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MST solutions

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Comprehensive solutions for high-tech industries requiring exceptional performance and the highest level of reliability
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Your technology partner

Strong core competencies in interconnect technology, advanced assembly, semiconductor packaging and implantable batteries
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News & Events

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04.09.2018

DYCONEX introduces automated final inspections

DYCONEX AG now offers customers automated final inspections to further optimize testing of their printed circuit boards.

 

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01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

 

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22.08.2017

LITRONIK accomplishes EN ISO 13485:2016 certification

LITRONIK, an MST company and a specialist in the development and manufacture of compact, ultra reliable batteries for active implants, has successfully completed EN ISO 13485:2016 certification, the international standard for quality management systems for medical devices.

MST at COMPAMED 2018

COMPAMED

High tech solutions for medical technology
November 12 - 15, 2018
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03

DYCONEX & Micro Systems Engineering GmbH (MSE) at electronica 2018

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Electronic Components, Systems & Applications
November 13 - 16, 2018
Messe München, Germany
DYCONEX: Hall A1, Booth# 331
MSE: Hall B1, Booth# 220

MST at Sensors Summit 2018 - USA

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Sensor Technology
December 10 - 12, 2018
Sheraton Hotel, San Diego, CA, USA
Booth# 3

Careers

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.