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What we offer
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What we offer
Technologies
Driven by the requirements of high-tech markets, MST relies on sustainable development programs so as to continually refine its technologies. These leading-edge technologies along with many years of experience are available to you for solutions that require exceptional performance and the highest levels of reliability.
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- Design services
- Highly complex ultra-HDI/microvia PCBs in flex, rigid-flex and rigid technology
- Chip packaging substrates
- LCP substrates
- Ceramic substrates based on LTCC (low-temperature co-fired ceramic) and thick film
- Test services
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- On ceramic and organic substrates
- Automated SMD assembly
- Flip chip / CSP capability
- Die attach technologies
- Wire bonding
- Mixed assembly – COB and SMT
- Die protection and encapsulation
- Test services
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- High-density chip packaging substrates based on various materials
- Stacked Die BGAs using transfer moulding for small and medium-sized volumes
- High voltage BGAs
- BGA, LGA and QFP configurations
- Laser cutting and marking
- Hermetic and non-hermetic housings
- Miniaturisation solutions
- Test services
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- High-performance primary batteries for medical implants
- Based on Lithium-Iodine, Lithium-Manganese Dioxide and Lithium-Carbon Monofluoride electrochemical systems
- Very high volumetric energy and power densities
- Very low self-discharge
- Long operational safety
- Electrical characterisation services