Flexible Substrates for Smart Sensor Applications
A novel approach that delivers miniaturized, hermetic, biostable and highly reliable smart sensor modules.
Authors: Dr. Eckardt Bihler, Dr. Marc Hauer, Birgit Neubauer
Why Predictability Matters in High-End PCB Manufacturing
An advanced approach that delivers predictability, serving as the basis for assuring ongoing reliability.
Noble Metal PCB Manufacturing for Direct Implants
The market of active implantable devices requires new strategies in designing and manufacturing the relevant components.
New Features For High-Frequency LCP Package Substrate
Emerging RF system applications, especially in the field of radar or security technology, significantly drive RFIC packaging and HF PCB development.
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