MSEI installing new UV excise laser capability with full digital factory integration capability. Increased 2x cut speeds with virtually no debris over previous installed technology, with ability to go up to 8x cut speeds.
Microelectronics & Packaging
May 2, 2017
Boxboro Regency Hotel, Boxborough, MA, USA
Medical Design & Manufacturing
June 13 - 15, 2017
Jacob K. Javits Convention Center, New York, NY, USA
Hall 3, Booth# 2163
Micro Systems Engineering, Inc.
6024 SW Jean Road
Lake Oswego, OR 97035
Tel. +1 (503) 744 8500
Fax +1 (503) 699 2790
© 2016 Micro Systems Technologies, CH-6340 Baar, Switzerland
Micro Systems Engineering, Inc., Lake Oswego (OR), USA