News & Events

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19.03.2019

World’s smallest active NFC sensor module

DYCONEX has developed a novel approach to miniaturized, hermetic and highly reliable smart sensor modules with diameters down to 6 millimeters. The modules are ideal for use in medical, food processing, pharmaceutical, chemical or industrial applications.

MST at IMAPS New England 2019 - USA

IMAPS
Microelectronics & Packaging
May 7, 2019
Boxboro Regency Hotel, Boxborough, MA, USA

DYCONEX & Micro Systems Engineering GmbH (MSE) at SMTconnect 2019

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Electronic assemblies & systems
May 7 - 9, 2019
Messezentrum Nuremberg, Germany
DYCONEX: Booth# 218E, Hall 5
MSE: Booth# 441, Hall 4

MST at T4M 2019

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Technology for medical devices
May 7 - 9, 2019
Messe Stuttgart, Germany
Swiss Pavilion Booth# 30.6, Hall 9D

MST at IMS / International Microwave Symposium 2019

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Microwave Technology
June 4 - 6, 2019
Boston Convention Center, Boston, MA, USA
Booth# 1332

MST at Swiss Medtech Day 2019

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Swiss Medical Technology Industry
June 6, 2019
Kursaal, Bern, Switzerland
Booth# 22

Poster Presentation by Dr. Eckardt Bihler | DYCONEX AG:
Wireless sensor modules for harsh environments based on LCP (Liquid Crystal Polymer)

MST at SENSOR+TEST 2019

SENSOR+TEST

Measuring, Testing, Monitoring
June 25 - 27, 2019
Messezentrum Nuremberg, Germany
Booth# 404, Hall 1

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.