News & Events

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01.02.2016

New UV excise laser capability

MSEI installing new UV excise laser capability with full digital factory integration capability.  Increased 2x cut speeds with virtually no debris over previous installed technology, with ability to go up to 8x cut speeds.

MST at IMAPS Advanced Packaging for Medical Microelectronics 2018

IMAPS
Advanced Packaging Workshop
January 23 - 24, 2018
Handlery Hotel, San Diego, CA, USA
Booth# tbd

MST at MD&M West Anaheim 2018

MD&M West

Medical Design & Manufacturing
February 6 - 8, 2018
Convention Center Anaheim, CA, USA
Hall E, Booth# 618

MST at IMAPS Device Packaging 2018

IMAPS
Device Packaging
March 6 - 7, 2018
We-Ko-Pa Resort & Conference Center, Scottsdale/Fountain Hills, AZ, USA
Booth# tbd

Careers


New UV excise laser capability


02/01/2016 - MSEI installing new UV excise laser capability with full digital factory integration capability.  Increased 2x cut speeds with virtually no debris over previous installed technology, with ability to go up to 8x cut speeds.  Total energy delivered to the sample reduced by as much as one half. This is yet another step to establish MSEI as the state of the art SMT line in its industry.


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