Stacked Via

As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via-filling process for laser-drilled blind vias. The process enables an anylayer blind via configuration for flexible PCB layout routing. The short signal way of stacked blind vias will always guarantee an excellent high frequency performance.

With this new development, in combination with its offering of stacked vias, DYCONEX can now provide full flexibility in layer interconnect. By applying a build-up that consists of stacked vias, PCB designers can achieve significant size reductions as well as attain a planar surface that is especially well suited for direct chip attachment and/or BGA soldering processes.

Furthermore, filled vias give designers exacting control of how operating heat is routed to the PCB's surface for its efficient dissipation.

DYCONEX status:

  • process including filled blind vias and stacked vias is available
  • minimum filled via/pad diameter = 50/150 µm
  • up to 10 via stacks possible
  • stacking in polyimide, LCP, R4
  • large IST database for reliability predictions