News & Events

Micro Systems Engineering GmbH (MSE) at IMAPS Technology Workshop Lyon 2016 - France

IMAPS
Microelectronics, Systems & Packaging
December 7 - 8, 2016
Metropole Hotel, Lyon, France

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Products and services

Design services

Design services

Your design inputs and requirements are converted into reliable and robust products by our design support team. We offer assistance for various technologies like LTCC (Low Temperature Co-fired Ceramic), thick film, HTCC (High Temperature Co-fired Ceramic), HDI printed circuit boards, rigid-flex PCBs and thin film.

Substrate manufacturing

Substrate manufacturing

MSE manufactures multilayer ceramic substrates based on LTCC (Low Temperature Co-fired Ceramic) and thick film technology - offering a variety of beneficial features like fine line resolution, integrated passive components and many more, and this for complex substrate solutions in avionic, space, radar, automotive and sensor applications.

Advanced assembly

Advanced assembly

Extensive assembly equipment and inspection technologies in the field of SMT (Surface Mount Technology) and chip & wire enable us to assemble an extremely wide range of components like SMD (Surface Mount Devices), BGA (Ball Grid Arrays), CSP (Chip Scale Packages), flip chips and bare dies on any board material for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

We offer various customized packaging solutions for a wide range of base materials, I/O configurations and housing types. Our newest technology development enables the production of SDBGAs (Stacked Die Ball Grid Arrays) using transfer molding technology in small and medium-sized volumes.

Special capabilities and services

Special capabilities and services

A wide range of innovative test capabilities, the development of application-specific tests as well as a set of complementary services like global procurement and supply chain management allow us to offer comprehensive customized solutions from one source.