News & Events

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19.03.2019

World’s smallest active NFC sensor module

DYCONEX has developed a novel approach to miniaturized, hermetic and highly reliable smart sensor modules with diameters down to 6 millimeters. The modules are ideal for use in medical, food processing, pharmaceutical, chemical or industrial applications.

MST at SENSOR+TEST 2019

SENSOR+TEST

Measuring, Testing, Monitoring
June 25 - 27, 2019
Messezentrum Nuremberg, Germany
Booth# 404, Hall 1

DYCONEX at PCB West 2019

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PCB Industry
September 10, 2019
Convention Center, Santa Clara, CA, USA
Booth# 203

Micro Systems Engineering GmbH (MSE) at EMPC | European Microelectronics and Packaging Conference 2019

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September 16 - 19, 2019
Conference Center, Pisa, Italy

Presentation by Dr. Rainer Dohle:
New Assembly Technology for VCSEL arrays comprising ultra-thin diodes

MST at IEEE COMCAS 2019

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International Conference on Microwaves, Communications, Antennas and Electronic Systems
November 4 - 6, 2019
David Intercontinental Hotel, Tel Aviv, Israel 
Booth# 79

Careers


DYCONEX opts for automated guided vehicles

DYCONEX AG, an MST company and the world’s leading supplier of ultra-complex printed circuit board solutions, successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

Introduction of Automated Guided Vehicles (AGVs) at DYCONEX marks a further step in the company’s methodical automation of production processes. The AGV system’s primary task is to transport materials between departments. “We aim to make good use of automation technology by relieving our staff of time-consuming transport tasks. For example, there is no need for people to step away from operating machinery or exit beyond clean zones,” explains Stephan Messerli, VP of Operations at DYCONEX.

The AGV system is comprised of various components working closely together to enable completely autonomous transport from shelf to shelf. The transport robots have been adapted to DYCONEX requirements and navigate by themselves, aided by a laser scanner. They react to changes in the working environment, avoiding people and obstacles on their own. Each vehicle calculates an optimal route to its destination on the basis of a stored map. The routing integrates processes for opening doors as well as autonomous floor-to-floor transfers via goods lift. Vehicles communicate via WLAN and organize transport tasks among themselves. Panels for entering transport orders complement the infrastructure. After a test phase lasting several months, the AGV transport system has been in productive operation since last December.

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Über DYCONEX AG
About DYCONEX AG
With more than 50 years of experience, DYCONEX AG is an international leader in the supply of highly complex flexible, rigid-flex and rigid HDI/microvia circuit boards and chip-substrate solutions. These products are used in every application where miniaturization, increased functionality, quality and the highest level of reliability play a role.
With its headquarters in Bassersdorf, DYCONEX today has 180 employees and the company is a member of the Micro Systems Technologies Group.

About the Micro Systems Technologies group
The Micro Systems Technologies Group consists of four high-tech companies that offer innovative components and services for medical devices, in particular implants. Other high-tech industries that demand exceptional performance, quality and the highest levels of reliability also rely on the expertise of MST companies.
The globally active companies that make up the MST Group – DYCONEX AG (Switzerland), LITRONIK Batterietechnologie GmbH (Germany), Micro Systems Engineering GmbH (Germany) and Micro Systems Engineering, Inc. (USA) – offer their customers integrated solutions ranging from initial design through to series production.

Contact
DYCONEX AG
Grindelstrasse 40
CH-8303 Bassersdorf
Switzerland

Phone +41 (43) 266 1100
Fax     +41 (43) 266 1101
mail.dyconex@mst.com

www.mst.com/dyconex