Image
Interconnect ceramic
In addition to standard thick film substrates, we manufacture highly complex multilayer LTCC (Low Temperature Co-fired Ceramic) substrates according to your specific needs. Furthermore, we offer concepts and design support for HTCC (High Temperature Co-fired Ceramic) technology.
- Multilayer technology up to more than 20 layers
- 3-dimensional design
- Fine line patterning
- Excellent RF performance up to 120 GHz
- Trimmable thick film resistors on outer surface
- Embedded passive components
- Thick film ceramic (96% alumina)
- Well suited for small geometry, high resistor value circuitry
- Multiple layer structures – single sided with single layer to multilayer on two sides
- Wide range of conductor materials