Full Flex & Flex Rigidized for Folding
In some applications Printed Circuit Boards (PCB) may need to be bent, folded or twisted or even continuously flexed during their application while at the same time parts of the same board need to maintain shape for stability and mechanical support for better handling or function. A rigid flex therefore combines the mechanical elements of rigid boards and the advantages of flexible boards.
Dyconex this way offers a technology that makes foldable full flex constructions a perfect match for small, reliable, microelectronic systems.
Technology Highlights
- Thin multilayer full flex for 3D miniaturization with flex only material
- Ultra-fine line down to 25/35 μm lines/spaces
- Ultra-HDI microvia technology down to 40 μm blind via
- Anylayer stacked blind vias and vias in pad
- Small bend zones in multiple shapes with laser technology
- Higher packaging density compared to classical rigid-flex PCB with prepregs
- Combination of PI or LCP flex and rigid materials possible
- Wide range of reflow assembly technologies possible such as flip chip,
- Chip on board (COB), Chip Scale Package (CSP), Ball grid array (BGA)
- Combination of reflow and wire bonding technology possible such as Al wire wedge-wedge bonding or thermosonic ball-wedge gold wire bonding
- Wide range of surface finishes are available, such as ENIG, ENEPIG, E-Ni/Au, OSP, DIG
General capabilities for full flex & flex rigidized circuit boards:
Description |
Standard Capability |
Lines/spaces |
35/40 µm |
Microvias/pads Ø |
50/150 µm |
Thinnest starting material |
25 µm |
Thinnest dielectric thickness |
12 µm |
Conductor width tolerance |
+/- 20% |
Artwork to soldermask tolerance |
+/- 25 µm |
Layer count |
< 8 |
Description |
Leading edge capability |
Lines/spaces |
25/35 µm |
Microvias/pads Ø |
40/100 µm |
Thinnest starting material |
12 µm |
Thinnest dielectric thickness |
5 µm |
Conductor width tolerance |
+/- 10 % |
Artwork to soldermask tolerance |
+/- 15 µm |
Layer count |
< 12 |