The launch of the DYCOstrate® technology in 1992 became our biggest success story worldwide. Developed to meet the growing demand for applications with ultra high wiring density and complex packaging substrates, DYCOstrate® was our premium technology for optimized performance.
This technology is based on the use of plasma etching and laser drilling as drilling/milling tools for HDI micro vias, windows, contours and other structures in thin, flexible dielectrics. DYCOstrate® enables the production of rigid, rigid-flex and flex substrates, and it is tailored to solve most requirements concerning thermal management, RF performance, stiffness, controlled thermal expansion, thickness and weight.
DYCOstrate®-C is the rigid sequential build-up (SBU) version allowing up to 3 laser-drilled microvia layers per side on a conventional multi-layer board.
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DYCONEX AG, CH-8303 Bassersdorf, Switzerland