Thick film features

Thick film dimensional capabilities

 


Index Description Standard Leading edge
tf_substrate_dimensions
A Line width 200 µm 100 µm
B Line to via coverpad spacing 200 µm 150 µm
C Line spacing 200 µm 100 µm
D Through hole pitch 600 µm 500 µm
E Line to edge spacing 250 µm 200 µm
F Via to edge spacing 400 µm 400 µm
G Pad to edge spacing 300 µm 200 µm
H Through hole diameter
200 µm 150 µm
I Coverpad through hole
500 µm
square
400 µm
square
J Via pad 300 µm
square
300 µm
square
K Dielectric to substrate edge 200 µm 200 µm
L Conductor to dielectric edge 200 µm 200 µm
M Via pitch at same potential
Via pitch at different potential
≥ 0 µm
≥ 200 µm
≥ 0 µm
≥ 200 µm

 

External dimensions

Length / width tolerances

Standard
Premium
Ultra premium

 

± 1%, not less than ±0.102 mm
± 1%, not less than ±0.076 mm
± 1%, not less than ±0.051 mm

Thickness tolerances (0.254 mm to 3.048 mm)

Standard
Premium

 

± 10%, not less than ±0.038 mm
± 7%, not less than ±0.025mm

Camber tolerances

Standard
Premium

 

≤ 0.076 mm/mm
≤ 0.051 mm/mm

Data according to manufacturer


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