Advanced assembly

SMT (Surface Mount Technology) and chip & wire technologies are available for the assembly of components like SMD, BGA, LGA, CSP, flip chips or bare dies on ceramic and organic substrates.


Surface Mount Technology (SMT)

  • Three automated SMD assembly lines
  • On any board material
  • Plasma and IPA cleaning available
  • 01005 components up to 85 x 85 mm2
  • Flip chip / CSP (chip scale package) capability

Die attach technologies

  • Gluing by epoxy printing, epoxy dispensing, pre-forms and stamping
  • Soldering by solder printing, solder dispensing and pre-forms
  • High precision die bonder can pick from wafers, waffle packs or gel-packs

Wire bonding

  • Ultrasonic bonding for Al thin wires
  • Thermosonic wedge/wedge bonding for Au thin and Au cold wires
  • Thermosonic ball/wedge bonding for Au thin wires

Die protection / encapsulation

  • Glop top (temperature or UV curing)
  • Underfill
  • Junction coating
  • Transfer molding
  • Soldering or gluing for covers and lids