News & Events

1809_AFI_208
04.09.2018

DYCONEX introduces automated final inspections

DYCONEX AG now offers customers automated final inspections to further optimize testing of their printed circuit boards.

1802_FTS-AGV_208
01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones

DYCONEX and MSEB at 15. Leiterplatten-Forum

Logo Bayern Innovativ

Die Leiterplatte zwischen "all-in-one package" und gedruckter Schaltung
January 29, 2019
Maritim Hotel Nürnberg, Germany 

MST at MD&M West Anaheim 2019

MD&M West

Medical Design & Manufacturing
February 5 - 7, 2019
Convention Center Anaheim, CA, USA
Booth# 610, Hall E

DYCONEX at EIPC Winter Conference

eipc

EIPC Winter Conference
February 14 - 15, 2019
NH Hotel Milano Fiera, Italy

Presentation by Sven Johannsen:
LCP for hermetically sealed sensing applications


Showcases

Flex

FPC for medical implants

Miniaturization-driven PCBs used in implantable medical devices, hearing aids and other medical applications require ever finer structures on multilayer flex circuits. Increasingly high levels of chip integration, smaller component footprints and reduced device form factors are driving requirements towards ultra HDI properties.

Rigid-Flex

Rigid-flex PCB for 3D miniaturization

In order to reduce the overall packaging form factor for a "smart pill" application, folded high-density (HDI) rigid-flex technology was employed. Thanks to this innovative approach, all mounting and assembly requirements were achieved together with optimal volume utilization.

Rigid

High performance rigid PCB

Having a strong aerospace and defense background, DYCONEX has as one of its core specialties ruggedized high-density multilayer PCBs. Our dedicated engineering team concentrates primarily on highly complex rigid interconnect solutions such as the one shown here from a Formula 1 steering wheel dashboard.

packagingsubstrates

Advanced packaging substrates

DYCOstrate technology represents the ideal solutions for prototypes and small to medium batches of advanced packaging interconnect, here incorporated in a SiP (system in package) substrate for a GPS module. Various organic substrate types are available for packages such as BGA (ball grid array), CSP (chip scale package) and MCM (multichip module).