiss Medtech Day 2019

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Swiss Medical Technology Industry
June 6, 2019
Kursaal, Bern, Switzerland
Booth# 22

Poster Presentation by Dr. Marc Hauer | DYCONEX AG:
Wireless sensor modules for harsh environments based on LCP (Liquid Crystal Polymer)

MST at SENSOR+TEST 2019

SENSOR+TEST

Measuring, Testing, Monitoring
June 25 - 27, 2019
Messezentrum Nuremberg, Germany
Booth# 404, Hall 1

DYCONEX at PCB West 2019

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PCB Industry
September 10, 2019
Convention Center, Santa Clara, CA, USA
Booth# 203

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.