Advanced assembly
SMT (Surface Mount Technology) and chip & wire technologies are available for the assembly of components like SMD, BGA, LGA, CSP, flip chips or bare dies on ceramic and organic substrates.
Surface Mount Technology (SMT)
- Three automated SMD assembly lines
- On any board material
- Plasma and IPA cleaning available
- 01005 components up to 85 x 85 mm2
- Flip chip / CSP (chip scale package) capability
Die attach technologies
- Gluing by epoxy printing, epoxy dispensing, pre-forms and stamping
- Soldering by solder printing, solder dispensing and pre-forms
- High precision die bonder can pick from wafers, waffle packs or gel-packs
Wire bonding
- Ultrasonic bonding for Al thin wires
- Thermosonic wedge/wedge bonding for Au thin and Au cold wires
- Thermosonic ball/wedge bonding for Au thin wires
Die protection / encapsulation
- Glop top (temperature or UV curing)
- Underfill
- Junction coating
- Transfer molding
- Soldering or gluing for covers and lids