Facts & figures

Experience Since 1964 (management buy-out as DYCONEX in 1991)
Headquarters Bassersdorf / Zurich, Switzerland
Manufacturing area 6'000m2, including 600m2 of clean room 
Employees 190
Products









  • Ultra-high-density/microvia PCBs in flex,
    rigid-flex and rigid multilayer technology
  • Interconnect solutions for miniaturization
  • Biocompatible substrates based on LCP
  • High-frequency designs, also using LCP
  • High-temperature designs
  • Packaging substrates
Industries Medical, Aerospace & Defense, Aviation, Sensors, Industrial,
Semiconductor Packaging
Main export markets   USA, Europe, Asia-Pacific, Australia
Management Dr. Hubert Zimmermann, Urs Bopp, Stephan Messerli, Gloria Müller,
Christian Beck, Dr. Selçuk Mentese
Quality

Memberships

EIPC, EITI, FEDIMAPSIPC, MEPTECSMTA
Swiss Aerospace Cluster, SWISS MEDTECHZVEI 

Financial rating

Risk Indicator 1 award by Bisnode Dun & Bradstreet for financial
stability and high credit standing

200328_bisnode_d_b_rating_certificate