News & Events


Micro Systems Engineering, Inc. celebrates its 40th anniversary

Lake Oswego, July 24, 2019 – Micro Systems Engineering, Inc. (MSEI), an MST company and leading specialist in high-reliability medical microelectronics including development & design, system integration, and manufacturing celebrated its 40th anniversary in June 2019.


World’s smallest active NFC sensor module

DYCONEX has developed a novel approach to miniaturized, hermetic and highly reliable smart sensor modules with diameters down to 6 millimeters. The modules are ideal for use in medical, food processing, pharmaceutical, chemical or industrial applications.

DYCONEX at PCB West 2019


PCB Industry
September 10, 2019
Convention Center, Santa Clara, CA, USA
Booth# 203

Micro Systems Engineering GmbH (MSE) at EMPC | European Microelectronics and Packaging Conference 2019


September 17, 2019, 2:55 - 3:20 pm
Conference Center, Pisa, Italy

Presentation by Dr. Rainer Dohle:
New Assembly Technology for VCSEL arrays comprising ultra-thin diodes

MST at IMAPS Microelectronics Symposium 2019 - USA

October 1 - 2, 2019
Hynes Convention Center, Boston, MA, USA
Booth# 315

MST at European Microwave Week 2019


Microwave, RF, Wireless & Radar
October 1 - 3, 2019
Paris Expo Porte de Versailles, France
Booth# 2085

MST at EIPC & FED Technical Snapshot Workshop 2019


PCB and Electronics Manufacturing
October 8, 2019
Fraunhofer IZM, Berlin, Germany

Presentation (in German) by Daniel Schulze:
Mehr Funktionalität durch ultradünne Materialien
Tuesday, October 8, 2019 at 2:15 pm



Micro Systems Technologies Management AG
Neuhofstrasse 4
CH - 6340 Baar

Tel. +41 (44) 804 6300
Fax +41 (44) 804 6301

Commercial registry entry

Registered office of the company: Baar (ZG)
Legal form: Aktiengesellschaft (Swiss public limited company)
UID: CHE-114.724.240
Commercial registry office: Canton Zug (Switzerland)
Value-added tax number: CHE-114.724.240 MWST

Authorized representatives

Michael Andreas Fink, Director

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