Driven by leading-edge customers, DYCONEX has continually been at the forefront of developments in PCB manufacturing methodologies, and we have repeatedly set important technological milestones. Just a few examples are:

2013 Multibond Process
2012 25 µm soldermask registration
  • LDI fine line capability
  • IST testing for longtime high-reliability simulation
2010 Via fill technology for HDI (high-density interconnect) applications
  • Pattern plating technology
  • Biocompatible biosensors for direct implants
  • Development of high-resistance PCBs
  • Development of nickel wiring bands for high current and reliable Interconnects
2008 Mechanically drilled microvias for rigid
2007 Development of LCP (liquid crystal polymer) cavity devices for radar applications
2005 Embedded passives
2004 LCP microvia boards, 2 and 4 layers
2003 Microfluidic and biosensor chip technology
2002 High-reliability microvia multilayer boards produced by plasma-laser combination
2001 Laser direct imaging of high-density patterns on flex substrates
1999 Wraparound microvia build-up for high-end applications
  • 2x5-layer DYCOstrate® build-up for performance-driven applications
  • BGA interposer technology (DYCOre®)
1997 Embedded microcoaxial structures
1995 Epoxy-based, low-cost DYCOstrate®-C technology (sequential build-up)
1992 Microvia PCB and MCM (multichip module) foil technology (DYCOstrate®)
1991 High-reliability rigid-flex multilayer boards (DYCOflex®)
1988 CTE-constrained multilayer boards with copper-carbon-copper (CCC)
1985 CTE-constrained multilayer boards with copper-molybdenum-copper (CMC)
1984 SMD (surface-mount device) multilayer boards with a combination of blind and buried vias (DENSTRATE®)
1983 CTE-constrained multilayer boards with copper-invar-copper (CIC)
1980 Multilayer boards for high-current loads