Brochures Leaflets & Data Sheets

Company Brochures

MST Company Overview (PDF)

DYCONEX Company Brochure (PDF)

LITRONIK Company Brochure (PDF)

MSE Company Brochure (PDF)

Technology Leaflets

Primary Battery Technology leaflet preview

Primary Battery Technologies

High-Performance Batteries for Active Medical Implants

Flexible PCB technology leaflet preview

Flexible Printed Circuit Boards

For highly durable and reliable miniaturized electronics

LTCC technology leaflet preview

Low-Temperature Co-fired Ceramic Substrates (LTCC)

Exceptional Performance in RF and Microwave Applications

Flexible Implanted Electrodes technology leaflet preview

Flexible Implanted Electrodes

Durable and Biocompatible Substrate Technology for Medical Use

Hermetic Feedthroughs technology leaflet preview

Hermetic Feedthroughs

Biocompatible Interface Component for Active Implants

Rigid IC Substrates and Ultra HDI Boards technology leaflet preview

Rigid IC Substrates & Ultra HDI Boards

High Reliability and Component Density for Advanced Electronics

Semiconductor Packaging technology leaflet preview

Semiconductor Packaging

& System in Package and Class 3 Assembly in Europe

MST Technology Leaflet Class 3 Assembly

Class 3 Assembly

For Medical Implants

Materials

Materials (PDF)

Rigid-flex (PDF)

Advanced Rigid Substrates for HF Applications, Ultra-thin Bild-ups and Chip Packages (PDF)

Smallest form Factor Acitve NFC Tag for Sensor Applications in Harsh Enviroments (PDF)

Interconnect Solutions such as Wrap-Around PCBs for Optimal Thermal Management (PDF)

Biocompatible Flexible Substrates for Directly Implantable Applications (PDF)

Advanced LCP Substrates for HF & Microwave Applications (PDF)

Battery Data Sheets

High Energy Batteries

LiS 2650 High Energy (PDF)

LiS 3150 High Energy (PDF)

Medium Rate Batteries

LiS 2044 Medium Rate (PDF)

LiS 2044K Medium Rate (PDF)

LiS 2650M Medium Rate (PDF)

LiS 3150M Medium Rate (PDF)

High Power Batteries

LiS 2592 High Power (PDF)