Our technology roadmap looks ahead to allow us to meet the future demands of current and targeted customers and fully satisfy their requirements from 2013 to through 2016. The roadmap is based on the regular production of optimized build-ups, but many technologies are available at DYCONEX a full year earlier for prototypes and R&D purposes.
|Conductor lines/spaces||18/22 µm||16/20µm||15/20µm||13/18 µm|
|Microvias/pads diameter, laser flex||40/130µm||35/110 µm||35/100 µm||30/90 µm|
|Microvias/pads diameter, laser rigid||50/150µm||40/130 µm||40/120µm||40/120 µm|
|Artwork to soldermask tolerance||+/-15 µm||+/-15 µm||+/-15 µm||+/-10 µm|
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DYCONEX AG, CH-8303 Bassersdorf, Switzerland