News & Events


DYCONEX introduces automated final inspections

DYCONEX AG now offers customers automated final inspections to further optimize testing of their printed circuit boards.



DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.



LITRONIK accomplishes EN ISO 13485:2016 certification

LITRONIK, an MST company and a specialist in the development and manufacture of compact, ultra reliable batteries for active implants, has successfully completed EN ISO 13485:2016 certification, the international standard for quality management systems for medical devices.

DYCONEX at EIPC Winter Conference


EIPC Winter Conference
February 14 - 15, 2019
NH Hotel Milano Fiera, Italy

Presentation by Sven Johannsen:
LCP for hermetically sealed sensing applications

MST at IMAPS Device Packaging 2019

Device Packaging
March 5 - 6, 2019
We-Ko-Pa Resort & Conference Center, Scottsdale/Fountain Hills, AZ, USA
Booth# 5

Micro Systems Engineering GmbH (MSE) at IMAPS Seminar 2019

"AVT - auch in Serie OK!"
March 27, 2019
Universität Rostock | Institut für Gerätesysteme und Schaltungstechnik, Rostock, Germany

Presentation by Jörg Gossler:
SMT-Technik in Kombination mit COB in der Serienproduktion kleiner und mittlerer Stückzahlen

MST at smartsystems integration 2019

Integration Issues of Miniaturized Systems
April 10 - 11, 2019
Hotel Barceló Sants, Barcelona, Spain
Booth# H-17

Presentation by Dr. Eckardt Bihler | DYCONEX AG:
Miniaturized Electronic Modules for Aggressive Environments


Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.