Standard thick film ceramic (96% alumina) substrates are engineered to minimize as-fired resistor variations and maximize aged adhesion values. Superior resistor stability is achieved by controlling the substrates' effects on the temperature coefficient of resistance.
The standard thick film ceramic substrate is particularly well suited for small geometry, high resistor value circuitry.
Thick film process flow
After scribing / drilling with a CO2 laser and a cleaning step the alumina substrates are patterned by screen printing, followed by a drying and the final sintering step.
Thick film circuits are available in a variety of layer structures from single sided with single layer to multilayer on two sides.
The thick film multilayer structure allows for up to three layers on both sides.
Quality performance testing and assurance
In-process and final inspection procedures include:
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