Founded as a supplier of electronic modules for active implants, MSE is now an important partner and specialist for the international electronics industry, providing superior solutions for advanced electronics at the highest quality level.
Your design inputs and requirements are converted into reliable and robust products by our design support team. We offer assistance for various technologies like LTCC (Low Temperature Co-fired Ceramic), thick film, HTCC (High Temperature Co-fired Ceramic), HDI printed circuit boards, rigid-flex PCBs and thin film.
MSE manufactures multilayer ceramic substrates based on LTCC (Low Temperature Co-fired Ceramic) and thick film technology - offering a variety of beneficial features like fine line resolution, integrated passive components and many more, and this for complex substrate solutions in avionic, space, radar, automotive and sensor applications.
We have at our disposal extensive assembly equipment and inspection technologies in the field of SMT (Surface Mount Technology) and chip & wire. They enable us to assemble an extremely wide range of components like SMD (Surface Mount Devices), BGA (Ball Grid Arrays), CSP (Chip Scale Packages), flip chips and bare dies on any board material for the production of complex, miniaturized electronic modules.
We offer various customized packaging solutions for a wide range of base materials, I/O configurations and housing types. Our newest technology development enables the production of SDBGAs (Stacked Die Ball Grid Arrays) using transfer molding technology in small and medium-sized volumes.
A wide range of innovative test capabilities, the development of application-specific tests as well as a set of complementary services like global procurement and supply chain management allow us to offer comprehensive customized solutions from one source.