1984 Launch of MSE in Berg (Northern Bavaria)
1985 Production start of thick film hybrid modules for implantable pacemakers
1990 First automated assembly line
1995 Start of LTCC process development
1997 First single chamber LTCC circuit for pacemakers
1999 First prototypes of dual chamber pacemakers with Chip Scale Packages (CSP) on rigid-flex boards
2003 Introduction of automated assembly line for flip chip and CSP mounting
2005 First multi-million euro order for LTCC substrates

Two new Kemmer punching machines: total punching capacity of 4 million vias per day

First LTCC substrate operating at 60 GHz


Prize winner "Bayern's Best 50" - awarded by the Bavarian Secretary of Commerce

Move into additional building with another 600 m2 clean room and 400 m2 lab and office space

2008 MSE becomes part of the globally active Micro Systems Technologies group
2012 Start of packaging line for stacked die BGAs including transfer molding
2013 Attestation of an Energy Management System
2014 Start of stacked die BGA series production for medical applications

Additional automated SMD assembly line

Extension of production building by 200 m2 cleanroom

Groundbreaking for additional production building