MSE brand page

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Micro Systems Engineering GmbH (MSE)

Profile

Facts & Figures

Engineering

Quality

Publications

Profile

Since 1984 MSE has specialized in customer-specific solutions for advanced microelectronics. The company belongs to the leading European suppliers of complex LTCC (Low Temperature Co-fired Ceramics) substrates, advanced board assembly and semiconductor packaging technologies.

From the early days until now, the manufacture of electronic modules for implantable active devices at the highest quality level has been one of main business segments. MSE has focused on excellence ever since.

Further, MSE has always been convinced that all the knowledge, experience and dedication mandatory in medical device production should also be available to customers of other industries who likewise expect leading-edge production technology. The company applies the expertise and experience it has gained in medical technology to every sector where high reliability, miniaturization, high temperatures, high frequencies or hermetic encapsulation play an important role.
MSE supports its customers as a partner from the concept phase through prototyping to volume production, from design support through quality management to procurement.

Based on customer-specific requirements, MSE offers all the key processes needed to manufacture an electronic module from one source:

  • Design service for ceramic and organic substrates, as well as others such as thin film, DCB, etc.
  • Substrate manufacturing: LTCC (low-temperature co-fired ceramics) and thick film
  • Advanced assembly processes such as SMT, flip chip, wire bonding, die attach, etc. on any base materials
  • Packaging processes for BGA (ball grid arrays), LGA (land grid arrays), QFP (quad flat packages), etc.
  • Special services including customer-specific tests, project management, validation, materials procurement on a worldwide basis, etc.

The most modern production lines, comprehensive test and inspection equipment, 100 percent traceability for processes and materials guarantee top-level solutions in microelectronics.

With some 300 skilled workers, technicians, engineers and scientists MSE has the critical mass for all key processes, still maintaining the efficiency and flexibility of a mid-sized enterprise. MSE has its headquarters in Berg (Upper Franconia), roughly 60 km north of Bayreuth, Germany. The facility located there has a total floor space of 6’000 m2.  MSE is ISO 13485, ISO 9001 and ISO 50001 certified.


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mse logo

Micro Systems  Engineering GmbH
Schlegelweg 17
DE-95180 Berg
Germany

Tel. +49 (9293) 78-0
Fax +49 (9293) 78-41
info.msegmbh(at)mst.com

Facts & Figures

Foundation

1984

Headquarters

D-95180 Berg (Northern Bavaria), Germany

Business premises

6000 m2, including 2500 m2 clean room

Employees

300

Products & services

  • Design services

  • Substrate manufacturing

  • Advanced assembly

  • Semiconductor packaging

  • Test services

  • Global material procurement and supply chain management

Main export markets

Europe, USA

Management

David Smietanski

Quality standards

  • DIN EN ISO 9001:2015

  • SN EN ISO 13485:2016

  • DIN EN ISO 50001:2011

Memberships

Cluster MikrosystemtechnikiMAPS Germany, iMAPS International, INNOMAG, DVS, MEPTEC, SMTA

mse logo

Micro Systems  Engineering GmbH
Schlegelweg 17
DE-95180 Berg
Germany

Tel. +49 (9293) 78-0
Fax +49 (9293) 78-41
info.msegmbh(at)mst.com

Engineering

Design services

MSE offers concepts and design support for the following technologies:

  • LTCC (substrates manufactured by MSE)
  • Thick film (substrates manufactured by MSE)
  • HTCC (High Temperature Co-fired Ceramic)
  • HDI PCB (High Density Interconnect Printed Circuit Board)
  • Rigid-flex PCB
  • DCB (Direct Bonded Copper)
  • Thin film
  • MCM (Multi Chip Modules)
  • SiP (System in Package)

The MSE team works with the following design systems and interfaces:

  • Altium Designer
  • CAM 350
  • Gerber + aperture table
  • Extended Gerber preferred
  • DXF
  • HPGL
  • Graffy/Hyde

R&D projects

MSE is participating in various government funded research and development projects to maintain its leading position in the electronics world.
In addition to other projects, MSE is currently working on:

 

BiSWind

Miniaturized and energy autonomous sensor elements based on complex 3D-shaped LTCC substrates to facilitate real time supervision of wind turbine shaft systems

MultiMat

Multi material systems for enhanced sensor integration and miniaturization based onceramic substrates by additive manufacturing processes

MecDruForm

Plastic films by combining printing technologies


Quality

MSE was founded as a supplier of electronic modules for implantable pacemakers. The development and manufacture of modules for life-sustaining medical devices and other critical applications characterise the quality awareness and the management system of MSE.

Every employee's activities are highly focused on customer requirements plus the quality and reliability of all products and services.Continual improvement of all processes, ongoing training and further education as well as the careful and efficient use of all resources are further cornerstones of MSE's uncompromising quality policy.
During manufacturing, MSE guarantees complete traceability of materials and processes. A wide range of manufacturing tests, stress tests and other means of analysis is available to demonstrate the performance of components and modules.

Today, the effectiveness of MSE's quality system is confirmed by official certification to ISO 13485, ISO 9001 and ISO 50001.


Inspection and Test

  • X-Ray and CT
    - 01005 and fine-pitch inspection
    - Combined 2D / 3D CT-operation
    - Solder joint analysis
    - Package inspection
  • Scanning Acoustic Microscopy
    - Detection of delamination, cracks, voids and porosity
  • Optical surface scan
  • Cross sectioning
  • Temperature cycling (-65°C/+250°C)
  • Hermeticity test
  • Wire pull test
  • Component shear test
  • Flying probe tester
  • Contamination measurement
  • X-ray fluorescence method
  • SEM/EDX (external service)

Downloads

Publications

MSE has published a wide range of papers in the field of ceramic circuits and in the field of assembly and packaging. If you are interested in receiving the full paper please contact MSE under following e-mail address: info.msegmbh(at)mst.com.


Publications in the field of assembly and packaging

LTCC-Based Highly Integrated SiPM Module With Integrated Liquid Cooling Channels for High Resolution Molecular Imaging

R. Dohle, I. Sacco, Th. Rittweg, Th. Friedrich, G. Henning, J. Goßler, P. Fischer,
Journal of Microelectronics and Electronic Packaging, 2018

Study on electromigration in flip chip lead-free solder connections with 40 µm or 30 µm diameter on thin film ceramic substrates

Gorywoda M., Dohle R., Kandler B., Burger B.,
IMAPS International Symposium on Microelectronics, Orlando, Florida, October 26 - 29, 2015

On the failure mechanism in lead-free flip-chip interconnects comprising ENIG finish during electromigration

Dohle, R., Gorywoda, M., Wirth, A., Burger, B., Goßler, J., 
ECTC, San Diego, California, May 26 - 29, 2015

Investigation of electromigration behaviour in lead-free flip-chip solder connections

Dohle, R., Gorywoda, M., Wirth, A., Goßler, J., 
5th Electronics System-Integration Technology Conference, Helsinki, Finland, September 16 - 18, 2014

Small to Mid Quantity SDBGA Packaging Line for Active Medical Implants: Conception, Implementation and Challenges

Perrone, R., Goßler, J., 
Micro Systems Engineering GmbH, Medical Electronics Symposium, Lake Oswego, Oregon, September 18 - 19, 2014

Langzeitstudie zur Elektromigration in bleifreien Flip Chips mit Lotkugeldurchmessern von 50 µm oder 60 µm und ENIG-Finish auf der Chip- und Leiterplattenseite

Marek Gorywoda, Dr. Rainer Dohle, Andreas Wirth, Bernd Burger, Jörg Gossler,
4. Landshuter Symposium Mikrosystemtechnik, Landshut, 12./13.03.2014

Produktionsprozesse für Stacked Die Ball Grid Arrays

Jörg Gossler,
Fachseminar "Innovationen in der Aufbau- und Verbindungstechnik", Nürnberg, 30.01.2014

Long-Term Electromigration Study of Lead-Free Flip-Chips with Solder Bumps with 50 µm or 60 µm Diameter Employing ENIG Surface Finish on Both Chip and Substrate Side

Gorywoda, M., Dohle, R., Härter, S., Wirth, A., Goßler, J., Franke, J.,
Proceedings of the 46th International Symposium on Microelectronics, Orlando, Florida, September 29 - October 3, 2013

Electromigration Performance of Flip-Chips with Lead-Free Solder Bumps between 30 µm and 60 µm Diameter

Dohle, R., Härter, S., Wirth, A., Goßler, J. Gorywoda, M., Reinhardt, A., Franke, J.,
Proceedings of the 45th International Symposium on Microelectronics, San Diego, California, September 9-13, 2012

Reliability Study of Lead-Free Flip-Chips with Solder Bumps Down to 30 µm Diameter

Härter, S., Dohle, R., Reinhardt, A., Goßler, J., Franke, J.,
Proceedings 62nd Electronic Components and Technology Conference, San Diego, California, 2012

Zuverlässigkeit hochminiaturisierter Flip-Chip Baugruppen mit Leiterplatten in Subtraktivtechnologie

Dohle, R., Friedrich, T., Goßler, J., Georgiev, G.,
DVS/GMM-Tagung Elektronische Baugruppen und Leiterplatten, Fellbach, Februar 2012

Packaging eines Beschleunigungssensors für aktive medizinische Implantate

R. Perrone, T.Friedrich und J. Goßler,
Deutsche IMAPS-Konferenz 2012

Assembly und Packaging von Elektronikmodulen für medizinische Implantate

Jörg Goßler,
ZVEI AVT-Expertentreffen 2011; Frankfurt, 6.12.2011

Accelerated Life Tests of Flip-Chips with Solder Bumps Down to 30 µm Diameter

Dohle, R., Härter, S., Goßler, J., Franke, J.,
Proceedings of the 44th International Symposium on Microelectronics, Long Beach, California, October 9-13, 2011 (Best Paper Award)

Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30 µm

Oppert, T., Dohle, R., Franke, J., Härter, S.,
Proceedings of the 44th International Symposium on Microelectronics, Long Beach, California, October 9-13, 2011

Assembly and Packaging von Elektronikmodulen für medizinische Implantate - ein Überblick

R. Perrone, J. Gossler,
DVS-Tagung AG-Bonden, Oberbärenburg, Juni 2011

Processing and Reliability Analysis of Flip-Chips With Solder Bumps Down to 30 µm Diameter

Franke, J., Dohle, R., Schüßler, F., Oppert, T., Friedrich, T., Härter, S.,
Proceedings 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, 2011

Solder Bumping and Processing of Flip-Chips with a Solder Bump Diameter of 30 μm or 40 μm

Oppert, T., Dohle, R., Schüßler, F., Franke, J.,
Proceedings International Conference on Electronics Packaging (ICEP) 2011, Nara, Japan, 2011

Room Temperature Wedge-Wedge Ultrasonic Bonding using Aluminum Coated Copper Wire

Dohle, R., Petzold, M., Klengel, R., Schulze, H., Rudolf, F.,
Microelectronics Reliability (Elsevier) 51 (2011)

Kontaktierungsverfahren und Prozesstechnik für Ultra-Fine-Pitch-Baugruppen

Autorenkollektiv,
Verlag FAPS-TT GmbH, Nürnberg 2010, ISBN 978-3-87525-313-9

Passive Integration für LTCC Mikrowellen-Module - Technologie und Design Optimierung

Rubén Perrone, Jens Müller,
Deutsche IMAPS-Konferenz 2010

State of the Art of Assembly and Packaging of Electronic Modules for Medical Implants

Jörg Goßler,
iNEMI Medical Packaging Workshop; September 17, 2010, Berlin

Adapted Assembly Processes for Flip-Chip Technology With Solder Bumps of 50 µm or 40 µm Diameter

Dohle, R., Schüßler, F., Friedrich, T., Goßler, J., Oppert, T., Franke, J.,
Proceedings 3rd Electronic System-Integration Technology Conference (ESTC), Berlin, 2010

Automatisierte Bestückung und Underfill von Ultra-Fine-Pitch Flip-Chips

Dohle, R., Schüßler, F., Friedrich, T., Goßler, J., Oppert, T., Franke, J.,
2. Landshuter Symposium Mikrosystemtechnik, Landshut, 2010

Hochpolige Fine-Pitch-Ball-Grid-Array-Baugruppen mit niedrigschmelzenden Lotwerkstoffen

Dohle, R. Goßler, J., Kemethmüller, S., Pohlner, J., Dünne, T.,
Vortrag auf dem Spezialseminar (BFE-13sp) niedrigschmelzende Lotwerkstoffe bei Loewe-Opta, 7. September 2010

Assembly und Packaging von Elektronikmodulen für medizinische Implantate - ein Überblick

Jörg Goßler,
SMT / Hybrid / Packaging; 9. Juni 2010, Nürnberg

Bereitstellung kleinster Lotmengen bei feinsten Anschlussstrukturen

Dohle, R.,
Abschlusspräsentation ProUFP, 14. April 2010, BMBF-Förderkennzeichen 02PG2361

Flip-Chip-Technologie - fit für künftige Anforderungen ?

Jörg Goßler,
25. µTP-Workshop "ProUFP"; 14. April 2010, Nürnberg

Automatisierte Bestückung und Underfill von Ultra-Fine-Pitch Flip-Chips

Rainer Dohle, Thomas Friedrich, Jörg Goßler,
2. Landshuter Symposium Mikrosystemtechnik; Februar 2010, Landshut


Publications in the field of LTCC and thick film circuits

LTCC-Based Highly Integrated SiPM Module With Integrated Liquid Cooling Channels for High Resolution Molecular Imaging

R. Dohle, I. Sacco, Th. Rittweg, Th. Friedrich, G. Henning, J. Goßler, P. Fischer,
IMAPS International Symposium on Microelectronics, October 9-12, 2017, Raleigh, North Carolina, USA

more information

Embedded Cavity based Dielectric Loss Measurements for LTCC Substrates up to 110 GHz

A. Talai, F. Steinhaußer, A. Bittner, U. Schmid, R. Weigel, D. Schwanke, Th. Rittweg, A. Koelpin,
IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), August 11-14, 2015, Ottawa, Canada

LTCC Based Microfluidic Mass Flow Sensor Concept

C. Zeilmann, T. Haas, A. Backes, U. Schmid,
Journal of Microelectronics and Electronic Packaging (2012) 9, 87-96

Micro Fluidic Mass Flow Sensor Concept for Functional Ceramic Circuits

C. Zeilmann, T. Haas, A. Backes, U. Schmid,
Paper Ceramic Interconnect & Ceramic Microsystems Technologies CICMT 2012 Erfurt

Verbundprojekt AeroSens, Ziele und Struktur des Projektes, Testvehikel-Fertigung durch MSE

Dieter Schwanke, Jürgen Pohlner, Cluster AeroSens,
Deutsche IMAPS Konferenz, München, 2012

Optimization of silver paste for flexography printing on LTCC substrate

R. Faddoul, N. Reverdy-Bruas, A. Blayo, T. Haas, C. Zeilmann,
Journal of Microelectronics Reliability, Vol. 52, Issue 7, July 2012, ISSN 0026-2714

Investigation of Pressure Sensor Concepts for Functional Ceramic Circuits

T. Haas, C. Zeilmann, U. Schmid,
International Symposium on Ceramic Materials and Components for Energy and Environmental Applications, CMCEE, Dresden, Germany, 2012

Manufacturing Processes for Pressure Sensors Realized in LTCC

T. Haas, C. Zeilmann, U. Schmid, A. Bittner,
Konferenz Mechatronics, Linz, Austria, 2012

Investigation of Innovative Cooling Concepts for Functional Ceramic Circuits

T. Haas, C. Zeilmann, A. Backes, A. Bittner, U. Schmid,
European Advanced Technology Workshop on Micropackaging and Thermal Management, IMAPS France, LaRochelle, France, 2011

Investigation on Micromachining Technologies for the Realization of LTCC Devices and Systems

T. Haas, C. Zeilmann, A. Bittner, U. Schmid,
SPIE Microtechnologies, Prague, Czech Republic, 2011

Passive Integration für LTCC-Mikrowellen-Module - Technologie- und Designoptimierung

Ruben Perrone, Dieter Schwanke, Jens Müller,
Deutsche IMAPS Konferenz, München, Oktober 2010

Design and Evaluation of an Active Cooling Concepts for Functional Ceramic Circuits

T. Haas, C. Zeilmann, A. Backes, A. Bittner, U. Schmid,
21st Micromechanics and Micro Systems Europe Workshop, MME, Enschede, The Netherlands, 2010

Entwicklung nanotechnologischer Siebbeschichtungen und daran angepasster Pastensysteme für den Fine-Line-Druck von keramischen Schaltungsträgern

D. Schwanke et. al.,
2010, Verlag Dr. Markus A. Detert, ISBN13: 978-3-934142-39-8