Flex Printed Circuits

Many complex interconnect challenges are best addressed with flexible printed circuit technology. In the pursuit of continuous miniaturization, the outstanding properties of flex base materials enable smaller application form factors with the benefit of reduced weight and optimized volume utilization. In addition to facilitating designs with ultra-dense and precise conductor geometries, we have found that polyimide or LCP (liquid crystal polymer)-based flex materials provide excellent electrical and RF performance characteristics. All these attributes are indispensable to an electronics industry that is driven by the ever-challenging quest to extend functionality on continuously smaller footprints.

With inventions like DYCOstrate and the plasma-etched microvia, DYCONEX is an enduring pioneer of flexible multilayer HDI (high-density interconnect) and Ultra-HDI boards. We are empowered by an unquestionable commitment to serve this business segment. As a technology frontrunner, DYCONEX is equipped to cope with cutting-edge design requirements and the most demanding quality standards as applied in the medical and defense industries.

Our high-yield manufacturing of HDI(1 and ultra-HDI(2 flex applications and professional, hands-on consulting services are compelling reasons to make DYCONEX your FPC partner of choice.

(1 HDI flex - lines/spaces 50-150 µm, vias 75-130 µm
(2 Ultra-HDI flex - lines/spaces <50 µm, vias 25-75 µm


Technology Highlights

  • Turnkey flex solutions targeting 3D miniaturization
  • Highly reliable, extremely robust multilayer flex/microvia substrates
  • Filled via and stacked via process available (Anylayer technology)
  • Complex mechanical/assembly assist features, including special profiles, fold lines, cut-outs and thinned bending zones/cavities
  • Wrap-around boards
  • Chip-on-flex (COF) and chip scale packaging (CSP) substrates
  • A wide variety of surface finishes for standard assembly applications, for example OSP, ENIG and ENEPIG; for applications with special bending requirements, Dyconex offers Ni-free surface finishes for example E-AU, DIG, ISIG, EPIG
  • Flying leads
  • Bending test for flexible circuits
  • Ultra High Density flex cables
  • Ultrathin 3-12 µm Pi layer
  • Flying leads and bridges

General capabilities for flex circuit boards:

Description Standard Capability
Lines/spaces 25/35 µm
Microvias/pads diameter

50/150 µm

Thinnest starting material 25 µm
Thinnest dielectric thickness 12 µm
Conductor width tolerance +/- 20%
Artwork to soldermask tolerance +/- 25 µm
Layer count 8
Description Leading edge capability
Lines/spaces 20/25 µm
Microvias/pads diameter 40/100 µm
Thinnest starting material 12 µm
Thinnest dielectric thickness  3 µm
Conductor width tolerance +/- 10 %
Artwork to soldermask tolerance +/- 15 µm
Layer count 10+