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19.03.2019

World’s smallest active NFC sensor module

DYCONEX has developed a novel approach to miniaturized, hermetic and highly reliable smart sensor modules with diameters down to 6 millimeters. The modules are ideal for use in medical, food processing, pharmaceutical, chemical or industrial applications.

MST at SENSOR+TEST 2019

SENSOR+TEST

Measuring, Testing, Monitoring
June 25 - 27, 2019
Messezentrum Nuremberg, Germany
Booth# 404, Hall 1

DYCONEX at PCB West 2019

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PCB Industry
September 10, 2019
Convention Center, Santa Clara, CA, USA
Booth# 203

Micro Systems Engineering GmbH (MSE) at EMPC | European Microelectronics and Packaging Conference 2019

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September 16 - 19, 2019
Conference Center, Pisa, Italy

Presentation by Dr. Rainer Dohle:
New Assembly Technology for VCSEL arrays comprising ultra-thin diodes

MST at IEEE COMCAS 2019

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International Conference on Microwaves, Communications, Antennas and Electronic Systems
November 4 - 6, 2019
David Intercontinental Hotel, Tel Aviv, Israel 
Booth# 79

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World’s smallest active NFC sensor module

DYCONEX has developed a novel approach to miniaturized, hermetic and highly reliable smart sensor modules with diameters down to 6 millimeters. The modules are ideal for use in medical, food processing, pharmaceutical, chemical or industrial applications.

The tiny modules are based on Liquid Crystal Polymer (LCP), a thermoplastic dielectric material with very low water absorption (< 0.04%), high chemical stability and low thermal expansion. LCP is best suited both as a substrate material and as an encapsulate. LCP’s permeability for water and gases is the lowest among all polymeric materials. Phosphate buffered saline and sulfuric acid soak tests with an embedded, moisture sensitive test chip have demonstrated long term stability (> 14 months) and sufficient hermeticity for exposures in harsh environments.

Processing techniques for LCP substrates are the same as for other substrate materials. Resolution of lines, spaces and vias are comparable, multilayer structures can be built up and part of the metal layers can be used to form a coil for NFC (Near Field Communication). The substrates can be assembled with standard SMT processes as well as connected and sealed without the need for any adhesives by benefiting from its thermoplastic properties. LCP is a homogenous material and can be easily machined with UV lasers with a precision down to the micrometer scale, for example to integrate cavities and openings for recessed components.

For further information on the sensor modules please contact Dr. Eckardt Bihler , Business Development & Program Manager at DYCONEX.

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About DYCONEX AG
With more than 50 years of experience, DYCONEX AG is an international leader in the supply of highly complex flexible, rigid-flex and rigid HDI/microvia circuit boards and chip-substrate solutions. These products are used in every application where miniaturization, increased functionality, quality and the highest level of reliability play a role.
With its headquarters in Bassersdorf, DYCONEX today has 180 employees and the company is a member of the Micro Systems Technologies Group.

About the Micro Systems Technologies group
The Micro Systems Technologies group consists of four high-tech companies that offer innovative components and services for medical devices, in particular implants. Other high-tech industries that demand exceptional performance, quality and the highest levels of reliability also rely on the expertise of MST companies.
The globally active companies that make up the MST group – DYCONEX AG (Switzerland), LITRONIK Batterietechnologie GmbH (Germany), Micro Systems Engineering GmbH (Germany) and Micro Systems Engineering, Inc. (USA) – offer their customers integrated solutions ranging from initial design through to series production.

Contact
DYCONEX AG
Grindelstrasse 40
CH-8303 Bassersdorf
Switzerland

Phone +41 (43) 266 1100
Fax     +41 (43) 266 1101
mail.dyconex@mst.com

www.mst.com/dyconex