News & Events

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04.09.2018

DYCONEX introduces automated final inspections

DYCONEX AG now offers customers automated final inspections to further optimize testing of their printed circuit boards.

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01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones

DYCONEX and Micro Systems Engineering at expoAIR 2018

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Trade show for the aerospace supply chain
November 20 - 22, 2018
MTC, Munich, Germany
Hall 2, Booth# C02

Presentation by Birgit Neubauer, DYCONEX:
Miniaturized Sensors for Harsh Environments

MST at MD&M West Anaheim 2019

MD&M West

Medical Design & Manufacturing
February 5 - 7, 2019
Convention Center Anaheim, CA, USA
Booth# 610, Hall E

DYCONEX at SMTconnect 2019

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Electronic assemblies & systems
May 7 - 9, 2019
Messezentrum Nuremberg, Germany
Booth# & Hall tbc


Showcases

Flex

FPC for medical implants

Miniaturization-driven PCBs used in implantable medical devices, hearing aids and other medical applications require ever finer structures on multilayer flex circuits. Increasingly high levels of chip integration, smaller component footprints and reduced device form factors are driving requirements towards ultra HDI properties.

Rigid-Flex

Rigid-flex PCB for 3D miniaturization

In order to reduce the overall packaging form factor for a "smart pill" application, folded high-density (HDI) rigid-flex technology was employed. Thanks to this innovative approach, all mounting and assembly requirements were achieved together with optimal volume utilization.

Rigid

High performance rigid PCB

Having a strong aerospace and defense background, DYCONEX has as one of its core specialties ruggedized high-density multilayer PCBs. Our dedicated engineering team concentrates primarily on highly complex rigid interconnect solutions such as the one shown here from a Formula 1 steering wheel dashboard.

packagingsubstrates

Advanced packaging substrates

DYCOstrate technology represents the ideal solutions for prototypes and small to medium batches of advanced packaging interconnect, here incorporated in a SiP (system in package) substrate for a GPS module. Various organic substrate types are available for packages such as BGA (ball grid array), CSP (chip scale package) and MCM (multichip module).