Rigid

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HDI & Ultra-HDI Rigid

Over the past decade, the selection of tools available for the manufacture of high density rigid printed circuit boards (PCBs) has been greatly enhanced. The introduction of ultra-high speed mechanical drilling systems, improved laser technologies and x-ray based/SPC-supportable registration tools has bolstered the capabilities of leading PCB manufacturers around the world. Combined with exciting new material selections, powerful interconnect solutions are now realizable in the rigid board space that up to now were distinctly the territory of flex circuit or non-PCB based technologies.

 

Technology Highlights

  • High reliability in numerous applications from implantable medical devices to MIL and space applications
  • DYCOstrate® build-up with buried, blind, staggered and stacked vias
  • Thermal management solutions including exotic carbon or invar based heat dissipation materials, heat-sinks, thermal vias and more
  • High frequency rigid multilayer circuit boards in combination with LCP as well as other glass reinforced materials
  • Ultra-thin base materials
  • Low CTE materials
  • Vibration resistant metal core boards
  • Tight line width tolerances for signal integrity
  • A wide variety of surface finishes such as ENIG, ENEPIG, HASL, OSP, immersion Sn, immersion Ag, electroplated Ni/Au

 

General capabilities for polyimide rigid circuit boards:

Description

Standard Capabilites

Lines/spaces

35/40 µm

Microvias/pads (laser) Ø

75/200 µm

Through vias/pads (mechanical) Ø 

125/250 µm

Thinnest starting material

50 µm

Thinnest dielectric thickness

60 µm

Conductor width tolerance

+/- 20%

Artwork to soldermask tolerance

+/- 25 µm

Layer count

20+

Description

Leading-Edge Capabilities

Lines/spaces

25/35 µm

Microvias/pads (laser) Ø

50/150 µm

Through vias/pads (mechanical) Ø

100/200 µm

Thinnest starting material

30µm

Thinnest dielectric thickness

30 µm

Conductor width tolerance

+/- 10%

Artwork to soldermask tolerance

+/- 15 µm

Layer count

up to 24


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