News & Events

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09.06.2020

DYCONEX AG implements various measures to reduce lead time

DYCONEX AG is recording its first results from its scheme to reduce the lead time in manufacturing. Production flow has been improved over the past eight months, while waiting times have been cut and investments have been made in new machinery.

MST at RF & Microwave 2020

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Radiofrequencies, microwaves, wireless and optical fibre
September 23 - 24, 2020
Paris Expo - Porte de Versailles, Paris, France
Booth# G24

MST at electronica 2020

electronica

World's leading trade fair for electronics
November 10 - 13, 2020
Messe München, Germany
Hall & Booth# tbc

MST at COMPAMED 2020

COMPAMED

High tech solutions for medical technology
November 16 - 19, 2020
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.