Rigid-Flex

Rigid-flex is a multilayer printed circuit board with both rigid and flex electric interconnecting layers. A composition of flexible and rigid substrates in a single circuit board creates unique opportunities. The technology allows designers to replace multiple PCBs interconnected with connectors, wires and ribbon cables to create a single circuit board while improving performance and reliability. Furthermore, because rigid-flex PCBs can be bent, folded or twisted, they make an ideal solution for optimizing applications with tight space limitations by using the third dimension.

DYCONEX has more than two decades of experience in the manufacture of rigid-flex technology. The resulting expertise has built up our solid reputation for excellence, especially where highly complex solutions are needed. Whether a 14-layer bookbinder PCB for the Herschel satellite, a high-density board for an F-1 steering wheel or a 3D miniaturization project in the field of medical implants, our expertise at DYCONEX in rigid-flex circuitry will serve you with a tailor-made, high-quality solution.


Technology Highlights

  • Multilayer HDI (high-density interconnect)/microvia rigid-flex circuit boards for 3D-miniaturization
  • Sequential, parallel, symmetric and asymmetric build-ups 
  • High-frequency, high-temperature and ruggedized rigid-flex solutions 
  • High-frequency rigid-flex HDI solutions based on LCP (liquid crystal polymer) base material
  • Thinned bending zones
  • High variety of flex and rigid base materials, surface protections and surface finishes.

 

General capabilities for polyimide rigid-flex circuit boards:

Description Standard Capabilities
Lines/spaces
35/40 µm
Microvias/pads diameter (flex) 50/200 µm
Microvias/pad diameter (rigid, laser 75/200 µm
Through vias/pads  diametter (rigid, mech.) 125/300 µm
Thinnest dielectric thickness (flex)
12 µm
Thinnest dielectric thickness (rigid)
60 µm
Conductor width tolerance +/- 20%
Artwork to soldermask tolerance
+/- 50 µm
Layer count
up to 20

 

Description Leading-Edge Capabilities
Lines/spaces
25/35 µm
Microvias/pads diameter (flex)
40/100 µm
Microvias/pads diameter (rigid, laser) 50/150 µm
Thinnest dielectric thickness (flex)
12 µm
Thinnest dielectric thickness (rigid)                           
46 µm
Conductor width tolerance +/- 15%
Artwork to soldermask tolerance +/- 25 µm
Layer count up to 24