Micro Systems Engineering GmbH

Founded as a supplier of electronic modules for active implants, MSE is now an important partner and specialist for the international electronics industry, providing superior solutions for advanced electronics at the highest quality level.

Micro Systems Engineering GmbH

MSE's mission is to support each customer as a partner - from the concept phase through prototyping to volume production, from design support through quality management to procurement.

Micro Systems Engineering GmbH

Our commitment to quality, reliability, cost-effectiveness and meeting customer requirements is your guarantee for customized top-level solutions in microelectronics.


Events

Micro Systems Engineering GmbH (MSE) at SMT 2014

SMT

SMT/HYBRID/PACKAGING
May 6 - 8, 2014
Messezentrum Nürnberg, Germany
Hall 7, Booth# 109

Micro Systems Engineering GmbH (MSE) at SENSOR+TEST 2014

SENSOR+TEST

Measuring, Testing, Monitoring
June 3 - 5, 2014
Messezentrum Nürnberg, Germany
Hall 12, Booth# 316

Micro Systems Engineering GmbH (MSE) at IMS 2014 International Microwave Symposium

ims_2014_108px

Microwave Technology
June 3 - 5, 2014
Tampa Convention Center, Tampa Bay, FL, USA
Booth# 2213

Careers


Products and services

Design services

Design services

Your design inputs and requirements are converted into reliable and robust products by our design support team. We offer assistance for various technologies like LTCC (Low Temperature Co-fired Ceramic), thick film, HTCC (High Temperature Co-fired Ceramic), HDI printed circuit boards, rigid-flex PCBs and thin film.

Substrate manufacturing

Substrate manufacturing

MSE manufactures multilayer ceramic substrates based on LTCC (Low Temperature Co-fired Ceramic) and thick film technology - offering a variety of beneficial features like fine line resolution, integrated passive components and many more, and this for complex substrate solutions in avionic, space, radar, automotive and sensor applications.

Advanced assembly

Advanced assembly

We have at our disposal extensive assembly equipment and inspection technologies in the field of SMT (Surface Mount Technology) and chip & wire. They enable us to assemble an extremely wide range of components like SMD (Surface Mount Devices), BGA (Ball Grid Arrays), CSP (Chip Scale Packages), flip chips and bare dies on any board material for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

We offer various customized packaging solutions for a wide range of base materials, I/O configurations and housing types. Our newest technology development enables the production of SDBGAs (Stacked Die Ball Grid Arrays) using transfer molding technology in small and medium-sized volumes.

Special capabilities and services

Special capabilities and services

A wide range of innovative test capabilities, the development of application-specific tests as well as a set of complementary services like global procurement and supply chain management allow us to offer comprehensive customized solutions from one source.