News & Events

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27.03.2020

Covid-19 contingency plans at the Micro Systems Technologies Group

The Micro Systems Technologies (MST) Group is keeping a close eye on the current situation with regard to the impact and spread of covid-19 and seeking to react to current events as appropriately and transparently as possible.

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Staff changes in quality management at DYCONEX AG

DYCONEX is pleased to announce the appointment of Dr Selçuk Mentese as our new Director of the Quality Management and member of the executive management team.

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Redefining thinness of PCBs

Tiny medical implants improve patients’ comfort, smart phones are now build into a watch: Made possible by flexible and rigid ultra-thin base materials for highly reliable and thinner PCBs.

MST at MiNaPAD Forum 2020

IMAPS
Micro/Nano-Electronics Packaging & Assembly
May 27 - 28, 2020
World Trade Center, Grenoble, France
Booth# 17

Presentation by Daniel Schulze | DYCONEX AG
Ultra-thin base materials take PCB miniaturization to the next level
Wednesday, May 27, 2020 at 14:15 h | Session C

MST at IMS | International Microwave Symposium 2020

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Microwave Technology
June 23 - 25, 2020
Convention Center, Los Angeles, CA, USA
Booth# 1411

MST at SENSOR+TEST 2020

SENSOR+TEST

Measuring, Testing, Monitoring
June 23 - 25, 2020
Messezentrum Nuremberg, Germany
Booth# 3C-123

MST at SMTconnect 2020

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Electronic assemblies & systems
July 28 - 30, 2020
Messezentrum Nuremberg, Germany
Booth# 5-114

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.