Production facilities at DYCONEX are designed to manufacture any type of high-end HDI (high-density interconnect) PCB with superior quality. Furthermore they allow the highest degree of flexibility in build-ups as well as process flows.
Every process module is set up as an independent work center within our production area. The most critical process steps (lithography, lamination, solder masking) are performed in a high-end clean room environment.
To master the extreme level of complexity in our production line we employ a highly sophisticated IT infrastructure. Full traceability is guaranteed from the lot level down to the individual print on a panel as well as for all base materials used.
The transition from prototype to volume production is a seamless process - all development activities are performed on target equipment, avoiding the use of lab or bench equipment during the initial phase of a product ramp-up.
© 2019 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland