News & Events

1910_UltraThin_Pacer_216

Redefining thinness of PCBs

Tiny medical implants improve patients’ comfort, smart phones are now build into a watch: Made possible by flexible and rigid ultra-thin base materials for highly reliable and thinner PCBs.

DYCO IC2_216

Predict and act

DYCO IC2: An advanced approach to assure ongoing reliability - which is essential to product success. That’s why when it comes to printed circuit board (PCB) manufacturing, predictability is so important.

1903_NFCsensor_591x391

World’s smallest active NFC sensor module

DYCONEX has developed a novel approach to miniaturized, hermetic and highly reliable smart sensor modules with diameters down to 6 millimeters. The modules are ideal for use in medical, food processing, pharmaceutical, chemical or industrial applications.

MST at 16. Leiterplatten-Forum

Logo Bayern Innovativ
Die Leiterplatte als Systemintegrator
January 30, 2020
Haus der Bayerischen Wirtschaft, Munich, Germany

Presentation by Dr. Sebastian Schweiger:
Die Vielseitigkeit der flexiblen Leiterplatte

MST at MD&M West Anaheim 2020

MD&M West

Medical Design & Manufacturing
February 11 - 13, 2020
Convention Center Anaheim, CA, USA
Booth# 610, Hall E


Showcases

LCP_produktebanner_elektroden

LCP for high-frequency and biocompatibility

Liquid crystal polymer (LCP) substrates demonstrate a range of exceptional qualities making it a perfect material for harsh environments, implantable devices and high-frequency applications. DYCONEX offers advanced multilayer LCP products for the most challenging interconnect needs.

Flex

FPC for medical implants

Miniaturization-driven PCBs used in implantable medical devices, hearing aids and other medical applications require ever finer structures on multilayer flex circuits. Increasingly high levels of chip integration, smaller component footprints and reduced device form factors are driving requirements towards ultra HDI properties.

Rigid

High performance rigid PCB

Having a strong aerospace and defense background, DYCONEX has as one of its core specialties ruggedized high-density multilayer PCBs. Our dedicated engineering team concentrates primarily on highly complex rigid interconnect solutions such as the one shown here from a Formula 1 steering wheel dashboard.

packagingsubstrates

Advanced packaging substrates

DYCOstrate technology represents the ideal solutions for prototypes and small to medium batches of advanced packaging interconnect, here incorporated in a SiP (system in package) substrate for a GPS module. Various organic substrate types are available for packages such as BGA (ball grid array), CSP (chip scale package) and MCM (multichip module).

Rigid-Flex

Rigid-flex PCB for 3D miniaturization

In order to reduce the overall packaging form factor for a "smart pill" application, folded high-density (HDI) rigid-flex technology was employed. Thanks to this innovative approach, all mounting and assembly requirements were achieved together with optimal volume utilization.