News & Events

DYCONEX at Bodensee Aerospace Meeting

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Die Fachkonferenz für Luft- und Raumfahrt in der DACH Region
March 19, 2019
Graf-Zeppelin-Haus, Friedrichshafen, Germany 

MST at smartsystems integration 2019

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Integration Issues of Miniaturized Systems
April 10 - 11, 2019
Hotel Barceló Sants, Barcelona, Spain
Booth# H-17

Presentation by Dr. Eckardt Bihler:
Miniaturized Electronic Modules for Aggressive Environments

DYCONEX at SMTconnect 2019

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Electronic assemblies & systems
May 7 - 9, 2019
Messezentrum Nuremberg, Germany
Booth# 218E, Hall 5

MST at T4M 2019

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Technology for medical devices
May 7 - 9, 2019
Messe Stuttgart, Germany
Swiss Pavilion booth


Showcases

Flex

FPC for medical implants

Miniaturization-driven PCBs used in implantable medical devices, hearing aids and other medical applications require ever finer structures on multilayer flex circuits. Increasingly high levels of chip integration, smaller component footprints and reduced device form factors are driving requirements towards ultra HDI properties.

Rigid-Flex

Rigid-flex PCB for 3D miniaturization

In order to reduce the overall packaging form factor for a "smart pill" application, folded high-density (HDI) rigid-flex technology was employed. Thanks to this innovative approach, all mounting and assembly requirements were achieved together with optimal volume utilization.

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High performance rigid PCB

Having a strong aerospace and defense background, DYCONEX has as one of its core specialties ruggedized high-density multilayer PCBs. Our dedicated engineering team concentrates primarily on highly complex rigid interconnect solutions such as the one shown here from a Formula 1 steering wheel dashboard.

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Advanced packaging substrates

DYCOstrate technology represents the ideal solutions for prototypes and small to medium batches of advanced packaging interconnect, here incorporated in a SiP (system in package) substrate for a GPS module. Various organic substrate types are available for packages such as BGA (ball grid array), CSP (chip scale package) and MCM (multichip module).