News & Events

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12.05.2016

DYCONEX celebrates its 25th anniversary

DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.

28.04.2016

MST strengthens its sales force in Israel with E.D.E. Electronics as representative

The Micro Systems Technologies Group (MST) is pleased to welcome E.D.E. Electronics Ltd. as new representative in Israel.

DYCONEX at ILA Berlin 2016

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The focal point of aerospace
June 1-4, 2016
Berlin ExpoCenter Airport
Hall ILA6, Booth# 620

MST at MD&M East New York 2016

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Medical Design & Manufacturing
June 14 - 16, 2016
Jacob K. Javits Convention Center, New York, NY, USA
Hall 3, Booth# 557

MST at Medical Manufacturing Asia 2016

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Manufacturing Processes for Medical Technology
August 31 - September 2, 2016
Marina Bay Sands, Singapore
Booth# 2M17

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.

Hermetic feedthroughs

Hermetic feedthroughs

Ceramic-to-metal, glass-to-metall or glass/ceramic-to-metal feedthroughs for hermetically sealed interfaces in active medical implants, implantable batteries and sensors.