News & Events

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04.09.2018

DYCONEX introduces automated final inspections

DYCONEX AG now offers customers automated final inspections to further optimize testing of their printed circuit boards.

 

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01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

 

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22.08.2017

LITRONIK accomplishes EN ISO 13485:2016 certification

LITRONIK, an MST company and a specialist in the development and manufacture of compact, ultra reliable batteries for active implants, has successfully completed EN ISO 13485:2016 certification, the international standard for quality management systems for medical devices.

MST at IMAPS Device Packaging 2019

IMAPS
Device Packaging
March 5 - 6, 2019
We-Ko-Pa Resort & Conference Center, Scottsdale/Fountain Hills, AZ, USA
Booth# 5

Micro Systems Engineering GmbH (MSE) at IMAPS Seminar 2019

IMAPS
"AVT - auch in Serie OK!"
March 27, 2019
Universität Rostock | Institut für Gerätesysteme und Schaltungstechnik, Rostock, Germany

Presentation by Jörg Gossler:
SMT-Technik in Kombination mit COB in der Serienproduktion kleiner und mittlerer Stückzahlen

MST at smartsystems integration 2019

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Integration Issues of Miniaturized Systems
April 10 - 11, 2019
Hotel Barceló Sants, Barcelona, Spain
Booth# H-17

Presentation by Dr. Eckardt Bihler | DYCONEX AG:
Miniaturized Electronic Modules for Aggressive Environments

MST at IMAPS New England 2019 - USA

IMAPS
Microelectronics & Packaging
May 7, 2019
Boxboro Regency Hotel, Boxborough, MA, USA

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.