Publications in the field of LTCC and thick film circuits

 

Embedded Cavity based Dielectric Loss Measurements for LTCC Substrates up to 110 GHz

A. Talai, F. Steinhaußer, A. Bittner, U. Schmid, R. Weigel, D. Schwanke, Th. Rittweg, A. Koelpin,
IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), August 11-14, 2015, Ottawa, Canada

LTCC Based Microfluidic Mass Flow Sensor Concept

C. Zeilmann, T. Haas, A. Backes, U. Schmid,
Journal of Microelectronics and Electronic Packaging (2012) 9, 87-96

Micro Fluidic Mass Flow Sensor Concept for Functional Ceramic Circuits

C. Zeilmann, T. Haas, A. Backes, U. Schmid,
Paper Ceramic Interconnect & Ceramic Microsystems Technologies CICMT 2012 Erfurt

Verbundprojekt AeroSens, Ziele und Struktur des Projektes, Testvehikel-Fertigung durch MSE

Dieter Schwanke, Jürgen Pohlner, Cluster AeroSens,
Deutsche IMAPS Konferenz, München, 2012

Optimization of silver paste for flexography printing on LTCC substrate

R. Faddoul, N. Reverdy-Bruas, A. Blayo, T. Haas, C. Zeilmann,
Journal of Microelectronics Reliability, Vol. 52, Issue 7, July 2012, ISSN 0026-2714

Investigation of Pressure Sensor Concepts for Functional Ceramic Circuits

T. Haas, C. Zeilmann, U. Schmid,
International Symposium on Ceramic Materials and Components for Energy and Environmental Applications, CMCEE, Dresden, Germany, 2012

Manufacturing Processes for Pressure Sensors Realized in LTCC

T. Haas, C. Zeilmann, U. Schmid, A. Bittner,
Konferenz Mechatronics, Linz, Austria, 2012

Investigation of Innovative Cooling Concepts for Functional Ceramic Circuits

T. Haas, C. Zeilmann, A. Backes, A. Bittner, U. Schmid,
European Advanced Technology Workshop on Micropackaging and Thermal Management, IMAPS France, LaRochelle, France, 2011

Investigation on Micromachining Technologies for the Realization of LTCC Devices and Systems

T. Haas, C. Zeilmann, A. Bittner, U. Schmid,
SPIE Microtechnologies, Prague, Czech Republic, 2011

Passive Integration für LTCC-Mikrowellen-Module - Technologie- und Designoptimierung

Ruben Perrone, Dieter Schwanke, Jens Müller,
Deutsche IMAPS Konferenz, München, Oktober 2010

Design and Evaluation of an Active Cooling Concepts for Functional Ceramic Circuits

T. Haas, C. Zeilmann, A. Backes, A. Bittner, U. Schmid,
21st Micromechanics and Micro Systems Europe Workshop, MME, Enschede, The Netherlands, 2010

Entwicklung nanotechnologischer Siebbeschichtungen und daran angepasster Pastensysteme für den Fine-Line-Druck von keramischen Schaltungsträgern

D. Schwanke et. al.,
2010, Verlag Dr. Markus A. Detert, ISBN13: 978-3-934142-39-8

Recent Developments in Screen Printing to Enhance Fine Line Resolution

Dieter Schwanke,
Printing Technologies (MULTILAYER Project), November 2, 2009, FhG-IKTS, Dresden, Germany

Ceramic Microwave Circuits for Satellite Communication

R. Kulke, G. Möllenbeck, C. Günner, P. Uhlig, K. H. Drüe, S. Humbla, J. Müller, R. Stephan, D. Stöpel,
J. F. Trabert, G. Vogt, M. A. Hein, A. Molke, T. Baras, A. F. Jacob, Dieter Schwanke, J. Pohlner, A. Schwarz,
G. Reppe.
Journal of Microelectronics and Electronic Packaging (2009) 6, 27-31

Validation of Alternative RoHS Compliant Au Pastes for the DuPont LTCC 951 System

Bernhard Mussler, Dieter Schwanke.
Journal of Microelectronics and Electronic Packaging (2009) 6, 20-26

Enhancement of Fine Line Print Resolution due to Coating of Screen Fabrics

Dieter Schwanke, Jürgen Pohlner, Andreas Wonisch, Torsten Kraft, Jürgen Geng.
Journal of Microelectronics and Electronic Packaging (2009) 6, 13-19

nanoSieb, MSE Teil 1 und 2

D. Schwanke, J. Pohlner, A. Lang,
23. μTP Workshop, 2009, Dresden

Projekt nanoSieb

Vortrag am 05.05.2009, SMT Messe Nürnberg 2009, Messestand µTP, Kompetenznetzwerk Mikrotechnische Produktion

Tagungsband "Production Research for Micro- and NanoTechnology"

MiNaT, Stuttgart, October, 7th - 9th, 2008

Funktionelle Schichtungen auf Siebdruckgeweben und deren Charakterisierung

Christoph Pönisch, Dr. Dieter Schwanke, Prof. Dr. Marek Gorywoda, Dr. Jürgen Geng,
September 2008, MSE Berg

Validation of Alternative RoHS Compliant Au-pastes for the DuPont LTCC 951 System

Proceedings 2008 IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), April 21-24, 2008, Munich, Germany

Enhancement of Fine Line Print Resolution due to Coating of Screen Fabrics

Proceedings 2008 IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), April 21-24, 2008, Munich, Germany

Baugruppen auf anorganischen Schaltungsträgern S.197 bis 211 in Innovative Produktionsprozesse für die Hochtemperaturelektronik

Dieter Schwanke, Thomas Haas,
ISBN 3-934142-52-4, Verlag Dr. Markus A. Detert, Templin, Mai 2005

Ceramic Interconnect and Ceramic Microsystems Technology (CICMT)

Jens Müller,
Baltimore/MD, April 10-13, 2005

LTCC - a Promising Technology for High-Frequency System-in-Packages

Jens Müller, Gerhard Kahmen, Roland Schumann, Nihal Sinnadurai,
MicroTech 2005, March 1-2, 2005, Cambridge, UK