News & Events

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24.07.2019

Micro Systems Engineering, Inc. celebrates its 40th anniversary

Lake Oswego, July 24, 2019 – Micro Systems Engineering, Inc. (MSEI), an MST company and leading specialist in high-reliability medical microelectronics including development & design, system integration, and manufacturing celebrated its 40th anniversary in June 2019.

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19.03.2019

World’s smallest active NFC sensor module

DYCONEX has developed a novel approach to miniaturized, hermetic and highly reliable smart sensor modules with diameters down to 6 millimeters. The modules are ideal for use in medical, food processing, pharmaceutical, chemical or industrial applications.

DYCONEX at PCB West 2019

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PCB Industry
September 10, 2019
Convention Center, Santa Clara, CA, USA
Booth# 203

Micro Systems Engineering GmbH (MSE) at EMPC | European Microelectronics and Packaging Conference 2019

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September 17, 2019, 2:55 - 3:20 pm
Conference Center, Pisa, Italy

Presentation by Dr. Rainer Dohle:
New Assembly Technology for VCSEL arrays comprising ultra-thin diodes

MST at International Symposium on Microelectronics 2019 - USA

IMAPS
Microelectronics
October 1 - 2, 2019
Hynes Convention Center, Boston, MA, USA
Booth# 315

MST at European Microwave Week 2019

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Microwave, RF, Wireless & Radar
October 1 - 3, 2019
Paris Expo Porte de Versailles, France
Booth# 2085

MST at EIPC & FED Technical Snapshot Workshop 2019

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PCB and Electronics Manufacturing
October 8, 2019
Fraunhofer IZM, Berlin, Germany

Presentation (in German) by Daniel Schulze:
Mehr Funktionalität durch ultradünne Materialien
Tuesday, October 8, 2019 at 2:15 pm

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.