News & Events

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Redefining thinness of PCBs

Tiny medical implants improve patients’ comfort, smart phones are now build into a watch: Made possible by flexible and rigid ultra-thin base materials for highly reliable and thinner PCBs.

MST at IMAPS Advanced Packaging for Medical Microelectronics 2020 - USA

IMAPS
Advanced Technology Workshop
January 28 - 29, 2020
Westgate Hotel, San Diego, CA, USA

Presentation by Susan Bagen:
Update on Development Progress of Biocompatible LCP Electrodes and Catheters

MST at 16. Leiterplatten-Forum

Logo Bayern Innovativ
Die Leiterplatte als Systemintegrator
January 30, 2020
Haus der Bayerischen Wirtschaft, Munich, Germany

Presentation by Dr. Sebastian Schweiger:
Die Vielseitigkeit der flexiblen Leiterplatte

MST at Southern Manufacturing & Electronics

SME

The most comprehensive annual industrial exhibition in the UK
February 11 - 13, 2020
International Exhibition Center, Farnborough, UK
Booth# J70

MST at MD&M West Anaheim 2020

MD&M West

Medical Design & Manufacturing
February 11 - 13, 2020
Convention Center Anaheim, CA, USA
Booth# 610, Hall E

MST at IMAPS Device Packaging 2020

IMAPS
Device Packaging
March 3 - 4, 2020
WeKoPa Resort & Conference Center, Scottsdale/Fountain Hills, AZ, USA
Booth# 57

MST at Bodensee Aerospace Meeting

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New trends in aviation and aerospace industry
March 25, 2020
Kongress am Park, Augsburg, Germany

Careers


World’s smallest active NFC sensor module

DYCONEX has developed a novel approach to miniaturized, hermetic and highly reliable smart sensor modules with diameters down to 6 millimeters. The modules are ideal for use in medical, food processing, pharmaceutical, chemical or industrial applications.

The tiny modules are based on Liquid Crystal Polymer (LCP), a thermoplastic dielectric material with very low water absorption (< 0.04%), high chemical stability and low thermal expansion. LCP is best suited both as a substrate material and as an encapsulate. LCP’s permeability for water and gases is the lowest among all polymeric materials. Phosphate buffered saline and sulfuric acid soak tests with an embedded, moisture sensitive test chip have demonstrated long term stability (> 14 months) and sufficient hermeticity for exposures in harsh environments.

Processing techniques for LCP substrates are the same as for other substrate materials. Resolution of lines, spaces and vias are comparable, multilayer structures can be built up and part of the metal layers can be used to form a coil for NFC (Near Field Communication). The substrates can be assembled with standard SMT processes as well as connected and sealed without the need for any adhesives by benefiting from its thermoplastic properties. LCP is a homogenous material and can be easily machined with UV lasers with a precision down to the micrometer scale, for example to integrate cavities and openings for recessed components.

For further information on the sensor modules please contact Dr. Eckardt Bihler , Business Development & Program Manager at DYCONEX.

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About DYCONEX AG
With more than 50 years of experience, DYCONEX AG is an international leader in the supply of highly complex flexible, rigid-flex and rigid HDI/microvia circuit boards and chip-substrate solutions. These products are used in every application where miniaturization, increased functionality, quality and the highest level of reliability play a role.
With its headquarters in Bassersdorf, DYCONEX today has 180 employees and the company is a member of the Micro Systems Technologies Group.

About the Micro Systems Technologies group
The Micro Systems Technologies group consists of four high-tech companies that offer innovative components and services for medical devices, in particular implants. Other high-tech industries that demand exceptional performance, quality and the highest levels of reliability also rely on the expertise of MST companies.
The globally active companies that make up the MST group – DYCONEX AG (Switzerland), LITRONIK Batterietechnologie GmbH (Germany), Micro Systems Engineering GmbH (Germany) and Micro Systems Engineering, Inc. (USA) – offer their customers integrated solutions ranging from initial design through to series production.

Contact
DYCONEX AG
Grindelstrasse 40
CH-8303 Bassersdorf
Switzerland

Phone +41 (43) 266 1100
Fax     +41 (43) 266 1101
mail.dyconex@mst.com

www.mst.com/dyconex