Backed by more than 50 years of experience in building PCBs, with our state-of-the-art equipment and extensive engineering know-how, DYCONEX specializes in the most complex rigid interconnect solutions. The company has earned a reputation as a supplier of high-quality and high-reliability PCBs, especially to the medical, defense and aerospace markets. Rigid capabilities include ultra-high density multilayer boards, high-temperature and thermal-management PCBs as well as RF, ruggedized and metal-core solutions using a variety of dielectric substrates.

Technology Highlights

  • High reliability in numerous applications from implantable medical devices to MIL and space applications
  • DYCOstrate® build-up with buried and blind vias
  • Thermal-management solutions including exotic carbon based heat dissipation materials, heat-sinks, thermal vias and more
  • High-frequency rigid multilayer circuit boards in combination with LCP (liquid crystal polymer) as well as other glass-reinforced materials
  • Vibration-resistant metal-core boards
  • Tight line width tolerances for signal integrity
  • A wide variety of surface finishes such as ENIG, ENEPIG, HAL, OSP, immerison Sn, immersion Ag, electroplated Ni/Au

General capabilities for polyimide rigid circuit boards:

Description Standard Capabilites
Lines/spaces 35/40 µm
Microvias/pads diameter (laser) 75/200 µm
Through vias/pads diameter (mechanical) 125/250 µm
Thinnest starting material 50 µm
Thinnest dielectric thickness 60 µm
Conductor width tolerance +/- 20%
Artwork to soldermask tolerance +/- 25 µm
Layer count 20+
Description Leading-Edge Capabilities
Lines/spaces 25/35 µm
Microvias/pads diameter (laser) 50/150 µm
Through vias/pads diameter (mechanical) 100/200 µm
Thinnest starting material 50 µm
Thinnest dielectric thickness 46 µm
Conductor width tolerance +/- 15%
Artwork to soldermask tolerance +/- 15 µm
Layer count up to 24