Advanced assembly

SMT (Surface Mount Technology) and chip & wire technologies are available for the assembly of components like SMD, BGA, LGA, CSP, flip chips or bare dies on ceramic and organic substrates.

Surface Mount Technology (SMT)

• Three automated SMD assembly lines
• On any board material
• Plasma and IPA cleaning available
• 01005 components up to 85 x 85 mm²
• Flip chip / CSP (chip scale package) capability

Die attach technologies

• Gluing by epoxy printing, epoxy dispensing, pre-forms and stamping
• Soldering by solder printing, solder dispensing and pre-forms
• High precision die bonder can pick from wafers, waffle packs or gel-packs

Wire bonding

• Ultrasonic bonding for Al thin wires
• Thermosonic wedge/wedge bonding for Au thin and Au cold wires
• Thermosonic ball/wedge bonding for Au thin wires

Die protection / encapsulation

• Glop top (temperature or UV curing)
• Underfill
• Junction coating
• Transfer molding
• Soldering or gluing for covers and lids