News & Events

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09.06.2020

DYCONEX AG implements various measures to reduce lead time

DYCONEX AG is recording its first results from its scheme to reduce the lead time in manufacturing. Production flow has been improved over the past eight months, while waiting times have been cut and investments have been made in new machinery.

 

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27.03.2020

Covid-19 contingency plans at DYCONEX

DYCONEX is keeping a close eye on the current situation with regard to the impact and spread of covid-19 and seeking to react to current events as appropriately and transparently as possible.

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02.03.2020

Staff changes in quality management at DYCONEX AG

DYCONEX is pleased to announce the appointment of Dr Selçuk Mentese as our new Director of the Quality Management and member of the executive management team.

MST at RF & Microwave 2020

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Radiofrequencies, microwaves, wireless and optical fibre
September 23 - 24, 2020
Paris Expo - Porte de Versailles, Paris, France
Booth# G24

MST at COMPAMED 2020

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High tech solutions for medical technology
November 16 - 19, 2020
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03


Showcases

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LCP for high-frequency and biocompatibility

Liquid crystal polymer (LCP) substrates demonstrate a range of exceptional qualities making it a perfect material for harsh environments, implantable devices and high-frequency applications. DYCONEX offers advanced multilayer LCP products for the most challenging interconnect needs.

Flex

FPC for medical implants

Miniaturization-driven PCBs used in implantable medical devices, hearing aids and other medical applications require ever finer structures on multilayer flex circuits. Increasingly high levels of chip integration, smaller component footprints and reduced device form factors are driving requirements towards ultra HDI properties.

Rigid

High performance rigid PCB

Having a strong aerospace and defense background, DYCONEX has as one of its core specialties ruggedized high-density multilayer PCBs. Our dedicated engineering team concentrates primarily on highly complex rigid interconnect solutions such as the one shown here from a Formula 1 steering wheel dashboard.

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Advanced packaging substrates

DYCOstrate technology represents the ideal solutions for prototypes and small to medium batches of advanced packaging interconnect, here incorporated in a SiP (system in package) substrate for a GPS module. Various organic substrate types are available for packages such as BGA (ball grid array), CSP (chip scale package) and MCM (multichip module).

Rigid-Flex

Rigid-flex PCB for 3D miniaturization

In order to reduce the overall packaging form factor for a "smart pill" application, folded high-density (HDI) rigid-flex technology was employed. Thanks to this innovative approach, all mounting and assembly requirements were achieved together with optimal volume utilization.