Ball Grid Array packages
The production process of the BGA packages includes transfer molding allowing for the manufacture of small and medium-sized volumes.
- Stacked die BGA, BGA
- High voltage BGA
Process flow for stacked die packages
- Transfer molding system: Fico MMS-W
- Molding system for single-sided products in MAP, such as BGA, QFN, etc.
- System allows for cost-effective production of small and medium-sized volumes
- CO2 laser
- Codes marking and scanning: 1D, 2D, BMP, JPG
- PCB fiducial recognition and positioning
- Dicing system: Fico ISS package saw
- System provides multiple operations: dicing, cleaning, top side AOI, bottom side AOI, sorting to JEDEC trays or bins