Technologies

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What we offer
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What we offer


Technologies

Driven by the requirements of high-tech markets, MST relies on sustainable development programs so as to continually refine its technologies. These leading-edge technologies along with many years of experience are available to you for solutions that require exceptional performance and the highest levels of reliability.


  • Design services
  • Highly complex ultra-HDI/microvia PCBs in flex, rigid-flex and rigid technology
  • Chip packaging substrates
  • LCP substrates
  • Ceramic substrates based on LTCC (low-temperature co-fired ceramic) and thick film
  • Test services
  • On ceramic and organic substrates
  • Automated SMD assembly
  • Flip chip / CSP capability
  • Die attach technologies
  • Wire bonding
  • Mixed assembly – COB and SMT
  • Die protection and encapsulation
  • Test services
  • High-density chip packaging substrates based on various materials
  • Stacked Die BGAs using transfer moulding for small and medium-sized volumes
  • High voltage BGAs
  • BGA, LGA and QFP configurations
  • Laser cutting and marking
  • Hermetic and non-hermetic housings
  • Miniaturisation solutions
  • Test services
  • High-performance primary batteries for medical implants
  • Based on Lithium-Iodine, Lithium-Manganese Dioxide and Lithium-Carbon Monofluoride electrochemical systems
  • Very high volumetric energy and power densities
  • Very low self-discharge
  • Long operational safety
  • Electrical characterisation services