Embedded Components

Technologies that embed active and passive devices are not yet fully developed. Various embedding approaches coexist today, but they lack thorough integration into the serial production process. The technological promises of the basic technology are nonetheless considerable, offering the opportunity for higher PCB functionality, performance and density. Thus electronics manufacturers continue to show high interest in the use of embedded technologies for their PCB designs.

DYCONEX shares this interest in the subject because it further enables micro system miniaturization. We are therefore actively working on this area by devoting significant internal R&D resources to it as well as through participation in EU research projects.


DYCONEX status:

  • embedding of test IC in LCP demonstrated with reliability data available upon request
  • embedding active components in LCP as part of an EU funded project