Technology Roadmap

Our technology roadmap looks ahead to allow us to meet the future demands of current and targeted customers and fully satisfy their requirements from 2013 to through 2016. The roadmap is based on the regular production of optimized build-ups, but many technologies are available at DYCONEX a full year earlier for prototypes and R&D purposes.

CAPABILITY 2013 2014 2015 2016
Conductor lines/spaces 25/35 µm 20/25 µm 18/22 µm 16/20 µm
Microvias/pads diameter, laser flex 50/200 µm 50/150 µm 40/130 µm 35/110 µm
Microvias/pads diameter, laser rigid 75/200 µm 60/200 µm 50/150 µm 40/130 µm
Artwork to soldermask tolerance +/-25 µm +/-25 µm +/-15 µm +/-15 µm