30 Years Dyconex

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DYCONEX is celebrating 30 years of leading-edge printed circuit board (PCB) manufacturing

Driven by leading-edge customers over the past 30 years, DYCONEX has continuously been at the forefront of developments in printed circuit board (PCB) manufacturing, and has repeatedly set important technological milestones, beginning with the introduction of high-reliability rigid-flex multilayer boards (DYCOflex®). Today, DYCONEX is the world's leading manufacturer of highly reliable, high quality and flexible PCBs for the medical industry, especially for medical implants. Biocompatible interconnect solutions are also one of the company's strengths. In addition, DYCONEX also produces rigid and rigid-flex substrates for various other industries.

The continuous innovation process is part of the DYCONEX DNA and is both the driver and the guarantee for the ongoing global competitiveness of the company. In addition to all technical developments, we are very proud of our employees who permanently ensure enduring improvements.

Our enormous investment efforts in the latest technologies and the ongoing outstanding commitment of our employees in process and product development allows us to maintain our role as a forerunner in technology which we were over the last three decades and made us what we are right now.

We are thankful to our customers for their trust in us and to our outstanding, highly innovative and passionately committed workforce, that we have become the top-selling Swiss printed circuit board manufacturer since 1991 and the global market leader in the field of highly reliable flexible substrates for the MedTech industry.

OUR HISTORY

DYCONEX from 1991 to Today

DYCONEX is proud of its 30-year history and consistent development of leadinge-edge innovations. Our commitment to be the world’s leading provider of complex, ultra dense and highly reliable interconnect solutions has made us what we are today.

1991
Management Buy-Out
  • The printed circuit board (PCB) division of Contraves was born in 1964.
  • Management buy-out as Dyconex of the Contraves PCB division. Dyconex pioneers PCB manufacturing, reaching key technological milestones, beginning with the introduction of high-reliability, rigid-flex multilayer boards (DYCOflex®). 
  • Contraves started its PCB activities in 1964. Its PCB division is active in R&D and in defence applications. Plasma etching vias (instead of mechanical drilling) is a cornerstone of Dyconex.
  • The Dyconex name combines "dynamic", "connection" and "etching" (ex).
     
1991
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Management Buy-Out
  • The printed circuit board (PCB) division of Contraves was born in 1964.
  • Management buy-out as Dyconex of the Contraves PCB division. Dyconex pioneers PCB manufacturing, reaching key technological milestones, beginning with the introduction of high-reliability, rigid-flex multilayer boards (DYCOflex®). 
  • Contraves started its PCB activities in 1964. Its PCB division is active in R&D and in defence applications. Plasma etching vias (instead of mechanical drilling) is a cornerstone of Dyconex.
  • The Dyconex name combines "dynamic", "connection" and "etching" (ex).
     
DYCONEX in Zuerich Seebach
DYCONEX in Zuerich Seebach
1992
Registration DYCOstrate ® Trademark​
  • DYCOstrate® trademark registered in Switzerland. License agreements with HP, IBM, and Würth Electronic for DYCOstrate® via technology.
  • Dycostrate substrate combines high density interconnects (HDIs) with thermal and mechanical elements suited to harsh environments.
  • A thin, flexible substrate, treated using plasma via technology, is used for the electrical connections. Thermal vias can be added for high thermal conductivity. 
  • A rigid core gives mechanical stability and thermal dissipation and can be made from conductive material.
1992
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Registration DYCOstrate ® Trademark​
  • DYCOstrate® trademark registered in Switzerland. License agreements with HP, IBM, and Würth Electronic for DYCOstrate® via technology.
  • Dycostrate substrate combines high density interconnects (HDIs) with thermal and mechanical elements suited to harsh environments.
  • A thin, flexible substrate, treated using plasma via technology, is used for the electrical connections. Thermal vias can be added for high thermal conductivity. 
  • A rigid core gives mechanical stability and thermal dissipation and can be made from conductive material.
DYCOstrate® Build-up
DYCOstrate® Build-up
1995
Microvia Plasma Technology DYCOstrate® for Mas Production
  • Transition from conventional, rigid/rigidly flexible circuit board technologies (Denstrate®, Constrate®, Dycoflex®) to DYCOstrate® microvia plasma technology for mass production in the medical field.
  • Plasma etching technology is superior to mechanical drilling in cost, speed, and size. It is a parallel process compared to mechanical drilling, which is a sequential process.
  • Sequential flex build-up is used to increase artwork alignment of neighboring layers to drive miniaturization.


 

1995
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Microvia Plasma Technology DYCOstrate® for Mas Production
  • Transition from conventional, rigid/rigidly flexible circuit board technologies (Denstrate®, Constrate®, Dycoflex®) to DYCOstrate® microvia plasma technology for mass production in the medical field.
  • Plasma etching technology is superior to mechanical drilling in cost, speed, and size. It is a parallel process compared to mechanical drilling, which is a sequential process.
  • Sequential flex build-up is used to increase artwork alignment of neighboring layers to drive miniaturization.


 

Hearing-Aid Substrate
Hearing-Aid Substrate
1997
Product Development Increase​
  • Sharp increase in orders from the field of audiology/medical devices with microvia technology. Increased complexity with 2x5-layer DYCOstrate® build-up for military defence applications and satellites. 
  • Development of BGA interposer technology (DYCOre®) for complex fanout designs.
  • Wraparound microvia build-up for high-end application (flex with metal core, high heat dissipation).
     
1997
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Product Development Increase​
  • Sharp increase in orders from the field of audiology/medical devices with microvia technology. Increased complexity with 2x5-layer DYCOstrate® build-up for military defence applications and satellites. 
  • Development of BGA interposer technology (DYCOre®) for complex fanout designs.
  • Wraparound microvia build-up for high-end application (flex with metal core, high heat dissipation).
     
Wrap-Around Substrate
Wrap-Around Substrate
2002
Relocation to Bassersdorf​
  • Company relocation from Seebach, in the canton of Zurich, to a new production site in Bassersdorf.
  • CAPEX of over CHF 10 million for new, cutting-edge equipment.
  • All processes for flexible substrate manufacturing (as DYCOstrate®) are optimized using the increased production floor space of 6000 m2, including 600 m2 of cleanrooms.
  • Significant increase in production capacity and major improvements in process stability to meet increasing quality and reliability requirements.
  • Sales growth and personnel expansion.
2002
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Relocation to Bassersdorf​
  • Company relocation from Seebach, in the canton of Zurich, to a new production site in Bassersdorf.
  • CAPEX of over CHF 10 million for new, cutting-edge equipment.
  • All processes for flexible substrate manufacturing (as DYCOstrate®) are optimized using the increased production floor space of 6000 m2, including 600 m2 of cleanrooms.
  • Significant increase in production capacity and major improvements in process stability to meet increasing quality and reliability requirements.
  • Sales growth and personnel expansion.
DYCONEX Building in Bassersdorf​
DYCONEX Building in Bassersdorf​
2003
Leading-Edge Production with Brandnew Equipment​

New equipment to increase miniaturization and HDI reliability by plasma/laser via combination. New depth routing in flexible multilayers for better bending. Extension of sensor fields applications.

  • New Kuttler box transport system for wet chemical processing equipment to handle PI flex materials.
  • New plating equipment optimized for thin materials and uniform plating.
  • All-new equipment to produce and test 25 µm fine line technology.
  • New solder mask screen printing and drying equipment.
  • New plasma.
  • State of the art inspection equipment.
2003
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Leading-Edge Production with Brandnew Equipment​

New equipment to increase miniaturization and HDI reliability by plasma/laser via combination. New depth routing in flexible multilayers for better bending. Extension of sensor fields applications.

  • New Kuttler box transport system for wet chemical processing equipment to handle PI flex materials.
  • New plating equipment optimized for thin materials and uniform plating.
  • All-new equipment to produce and test 25 µm fine line technology.
  • New solder mask screen printing and drying equipment.
  • New plasma.
  • State of the art inspection equipment.
Leading-edge Production
Leading-edge Production
2004
Development of LCP Lamination Process
  • Development of the liquid crystal polymer (LCP) lamination process to manufacture LCP multilayer and microvia boards (2 and 4 layers) for millimeter wave-phased array antennas.
  • Growing business in the US market for medical implantable applications, defibrillators, and pacemakers. (Guidant)
  • To provide additional reliability and capacity to large customers, the company GS Swiss PCB (Küssnacht) is equipped with Dyconex technology, thus creating a second source manufacturer as an extended work bench (2002 to 2004).
2004
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Development of LCP Lamination Process
  • Development of the liquid crystal polymer (LCP) lamination process to manufacture LCP multilayer and microvia boards (2 and 4 layers) for millimeter wave-phased array antennas.
  • Growing business in the US market for medical implantable applications, defibrillators, and pacemakers. (Guidant)
  • To provide additional reliability and capacity to large customers, the company GS Swiss PCB (Küssnacht) is equipped with Dyconex technology, thus creating a second source manufacturer as an extended work bench (2002 to 2004).
LCP Multilayer Substrate
LCP Multilayer Substrate
2005
Embedding Resistors on Ceramic Substrate in Flex PCBs​
  • As an alternative to in-situ deposited thin film or thick film passive components, DYCONEX developed an integration technology based on embedding discrete ultra flat high precision resistors within flexible multi-layer substrates. 
  • The resulting flexible printed circuit boards were evaluated according to basic electrical, mechanical and thermal testing procedures (IPC/JEDEC) and displayed excellent robustness, e.g. passing the requirements for MSL 1 conditions. Future work was focused on the integration of other, similar discrete, passive components and on multi-component stacking technologies. Also this work proved to be successful. 
     
2005
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Embedding Resistors on Ceramic Substrate in Flex PCBs​
  • As an alternative to in-situ deposited thin film or thick film passive components, DYCONEX developed an integration technology based on embedding discrete ultra flat high precision resistors within flexible multi-layer substrates. 
  • The resulting flexible printed circuit boards were evaluated according to basic electrical, mechanical and thermal testing procedures (IPC/JEDEC) and displayed excellent robustness, e.g. passing the requirements for MSL 1 conditions. Future work was focused on the integration of other, similar discrete, passive components and on multi-component stacking technologies. Also this work proved to be successful. 
     
Substrate with Embedding Resistors
Substrate with Embedding Resistors
2005
Expanding Sales Activities to the US Market
  • To support its fast-growing US customer base even better, Dyconex AG decides to set up a sales and application engineering office in Phoenix AR.
  • Providing local application engineering, especially for flex PCBs to help make more customers aware of the flex technology so they can improve PCB reliability and further miniaturize electronic modules.
     
2005
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Expanding Sales Activities to the US Market
  • To support its fast-growing US customer base even better, Dyconex AG decides to set up a sales and application engineering office in Phoenix AR.
  • Providing local application engineering, especially for flex PCBs to help make more customers aware of the flex technology so they can improve PCB reliability and further miniaturize electronic modules.
     
Actual Sales Activities Wordwide
Actual Sales Activities Wordwide
2006
Microfluidic Substrates Using PCB Technology​
  • Bioanalytical detection/analysis methods often rely on high numbers of identical, possibly disposable microfluidic substrates. In biosensor technology, microelectrodes must be integrated in microstructures for sensing or fluidic actuation. A technology is developed based on printed circuit manufacturing technologies, enabling volume production of polymer microfluidic substrates with integrated microelectrodes for a range of biomedical applications.
  • This technology is used to produce microfluidic networks with channel widths of 50 µm and heights of 20 µm.
2006
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Microfluidic Substrates Using PCB Technology​
  • Bioanalytical detection/analysis methods often rely on high numbers of identical, possibly disposable microfluidic substrates. In biosensor technology, microelectrodes must be integrated in microstructures for sensing or fluidic actuation. A technology is developed based on printed circuit manufacturing technologies, enabling volume production of polymer microfluidic substrates with integrated microelectrodes for a range of biomedical applications.
  • This technology is used to produce microfluidic networks with channel widths of 50 µm and heights of 20 µm.
Microfluidic Substrates​
Microfluidic Substrates​
2007
High Frequency LCP Boars with Cavity for IC Placement
  • LCP-based microwave circuit for  60 - 94 GHz mm-wave scanner.  
  • Active low-noise amplifier (LNA) and detector diodes are integrated via laser-ablated cavities into the LCP substrate.
  • Via structures for heat dissipation to a bottom, side-assembled metal carrier.
  • Precise copper etched patch antennas.
  • Low-cost injection-molded LCP antenna horn with metallization to replace high-cost traditional meta-routed HF components.
     
2007
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High Frequency LCP Boars with Cavity for IC Placement
  • LCP-based microwave circuit for  60 - 94 GHz mm-wave scanner.  
  • Active low-noise amplifier (LNA) and detector diodes are integrated via laser-ablated cavities into the LCP substrate.
  • Via structures for heat dissipation to a bottom, side-assembled metal carrier.
  • Precise copper etched patch antennas.
  • Low-cost injection-molded LCP antenna horn with metallization to replace high-cost traditional meta-routed HF components.
     
LCP PCB for HF with Cavities
LCP PCB for HF with Cavities
2007
New PCB Engineering Software
  • After 1.5 years of development, Dyconex releases new in-house PCB engineering software. The application, "Prisma", defines stack-ups, operation plans, and process parameters of PCBs. It produces quotes and manufacturing documents.
  • Prisma is the new iteration of the old engineering software (TEDA).
  • Prisma is based on the latest software technologies in object-oriented programming and relational databases. The system is now suited for further extension and will become the “brain” of the engineering department.

 

2007
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New PCB Engineering Software
  • After 1.5 years of development, Dyconex releases new in-house PCB engineering software. The application, "Prisma", defines stack-ups, operation plans, and process parameters of PCBs. It produces quotes and manufacturing documents.
  • Prisma is the new iteration of the old engineering software (TEDA).
  • Prisma is based on the latest software technologies in object-oriented programming and relational databases. The system is now suited for further extension and will become the “brain” of the engineering department.

 

Operational Traveller Software
Operational Traveller Software
2008
3D MID Technology​
  • Dyconex AG begins investigating molded interconnect device (MID) targeting applications in the medical and defense markets. The stable 3D form complements flexible PCBs for low- to mid-complexity interconnects with high 3D-alignment precision requirements.
  • Motivated to simplify, integrate, and miniaturize the final product, Dyconex partners with 3D-MID e.V., a driver of MID technology for over 15 years.
  • First uses of low-cost injection-molded LCP antenna horn with metallization to replace high-cost traditional metal brass-routed HF components.
2008
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3D MID Technology​
  • Dyconex AG begins investigating molded interconnect device (MID) targeting applications in the medical and defense markets. The stable 3D form complements flexible PCBs for low- to mid-complexity interconnects with high 3D-alignment precision requirements.
  • Motivated to simplify, integrate, and miniaturize the final product, Dyconex partners with 3D-MID e.V., a driver of MID technology for over 15 years.
  • First uses of low-cost injection-molded LCP antenna horn with metallization to replace high-cost traditional metal brass-routed HF components.
3D MID Technology​ Demonstrator
3D MID Technology​ Demonstrator
2009
Acquisition of DYCONEX AG by Micro Systems Technologies GmbH
  • Dyconex becomes a part of the MST Group, comprised of four international technology companies.
  • The global group provides products and services for medical devices and operates in several high-performance industries.
  • In the medical market especially, PCBs are vital for complex electronic assemblies – a strength of MST. 
  • Dyconex AG’s innovations are an asset for MST. Miniaturized electronic modules are set to become important in the fast-growing medical markets.
     
2009
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Acquisition of DYCONEX AG by Micro Systems Technologies GmbH
  • Dyconex becomes a part of the MST Group, comprised of four international technology companies.
  • The global group provides products and services for medical devices and operates in several high-performance industries.
  • In the medical market especially, PCBs are vital for complex electronic assemblies – a strength of MST. 
  • Dyconex AG’s innovations are an asset for MST. Miniaturized electronic modules are set to become important in the fast-growing medical markets.
     
Micro Systems Technologies Group Logo
Micro Systems Technologies Group Logo
2009
Plasma Desmearing Equipment and Leading-edge Mechanical Drilling
  • Dyconex enhances its laser debris cleaning capabilities with new plasma desmearing equipment. 
  • Lot tracking and process control is improved. New speciality plasma treatments for improved bondability and descumming processes are available for products where resist stripping proves difficult.
  • Advancing mechanical drilling, Dyconex implements new, state-of-the art drilling systems capable of producing mechanical holes of 100 µm ⌀ and even 75 µm ⌀ for specialty applications.
2009
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Plasma Desmearing Equipment and Leading-edge Mechanical Drilling
  • Dyconex enhances its laser debris cleaning capabilities with new plasma desmearing equipment. 
  • Lot tracking and process control is improved. New speciality plasma treatments for improved bondability and descumming processes are available for products where resist stripping proves difficult.
  • Advancing mechanical drilling, Dyconex implements new, state-of-the art drilling systems capable of producing mechanical holes of 100 µm ⌀ and even 75 µm ⌀ for specialty applications.
Plasma Desmearing Equipment
Plasma Desmearing Equipment
2010
Registration Concept
  • To respond to increasing demands for finer features and denser designs in multilayer PCBs, Dyconex engineers a state-of-the-art registration workflow. 
  • This improves layer to layer alignment and enables higher process robustness and better product quality and reliability.
  • Workflow set-up times can be drastically reduced, improving production costs and productivity and leading to fewer panel handling issues on the PCB during production, especially for thin flex products.
     
2010
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Registration Concept
  • To respond to increasing demands for finer features and denser designs in multilayer PCBs, Dyconex engineers a state-of-the-art registration workflow. 
  • This improves layer to layer alignment and enables higher process robustness and better product quality and reliability.
  • Workflow set-up times can be drastically reduced, improving production costs and productivity and leading to fewer panel handling issues on the PCB during production, especially for thin flex products.
     
X-ray Machine
X-ray Machine
2010
Blind Via Filling Process
  • In terms of miniaturization, Dyconex implements a via filling process for mechanical and laser-drilled blind vias. This allows for plate blind vias with an excellent via filling ratio and through holes with stacked blind vias, enabling the shortest signal path.
2010
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Blind Via Filling Process
  • In terms of miniaturization, Dyconex implements a via filling process for mechanical and laser-drilled blind vias. This allows for plate blind vias with an excellent via filling ratio and through holes with stacked blind vias, enabling the shortest signal path.
Filled Blind Via Stack-up
Filled Blind Via Stack-up
2011
CO2/UV Combi Laser
  • Dyconex invests in CO2/UV combi laser to increase throughput for HDI PCBs and improve blind via quality in rigid glass fiber materials.
  • This boosts productivity in blind via formation for rigid substrates, which is faster compared to UV laser drilling. The new system features an automatic loading and unloading station for further automation.
  • Quality improvements due to the selective ablation rates of the two laser systems. The CO2 system’s strength is the consistent and complete via opening in inhomogeneous glass-reinforced dielectrics.
     
2011
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CO2/UV Combi Laser
  • Dyconex invests in CO2/UV combi laser to increase throughput for HDI PCBs and improve blind via quality in rigid glass fiber materials.
  • This boosts productivity in blind via formation for rigid substrates, which is faster compared to UV laser drilling. The new system features an automatic loading and unloading station for further automation.
  • Quality improvements due to the selective ablation rates of the two laser systems. The CO2 system’s strength is the consistent and complete via opening in inhomogeneous glass-reinforced dielectrics.
     
Combi Laser
Combi Laser
2012
Dyconex Achieves ISO 13485 Certification
  • Dyconex awarded ISO 13485:2003 certification, a complement to the ISO 9001 QMS the company has had for many years, proof that Dyconex supplies high-quality and reliability components to the medical market.
  • Certification requires evidence of the ability to consistently fulfill customer and regulatory requirements, including:
    • Process introduction, verification, and change management
    • Documentation and traceability
  • This is a milestone in Dyconex’s continued performance improvement, demonstrating its industry commitment.
2012
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Dyconex Achieves ISO 13485 Certification
  • Dyconex awarded ISO 13485:2003 certification, a complement to the ISO 9001 QMS the company has had for many years, proof that Dyconex supplies high-quality and reliability components to the medical market.
  • Certification requires evidence of the ability to consistently fulfill customer and regulatory requirements, including:
    • Process introduction, verification, and change management
    • Documentation and traceability
  • This is a milestone in Dyconex’s continued performance improvement, demonstrating its industry commitment.
Bureau Veritas Certificate
Bureau Veritas Certificate
2013
Dyconex Invests in Orbotech LDI equipment
  • The Orbotech ParagonTM-9800 Laser Direct Imaging (LDI) system is a step in converting all exposure jobs to direct imaging. It results in a faster and easier process flow. The system guarantees high throughput for LDI optimized solder masks and other solder mask materials. Furthermore it offers side-to-side registration and dynamic imaging modes to match a panel’s distortion for the highest registration accuracy of better than 20 µm.
  • For high-reliability applications such as medtech implants, full traceability is guaranteed with serial number and date stamps and 1D or 2D barcodes for recording process parameters.
2013
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Dyconex Invests in Orbotech LDI equipment
  • The Orbotech ParagonTM-9800 Laser Direct Imaging (LDI) system is a step in converting all exposure jobs to direct imaging. It results in a faster and easier process flow. The system guarantees high throughput for LDI optimized solder masks and other solder mask materials. Furthermore it offers side-to-side registration and dynamic imaging modes to match a panel’s distortion for the highest registration accuracy of better than 20 µm.
  • For high-reliability applications such as medtech implants, full traceability is guaranteed with serial number and date stamps and 1D or 2D barcodes for recording process parameters.
Orbotech LDI equipment
Orbotech LDI equipment
2014
Laser ESI Gemstone® to Expand Capacity and Further Miniaturise Vias
  • The Gemstone generation provides small and reliable vias at an unprecedent speed.
  • The UV laser is equipped with a very specific galvano-optical laser beam adjustment to significantly increase speed.
  • Technically the laser equipment is capable of creating via diameters as small as 25 µm. Current standard via diameter at Dyconex are at 35 to 75 µm. Leading-edge applications have vias as small as 25 µm.
2014
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Laser ESI Gemstone® to Expand Capacity and Further Miniaturise Vias
  • The Gemstone generation provides small and reliable vias at an unprecedent speed.
  • The UV laser is equipped with a very specific galvano-optical laser beam adjustment to significantly increase speed.
  • Technically the laser equipment is capable of creating via diameters as small as 25 µm. Current standard via diameter at Dyconex are at 35 to 75 µm. Leading-edge applications have vias as small as 25 µm.
Laser ESI Gemstone
Laser ESI Gemstone
2014
Improvements with Multibond Adhesion Promotor
  • The Multibond is applied to high-reliability multilayer PCBs to improve the bonding between the single layers of a board. The underlying principle is a micro-roughening process in combination with an organic copper conversion coating for PCB inner layers. 
  • The new treatment leads to an improved adhesion between them an the prepregs, thus enhances the peel strenghts of the whole circuit board.
2014
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Improvements with Multibond Adhesion Promotor
  • The Multibond is applied to high-reliability multilayer PCBs to improve the bonding between the single layers of a board. The underlying principle is a micro-roughening process in combination with an organic copper conversion coating for PCB inner layers. 
  • The new treatment leads to an improved adhesion between them an the prepregs, thus enhances the peel strenghts of the whole circuit board.
Multibond Adhesion Promotor
Multibond Adhesion Promotor
2015
Reliability Center of Competence
  • Dyconex AG opens new reliability testing lab to serve as a Center of Competence. 
  • The lab unifies product reliability monitoring processes. It has stations for electrical fault location, thermography and multiple IST (interconnect stress test) units, bending testers , and a scanning electron microscope and optical microscopes for analysis. 
  • For critical applications, e.g. medical implants, the lab develops models that enable precise conclusions about product reliability using accelerated test procedures. 
     
2015
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Reliability Center of Competence
  • Dyconex AG opens new reliability testing lab to serve as a Center of Competence. 
  • The lab unifies product reliability monitoring processes. It has stations for electrical fault location, thermography and multiple IST (interconnect stress test) units, bending testers , and a scanning electron microscope and optical microscopes for analysis. 
  • For critical applications, e.g. medical implants, the lab develops models that enable precise conclusions about product reliability using accelerated test procedures. 
     
Reliability Competence Center
Reliability Competence Center
2016
Fourth IST Testing Machine Goes into Service
  • Further expanding its Reliability Center of Competence and the corresponding IST testing, Dyconex AG puts its fourth IST (interconnect stress test) testing machine into service.
  • Critical applications in medical technology and aeronautics and space flight cannot tolerate any compromises whatsoever when it comes to reliability. To meet these needs, Dyconex develops extensive and systematic methodologies that make it possible to gather solid evidence about product reliability. 
  • IST tests, enhanced by additional testing schemes and analytic methods, form the basis for guaranteed, measurable reliability of PCB substrates.
2016
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Fourth IST Testing Machine Goes into Service
  • Further expanding its Reliability Center of Competence and the corresponding IST testing, Dyconex AG puts its fourth IST (interconnect stress test) testing machine into service.
  • Critical applications in medical technology and aeronautics and space flight cannot tolerate any compromises whatsoever when it comes to reliability. To meet these needs, Dyconex develops extensive and systematic methodologies that make it possible to gather solid evidence about product reliability. 
  • IST tests, enhanced by additional testing schemes and analytic methods, form the basis for guaranteed, measurable reliability of PCB substrates.
Fourth IST Testing Machines
Fourth IST Testing Machines
2016
Depth Routing Equipment Investment Realized

Dyconex AG makes a major investment in the MXY2 drilling and routing machine from Schmoll Maschinen GmbH. The machine offers the following benefits:

  • Smaller structures and compliance with specific requirements for even higher accuracy.
  • Contact depth drilling and optical registration to achieve highly precise machining results with even higher process reliability. 
  • Registration with the aid of a CCD camera allows for corrections such as offset, rotation, shrinking, and stretching.
     
2016
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Depth Routing Equipment Investment Realized

Dyconex AG makes a major investment in the MXY2 drilling and routing machine from Schmoll Maschinen GmbH. The machine offers the following benefits:

  • Smaller structures and compliance with specific requirements for even higher accuracy.
  • Contact depth drilling and optical registration to achieve highly precise machining results with even higher process reliability. 
  • Registration with the aid of a CCD camera allows for corrections such as offset, rotation, shrinking, and stretching.
     
Depth Routing Process
Depth Routing Process
2017
Automated Guided Vehicles (AGVs) to Automate Internal Logistics
  • The AGV system’s primary task is to transport materials between departments.
  • The AGV system is comprised of various components working closely together to enable completely autonomous transport from shelf to shelf. The transport robots have been adapted to Dyconex’s requirements and navigate by themselves, aided by a laser scanner. They react to changes in the working environment, avoiding people and obstacles on their own. 
     
2017
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Automated Guided Vehicles (AGVs) to Automate Internal Logistics
  • The AGV system’s primary task is to transport materials between departments.
  • The AGV system is comprised of various components working closely together to enable completely autonomous transport from shelf to shelf. The transport robots have been adapted to Dyconex’s requirements and navigate by themselves, aided by a laser scanner. They react to changes in the working environment, avoiding people and obstacles on their own. 
     
Automated Guided Vehicles
Automated Guided Vehicles
2017
Laser Handling System
  • Increases productivity in production through the targeted use of robot handling systems for loading and unloading laser machines.
  • Three specialized robots relieve laser machine operators of repetitive tasks.
  • The handling systems enable continuous production by operating both during shift  hours and overnight without personnel present.
     
2017
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Laser Handling System
  • Increases productivity in production through the targeted use of robot handling systems for loading and unloading laser machines.
  • Three specialized robots relieve laser machine operators of repetitive tasks.
  • The handling systems enable continuous production by operating both during shift hours and overnight without personnel present.
     
Laser Handling Robots
Laser Handling Robots
2017
EN 9100:2009 certification
  • Dyconex awarded EN 9100:2009 aviation and aerospace certification and is added to the OASIS (Online Aerospace Supplier Information System) database.
  • With ISO 9001 (1993) and ISO 13485 certification (2012), Dyconex has an extensive QMS guaranteeing superb product reliability and 100% traceability. EN 9100 confirms that Dyconex meets the demanding requirements of the aviation and aerospace industry.
2017
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EN 9100:2009 certification
  • Dyconex awarded EN 9100:2009 aviation and aerospace certification and is added to the OASIS (Online Aerospace Supplier Information System) database.
  • With ISO 9001 (1993) and ISO 13485 certification (2012), Dyconex has an extensive QMS guaranteeing superb product reliability and 100% traceability. EN 9100 confirms that Dyconex meets the demanding requirements of the aviation and aerospace industry.
Bureau Veritas
Bureau Veritas
2018
Additive manufacturing by Sputtering Equipment

Dyconex decides to enter into additive and biocompatible interconnect manufacturing by purchasing leading-edge sputter equipment:

  • The leading-edge sputtering equipment is to maintain Dyconex’s place on the technological leader board in advanced printed circuits. 
  • The machine enables the coating of a wide range of thin-film materials  which can be structured by the usual lift-off and etching techniques. 
     
2018
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Additive manufacturing by Sputtering Equipment

Dyconex decides to enter into additive and biocompatible interconnect manufacturing by purchasing leading-edge sputter equipment:

  • The leading-edge sputtering equipment is to maintain Dyconex’s place on the technological leader board in advanced printed circuits. 
  • The machine enables the coating of a wide range of thin-film materials  which can be structured by the usual lift-off and etching techniques. 
     
Sputtering Equipment
Sputtering Equipment
2018
Automated Final Inspection
  • Thorough and readily reproducible testing of PCBs is the goal of the automated final inspection newly introduced by Dyconex. 
  • Automated final inspection is ideal for high production volumes, complex and highly repetitive PCB structures and products with the highest reliability requirements, such as life-supporting medical technology.
  • Thanks to the semi-transparent materials that Dyconex uses, automated inspection provides also an image of a PCB’s inner layers. 
2018
Image
Automated Final Inspection
  • Thorough and readily reproducible testing of PCBs is the goal of the automated final inspection newly introduced by Dyconex. 
  • Automated final inspection is ideal for high production volumes, complex and highly repetitive PCB structures and products with the highest reliability requirements, such as life-supporting medical technology.
  • Thanks to the semi-transparent materials that Dyconex uses, automated inspection provides also an image of a PCB’s inner layers. 
Automated Final Inspection
Automated Final Inspection
2019
Hot-E-Test to provide total reliability

Introduction of Hot-E-Test (full electrical test at elevated temperature) to further boost the reliability of our substrates for implantable applications:

  • Patented heating frame to heat substrates above 110°C to identify via-related issues on substrates.
  • No test coupons – Hot-E-Test performed on usable substrates.
  • Standard E-Test and Hot-E-Test can be performed in parallel, providing top reliablity at lower costs.
     
2019
Image
Hot-E-Test to provide total reliability

Introduction of Hot-E-Test (full electrical test at elevated temperature) to further boost the reliability of our substrates for implantable applications:

  • Patented heating frame to heat substrates above 110°C to identify via-related issues on substrates.
  • No test coupons – Hot-E-Test performed on usable substrates.
  • Standard E-Test and Hot-E-Test can be performed in parallel, providing top reliablity at lower costs.
     
Hot-E-Test t
Hot-E-Test t
2020
Etching Line to Boost Miniaturisation

Dyconex AG decides to update all wet chemical equipment to the latest leading-edge technology.

  • As a first step, the etching line is replaced.
  • The following steps are to be the replacement of parts of the infrastructure as well as the developers/strippers.
  • The new “vacuum”-etching process provides unprecedentedly fine subtractive structures, pushing the lines/spaces down to 15 µm with conventional subtractive technology.
  • The new equipment also provides a capacity increase of almost double.
2020
Image
Etching Line to Boost Miniaturisation

Dyconex AG decides to update all wet chemical equipment to the latest leading-edge technology.

  • As a first step, the etching line is replaced.
  • The following steps are to be the replacement of parts of the infrastructure as well as the developers/strippers.
  • The new “vacuum”-etching process provides unprecedentedly fine subtractive structures, pushing the lines/spaces down to 15 µm with conventional subtractive technology.
  • The new equipment also provides a capacity increase of almost double.
Etching Line
Etching Line
1991
Image
Management Buy-Out
  • The printed circuit board (PCB) division of Contraves was born in 1964.
  • Management buy-out as Dyconex of the Contraves PCB division. Dyconex pioneers PCB manufacturing, reaching key technological milestones, beginning with the introduction of high-reliability, rigid-flex multilayer boards (DYCOflex®). 
  • Contraves started its PCB activities in 1964. Its PCB division is active in R&D and in defence applications. Plasma etching vias (instead of mechanical drilling) is a cornerstone of Dyconex.
  • The Dyconex name combines "dynamic", "connection" and "etching" (ex).
     
DYCONEX in Zuerich Seebach
1991
1992
Image
Registration DYCOstrate ® Trademark​
  • DYCOstrate® trademark registered in Switzerland. License agreements with HP, IBM, and Würth Electronic for DYCOstrate® via technology.
  • Dycostrate substrate combines high density interconnects (HDIs) with thermal and mechanical elements suited to harsh environments.
  • A thin, flexible substrate, treated using plasma via technology, is used for the electrical connections. Thermal vias can be added for high thermal conductivity. 
  • A rigid core gives mechanical stability and thermal dissipation and can be made from conductive material.
DYCOstrate® Build-up
1992
1995
Image
Microvia Plasma Technology DYCOstrate® for Mas Production
  • Transition from conventional, rigid/rigidly flexible circuit board technologies (Denstrate®, Constrate®, Dycoflex®) to DYCOstrate® microvia plasma technology for mass production in the medical field.
  • Plasma etching technology is superior to mechanical drilling in cost, speed, and size. It is a parallel process compared to mechanical drilling, which is a sequential process.
  • Sequential flex build-up is used to increase artwork alignment of neighboring layers to drive miniaturization.


 

Hearing-Aid Substrate
1995
1997
Image
Product Development Increase​
  • Sharp increase in orders from the field of audiology/medical devices with microvia technology. Increased complexity with 2x5-layer DYCOstrate® build-up for military defence applications and satellites. 
  • Development of BGA interposer technology (DYCOre®) for complex fanout designs.
  • Wraparound microvia build-up for high-end application (flex with metal core, high heat dissipation).
     
Wrap-Around Substrate
1997
2002
Image
Relocation to Bassersdorf​
  • Company relocation from Seebach, in the canton of Zurich, to a new production site in Bassersdorf.
  • CAPEX of over CHF 10 million for new, cutting-edge equipment.
  • All processes for flexible substrate manufacturing (as DYCOstrate®) are optimized using the increased production floor space of 6000 m2, including 600 m2 of cleanrooms.
  • Significant increase in production capacity and major improvements in process stability to meet increasing quality and reliability requirements.
  • Sales growth and personnel expansion.
DYCONEX Building in Bassersdorf​
2002
2003
Image
Leading-Edge Production with Brandnew Equipment​

New equipment to increase miniaturization and HDI reliability by plasma/laser via combination. New depth routing in flexible multilayers for better bending. Extension of sensor fields applications.

  • New Kuttler box transport system for wet chemical processing equipment to handle PI flex materials.
  • New plating equipment optimized for thin materials and uniform plating.
  • All-new equipment to produce and test 25 µm fine line technology.
  • New solder mask screen printing and drying equipment.
  • New plasma.
  • State of the art inspection equipment.
Leading-edge Production
2003
2004
Image
Development of LCP Lamination Process
  • Development of the liquid crystal polymer (LCP) lamination process to manufacture LCP multilayer and microvia boards (2 and 4 layers) for millimeter wave-phased array antennas.
  • Growing business in the US market for medical implantable applications, defibrillators, and pacemakers. (Guidant)
  • To provide additional reliability and capacity to large customers, the company GS Swiss PCB (Küssnacht) is equipped with Dyconex technology, thus creating a second source manufacturer as an extended work bench (2002 to 2004).
LCP Multilayer Substrate
2004
2005
Image
Embedding Resistors on Ceramic Substrate in Flex PCBs​
  • As an alternative to in-situ deposited thin film or thick film passive components, DYCONEX developed an integration technology based on embedding discrete ultra flat high precision resistors within flexible multi-layer substrates. 
  • The resulting flexible printed circuit boards were evaluated according to basic electrical, mechanical and thermal testing procedures (IPC/JEDEC) and displayed excellent robustness, e.g. passing the requirements for MSL 1 conditions. Future work was focused on the integration of other, similar discrete, passive components and on multi-component stacking technologies. Also this work proved to be successful. 
     
Substrate with Embedding Resistors
2005
2005
Image
Expanding Sales Activities to the US Market
  • To support its fast-growing US customer base even better, Dyconex AG decides to set up a sales and application engineering office in Phoenix AR.
  • Providing local application engineering, especially for flex PCBs to help make more customers aware of the flex technology so they can improve PCB reliability and further miniaturize electronic modules.
     
Actual Sales Activities Wordwide
2005
2006
Image
Microfluidic Substrates Using PCB Technology​
  • Bioanalytical detection/analysis methods often rely on high numbers of identical, possibly disposable microfluidic substrates. In biosensor technology, microelectrodes must be integrated in microstructures for sensing or fluidic actuation. A technology is developed based on printed circuit manufacturing technologies, enabling volume production of polymer microfluidic substrates with integrated microelectrodes for a range of biomedical applications.
  • This technology is used to produce microfluidic networks with channel widths of 50 µm and heights of 20 µm.
Microfluidic Substrates​
2006
2007
Image
High Frequency LCP Boars with Cavity for IC Placement
  • LCP-based microwave circuit for  60 - 94 GHz mm-wave scanner.  
  • Active low-noise amplifier (LNA) and detector diodes are integrated via laser-ablated cavities into the LCP substrate.
  • Via structures for heat dissipation to a bottom, side-assembled metal carrier.
  • Precise copper etched patch antennas.
  • Low-cost injection-molded LCP antenna horn with metallization to replace high-cost traditional meta-routed HF components.
     
LCP PCB for HF with Cavities
2007
2007
Image
New PCB Engineering Software
  • After 1.5 years of development, Dyconex releases new in-house PCB engineering software. The application, "Prisma", defines stack-ups, operation plans, and process parameters of PCBs. It produces quotes and manufacturing documents.
  • Prisma is the new iteration of the old engineering software (TEDA).
  • Prisma is based on the latest software technologies in object-oriented programming and relational databases. The system is now suited for further extension and will become the “brain” of the engineering department.

 

Operational Traveller Software
2007
2008
Image
3D MID Technology​
  • Dyconex AG begins investigating molded interconnect device (MID) targeting applications in the medical and defense markets. The stable 3D form complements flexible PCBs for low- to mid-complexity interconnects with high 3D-alignment precision requirements.
  • Motivated to simplify, integrate, and miniaturize the final product, Dyconex partners with 3D-MID e.V., a driver of MID technology for over 15 years.
  • First uses of low-cost injection-molded LCP antenna horn with metallization to replace high-cost traditional metal brass-routed HF components.
3D MID Technology​ Demonstrator
2008
2009
Image
Acquisition of DYCONEX AG by Micro Systems Technologies GmbH
  • Dyconex becomes a part of the MST Group, comprised of four international technology companies.
  • The global group provides products and services for medical devices and operates in several high-performance industries.
  • In the medical market especially, PCBs are vital for complex electronic assemblies – a strength of MST. 
  • Dyconex AG’s innovations are an asset for MST. Miniaturized electronic modules are set to become important in the fast-growing medical markets.
     
Micro Systems Technologies Group Logo
2009
2009
Image
Plasma Desmearing Equipment and Leading-edge Mechanical Drilling
  • Dyconex enhances its laser debris cleaning capabilities with new plasma desmearing equipment. 
  • Lot tracking and process control is improved. New speciality plasma treatments for improved bondability and descumming processes are available for products where resist stripping proves difficult.
  • Advancing mechanical drilling, Dyconex implements new, state-of-the art drilling systems capable of producing mechanical holes of 100 µm ⌀ and even 75 µm ⌀ for specialty applications.
Plasma Desmearing Equipment
2009
2010
Image
Registration Concept
  • To respond to increasing demands for finer features and denser designs in multilayer PCBs, Dyconex engineers a state-of-the-art registration workflow. 
  • This improves layer to layer alignment and enables higher process robustness and better product quality and reliability.
  • Workflow set-up times can be drastically reduced, improving production costs and productivity and leading to fewer panel handling issues on the PCB during production, especially for thin flex products.
     
X-ray Machine
2010
2010
Image
Blind Via Filling Process
  • In terms of miniaturization, Dyconex implements a via filling process for mechanical and laser-drilled blind vias. This allows for plate blind vias with an excellent via filling ratio and through holes with stacked blind vias, enabling the shortest signal path.
Filled Blind Via Stack-up
2010
2011
Image
CO2/UV Combi Laser
  • Dyconex invests in CO2/UV combi laser to increase throughput for HDI PCBs and improve blind via quality in rigid glass fiber materials.
  • This boosts productivity in blind via formation for rigid substrates, which is faster compared to UV laser drilling. The new system features an automatic loading and unloading station for further automation.
  • Quality improvements due to the selective ablation rates of the two laser systems. The CO2 system’s strength is the consistent and complete via opening in inhomogeneous glass-reinforced dielectrics.
     
Combi Laser
2011
2012
Image
Dyconex Achieves ISO 13485 Certification
  • Dyconex awarded ISO 13485:2003 certification, a complement to the ISO 9001 QMS the company has had for many years, proof that Dyconex supplies high-quality and reliability components to the medical market.
  • Certification requires evidence of the ability to consistently fulfill customer and regulatory requirements, including:
    • Process introduction, verification, and change management
    • Documentation and traceability
  • This is a milestone in Dyconex’s continued performance improvement, demonstrating its industry commitment.
Bureau Veritas Certificate
2012
2013
Image
Dyconex Invests in Orbotech LDI equipment
  • The Orbotech ParagonTM-9800 Laser Direct Imaging (LDI) system is a step in converting all exposure jobs to direct imaging. It results in a faster and easier process flow. The system guarantees high throughput for LDI optimized solder masks and other solder mask materials. Furthermore it offers side-to-side registration and dynamic imaging modes to match a panel’s distortion for the highest registration accuracy of better than 20 µm.
  • For high-reliability applications such as medtech implants, full traceability is guaranteed with serial number and date stamps and 1D or 2D barcodes for recording process parameters.
Orbotech LDI equipment
2013
2014
Image
Laser ESI Gemstone® to Expand Capacity and Further Miniaturise Vias
  • The Gemstone generation provides small and reliable vias at an unprecedent speed.
  • The UV laser is equipped with a very specific galvano-optical laser beam adjustment to significantly increase speed.
  • Technically the laser equipment is capable of creating via diameters as small as 25 µm. Current standard via diameter at Dyconex are at 35 to 75 µm. Leading-edge applications have vias as small as 25 µm.
Laser ESI Gemstone
2014
2014
Image
Improvements with Multibond Adhesion Promotor
  • The Multibond is applied to high-reliability multilayer PCBs to improve the bonding between the single layers of a board. The underlying principle is a micro-roughening process in combination with an organic copper conversion coating for PCB inner layers. 
  • The new treatment leads to an improved adhesion between them an the prepregs, thus enhances the peel strenghts of the whole circuit board.
Multibond Adhesion Promotor
2014
2015
Image
Reliability Center of Competence
  • Dyconex AG opens new reliability testing lab to serve as a Center of Competence. 
  • The lab unifies product reliability monitoring processes. It has stations for electrical fault location, thermography and multiple IST (interconnect stress test) units, bending testers , and a scanning electron microscope and optical microscopes for analysis. 
  • For critical applications, e.g. medical implants, the lab develops models that enable precise conclusions about product reliability using accelerated test procedures. 
     
Reliability Competence Center
2015
2016
Image
Fourth IST Testing Machine Goes into Service
  • Further expanding its Reliability Center of Competence and the corresponding IST testing, Dyconex AG puts its fourth IST (interconnect stress test) testing machine into service.
  • Critical applications in medical technology and aeronautics and space flight cannot tolerate any compromises whatsoever when it comes to reliability. To meet these needs, Dyconex develops extensive and systematic methodologies that make it possible to gather solid evidence about product reliability. 
  • IST tests, enhanced by additional testing schemes and analytic methods, form the basis for guaranteed, measurable reliability of PCB substrates.
Fourth IST Testing Machines
2016
2016
Image
Depth Routing Equipment Investment Realized

Dyconex AG makes a major investment in the MXY2 drilling and routing machine from Schmoll Maschinen GmbH. The machine offers the following benefits:

  • Smaller structures and compliance with specific requirements for even higher accuracy.
  • Contact depth drilling and optical registration to achieve highly precise machining results with even higher process reliability. 
  • Registration with the aid of a CCD camera allows for corrections such as offset, rotation, shrinking, and stretching.
     
Depth Routing Process
2016
2017
Image
Automated Guided Vehicles (AGVs) to Automate Internal Logistics
  • The AGV system’s primary task is to transport materials between departments.
  • The AGV system is comprised of various components working closely together to enable completely autonomous transport from shelf to shelf. The transport robots have been adapted to Dyconex’s requirements and navigate by themselves, aided by a laser scanner. They react to changes in the working environment, avoiding people and obstacles on their own. 
     
Automated Guided Vehicles
2017
2017
Image
Laser Handling System
  • Increases productivity in production through the targeted use of robot handling systems for loading and unloading laser machines.
  • Three specialized robots relieve laser machine operators of repetitive tasks.
  • The handling systems enable continuous production by operating both during shift hours and overnight without personnel present.
     
Laser Handling Robots
2017
2017
Image
EN 9100:2009 certification
  • Dyconex awarded EN 9100:2009 aviation and aerospace certification and is added to the OASIS (Online Aerospace Supplier Information System) database.
  • With ISO 9001 (1993) and ISO 13485 certification (2012), Dyconex has an extensive QMS guaranteeing superb product reliability and 100% traceability. EN 9100 confirms that Dyconex meets the demanding requirements of the aviation and aerospace industry.
Bureau Veritas
2017
2018
Image
Additive manufacturing by Sputtering Equipment

Dyconex decides to enter into additive and biocompatible interconnect manufacturing by purchasing leading-edge sputter equipment:

  • The leading-edge sputtering equipment is to maintain Dyconex’s place on the technological leader board in advanced printed circuits. 
  • The machine enables the coating of a wide range of thin-film materials  which can be structured by the usual lift-off and etching techniques. 
     
Sputtering Equipment
2018
2018
Image
Automated Final Inspection
  • Thorough and readily reproducible testing of PCBs is the goal of the automated final inspection newly introduced by Dyconex. 
  • Automated final inspection is ideal for high production volumes, complex and highly repetitive PCB structures and products with the highest reliability requirements, such as life-supporting medical technology.
  • Thanks to the semi-transparent materials that Dyconex uses, automated inspection provides also an image of a PCB’s inner layers. 
Automated Final Inspection
2018
2019
Image
Hot-E-Test to provide total reliability

Introduction of Hot-E-Test (full electrical test at elevated temperature) to further boost the reliability of our substrates for implantable applications:

  • Patented heating frame to heat substrates above 110°C to identify via-related issues on substrates.
  • No test coupons – Hot-E-Test performed on usable substrates.
  • Standard E-Test and Hot-E-Test can be performed in parallel, providing top reliablity at lower costs.
     
Hot-E-Test t
2019
2020
Image
Etching Line to Boost Miniaturisation

Dyconex AG decides to update all wet chemical equipment to the latest leading-edge technology.

  • As a first step, the etching line is replaced.
  • The following steps are to be the replacement of parts of the infrastructure as well as the developers/strippers.
  • The new “vacuum”-etching process provides unprecedentedly fine subtractive structures, pushing the lines/spaces down to 15 µm with conventional subtractive technology.
  • The new equipment also provides a capacity increase of almost double.
Etching Line
2020

Videos

General FAQs

Engineering FAQ's

Videos

DYCONEX 30th Anniversary

Have a look on our 30 year video. 

About Micro Systems Technologies

Christian Roessle, President Sales & Marketing, explains what Micro Systems Technologies stands for and congratulates DYCONEX on its 30th anniversary.

Ultra-thin Flexible Substrates in Endoscopes

Stephan Trautweiler illustrates with the example of endoscopy how our flexible substrates solve major challenges in assembly and interconnection technology for our customers' applications.

Biocompatible Substrates

Dr. Marc Hauer explains the use of Bicompatible Substrates.

Lab-on-PCB Plattform

Dr. Eckardt Bihler presents our new cost-effective biocompatible substrate technology for Lab-on-PCB applications.

General FAQs

What does DYCONEX do?

DYCONEX delivers cutting-edge interconnect solutions in flex, rigid-flex and rigid technology.  As a producer of sophisticated PCB solutions, we are committed to consistent quality and innovation. In order to meet  ever-increasing product requirements, DYCONEX relies on state-of-the art equipment and class 10,000 clean room technology.  
 

What are your core capabilities?

Our core capabilities lie in the production of highly complex HDI, high-frequency and high-reliability circuit boards for medical, high-frequency and semiconductor applications. 

Which markets do you target for sales?

Dyconex is a leading supplier of flexible printed circuits for medical, defence and industrial markets. 

How long have you been in the PCB business?

The company has been in the PCB business for more than 50 years.

Where are you located?

The company is located in Bassersdorf, Switzerland, near Zurich airport. 

Will DYCONEX sign a non-disclosure and/or non-compete agreements?

Dyconex takes customer confidentiality very seriously.  All proprietary information is protected by mutually signed non-disclosure agreements.

What are your payment terms and how do you ship the boards?

Our standard payment terms are 30 days net from the date of invoice. The products are shipped from our manufacturing site in Bassersdorf according to FCA Incoterms. 

What information is required for a quote?

In order to calculate the price and lead time for a quote, customers should submit a Gerber file with the design layout and provide additional technical requirements, such as materials and surface finish. 

How long is my quote valid?

Dyconex provides quotes that are valid for 30 days. Beyond this period, we re-assess the price and lead time and provide updated quotes.

Do you check my artwork?

Checking our customer's artwork is one of the most important tasks in the quotation phase. We verify that all relevant design data complies with our design rules and ensure the customer's design can be manufactured successfully. 

Which format files can you read?

Design files should be preferably provided in Gerber format. Simple designs can also be submitted in CAD file formats such as DXF or DWG. 

What do you do with my set-up and E-test cost?

All standard set-up and E-test costs are included in our quotations. It is possible to request customer specific E-tests, which are quoted separately.

How do you send the quote to me after submitting my online quote request?

Upon receipt of the design files, our commercial and technical teams will assess the feasibility, price and lead time. This information is collected and returned to our customers as a quotation in PDF format. 

Do you have minimum order requirements (MOQ)?

The required minimum order quantity depends on the size and shape of the printed circuit. It is communicated individually in each quote. 

How quickly do you respond to a PCB quote request?

Dyconex supports its customers in obtaining their printed circuit boards in the shortest possible time.

What lead times can you offer?

Lead times are calculated and communicated individually on each quote. Optionally, customers can order a hand-carry lot, where the order is moved through the production line with highest priority. 

What can I do if I receive unsatisfactory PCBs?

Damage caused during shipping should be communicated immediately to Dyconex in writing. Defects on the printed circuit boards should be communicated to Dyconex within the first eight days from receipt of the goods. 

Engineering FAQ's

Why should circuit boards be electrically tested?

Optical inspection alone is not sufficient to ensure full functionality of a PCB. Since the z-axes interconnect (vias), they cannot be 100% visually inspected with AOI or AFI. We visually inspect every layer fully and electrically test all our PCBs 100% to ensure that they are fully functional and reliable. 

What should be shown in the drill file: drill diameter or finished hole diameter?

The drill file contains the locations and hole diameters should always indicate the finished hole diameter. 

What classification do you produce?

  • We produce PCBs according to the standards from the Institute for Printed Circuits (IPC). Most of our PCBs are produced according to IPC Class 3, which has the strictest requirements. 
  • The standard class can be manufactured according to the standard lead time table. The advanced class may require some additional quality control steps or special process attention, which could cause deviation from the standard lead time. Products within a leading-edge classification will require an engineering review before beeing produced and the standard lead time may deviate considerably.    

What solder masks do you use for PCBs?

Our PCBs are manufactured with photoimagable solder masks, ensuring the highest feature resolution and pattern fidelity.

Are there any other colour options for the solder mask?

Solder masks are available in green (standard), and white or black (optional). 

What are the benefits of LCP vs polyimide?

Liquid Crystal Polymer (LCP) is a thermoplastic substrate material for Flexible Printed Circuits (FPC). Compared to conventional polyimide substrates, LCP exhibits extremely low water absorption, excellent high-frequency properties and requires no adhesives to build multi-layer stacks. This is especially beneficial for applications where high frequencies or biocompatibility is required. Although polyimide itself can be biocompatible, the adhesives between a multilayer flex are generally not considered biocompatible.    

What are lines and spaces and why is this such an important size?

Lines and spaces designate the smallest possible width of traces and the gaps between them. It is an indicator for the degree of miniaturisation. We produce leading-edge PCBs with lines and spaces down to 15 µm, which is about 20 times smaller than the diameter of a human hair.     

How to reduce the cost of circuit boards?

The two major factors that influence the cost are the number of prints that fit on a production panel, and the yield, i.e. how many good prints are on the panel. Our engineers will guide you in selecting the optimum print size and stack build-up to minimise your cost.         

Can you manufacture my PCBs from a CAD file?

  • The DYCONEX tooling department uses the CAD/CAE program UCAM from Barco ETS: https://www.ucamco.com/en. The following file formats can be processed. The ranking refers to the data import speed and data quality. We prefer the Gerber, Barco UCAM and ODB++ PCB formats. Standard CAD formats are .hpgl and .dxf and the required data encoding is ASCII. 
  • However, this usually requires additional technical communication with our engineering team. We also offer design services for customers without in-house design capabilities. 

What is the maximum size PCB you can produce?

The maximum size for a PCB is 418 mm x 266 mm.

What is the minimum board thickness you can process?

We can produce ultra-thin PCBs from flexible polyimide sheets with a thickness of only 12.5µm. On a rigid PCB our minimum glass reinforced thickness is 30 µm.

What is the maximum thickness?

Multi-layer PCBs can be produced with a total thickness of up to 3 mm. 

What copper thickness do you use and are any other thicknesses available?

Our standard copper thickness is in the range of 10-20 µm. Optional thickness is available from a very thin copper thickness of 3 µm for very fine digital traces up to 80 µm for high current applications. 

What are NRE costs and what does this include?

Non-Recurring Engineering (NRE) costs include the following items: 
‐    Design data preparation from single prints to production panel layout 
‐    Design rule checks 
‐    Design modifications for cost optimisation 
‐    Design modifications for improved reliability 
‐    PCB stack build-up consulting 
‐    PCB material consulting 
‐    A team of dedicated and highly qualified engineers is at your disposal 

Can you provide material properties?

Yes, we have a wide range of materials available with varying dielectric properties and would be happy to advise you on your project. 

Can you handle controlled impedance requirements?

Yes, we use Polar Software simulation tools and Time-Domain Reflectance (TDR) measuring equipment to manufacture PCBs with critical impedance requirements. 

What certifications do you have?

Our PCB production site is ISO 9001 certified. We are also certified for medical devices (ISO 13485) and for the aerospace industry (EN 9100).  In addition to these production certifications, we observe other approvals and standards such as:  
‐    ITAR/EAR registration by MST USA 
‐    RoHS and REACH compliance 
‐    IPC standard manufacturing and testing 
‐    Certified 60 Black Belts and IPC qualified employees (CIT | CIS) 

Can you build RF PCBs?

Yes, we have many customers in the telecom, aerospace, and defence industries who require Radio Frequency (RF) range PCBs.