Our technology roadmap looks ahead to allow us to meet the future demands of current and targeted customers and fully satisfy their requirements from 2013 to through 2016. The roadmap is based on the regular production of optimized build-ups, but many technologies are available at DYCONEX a full year earlier for prototypes and R&D purposes.
|Conductor lines/spaces||25/35 µm||20/25 µm||18/22 µm||16/20 µm|
|Microvias/pads diameter, laser flex||50/200 µm||50/150 µm||40/130 µm||35/110 µm|
|Microvias/pads diameter, laser rigid||75/200 µm||60/200 µm||50/150 µm||40/130 µm|
|Artwork to soldermask tolerance||+/-25 µm||+/-25 µm||+/-15 µm||+/-15 µm|
© 2014 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland