LTCC (Low Temperature Co-fired Ceramic) is a multilayer capable substrate technology offering excellent RF and microwave performance characteristics. Its low sintering temperature (approximately 900°C) allows co-firing with highly conductive metals such as silver and gold.
LTCC process flow
The multilayer technology allows for the parallel stacking of up to more than 20 layers.
The excellent mechanical and electrical properties of LTCC substrates, combined with the ability to embed passive components and to apply fine line patterning, offer superior RF performance and device miniaturization for high-frequency applications.
Further features like the application of heat sinks, frames and nail head pins by brazing allow for hermetic and highly complex packages.
Quality performance testing and assurance
In-process and final inspection procedures include:
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