Semiconductor packaging

Your specific requirements can be realized by a variety of packaging options. Diverse I/O configurations, BGA packages and housing types are available.


Base materials

  • LTCC
  • Al2O3
  • PCB

I/O configurations

  • Ball Grid Array (BGA)
  • Land Grid Array (LGA)
  • Castellation
  • Single In-Line / Dual In-Line (SIL/DIL)
  • Quad Flat Packages (QFP)

Housings

  • Non-hermetic housings using plastic/metal covers or organic coatings
  • Hermetic housings by soldering

Ball Grid Array packages

  • Stacked Die BGA (SDBGA), BGA
  • High voltage BGA

 


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