News 2012

11/13/12

DYCONEX successfully running 25 µm laminates in volume using RENA cleaning unit

DYCONEX has further enhanced its high-end PCB production with a 25-µm laminate cleaning unit which is capable of processing foils without assisted transport.


09/06/12

DYCONEX buys CO2/UV Laser equipment

DYCONEX has again invested in additional laser drill equipment. The new CO2/UV Combi-Laser considerably increases throughput for HDI PCBs and improves especially the quality of blind vias.


07/13/12

DYCONEX Achieves ISO 13485 Certification

DYCONEX, a leading manufacturer of high-end medical PCBs, is proud to announce that it has been awarded ISO 13485:2003 certification. The ISO 13485 standard complements DYCONEX's existing ISO 9001 Quality Management System, that the company has maintained for many years and documents DYCONEX's capabilities as a supplier of high quality and reliability components to its customers in the medical market.


07/05/12

DYCONEX AG & Micro Systems Technologies announce changes in management structure

DYCONEX AG (Bassersdorf, Switzerland) and the Micro Systems Technologies (MST) Group (Baar, Switzerland) are pleased to announce important changes in their management structure.


05/14/12

DYCONEX demonstrates 20-μm line & space capability on multilayer LCP product

DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!


04/05/12

DYCONEX is a founding member of iNEMI’s «Defining Reliability Requirements for Implantable Medical Devices» project

We are proud to announce that DYCONEX is a founding member of a project being set up by the International Electronics Manufacturing Initiative (iNEMI) entitled «Defining Reliability Requirements for Implantable Medical Devices.»


02/13/12

Launch of new information platform for the EC IMAGINE innovation project

Since 2010, DYCONEX has been actively participating in the FP7-SME-2008-1 IMAGINE Project, which is targeted at strengthening the research capabilities of SMEs and is funded by the European Union (Grant Agreement no.: 231997). This project aims to develop a low-cost/high-performance passive millimeter-wave (MMIC) camera front end that can be put to use in security-screening applications such as airport body scanners.