News 2009

Substrates for high frequency SiP and MCM packages are not only subject to form factor requirements; they must also provide superior RF properties in combination with good heat diffusion and controllable thermal expansion. By combining the latest multilayer LCP fine-line substrate technology with a targeted use of laser cavities and metallic heat-sinks, DYCONEX has achieved an optimized interconnect design that accomplishes all of these desired performance characteristics.

DYCONEX has extended its capabilities in dimensional measurement and analysis for 2D and 3D objects with the acquisition of a new ProX3 coordinate measurement system from Impex.

Taking mechanical drilling capabilities one step further, DYCONEX has implemented new, state-of-the art drilling systems capable of routinely producing mechanical holes with diameters as low as 100 micrometers, and even as low as 75 micrometers for some specialty applications!

As PCB design complexity and density continue to increase, front-end data preparation efforts must be evermore exact and provide production artwork that is tailored to meet specific customer requirements.

Following through with another investment milestone planned for this year, DYCONEX successfully installed new plasma desmearing equipment this month, replacing an existing unit which has admirably served it's task for many years. The new equipment greatly extends the envelope of capability and enhances applicability of the plasma desmearing process.

DYCONEX, Inc., the USA subsidiary of high-end PCB foundry DYCONEX AG, announces that they recently have obtained their official International Traffic in Arms Regulations (ITAR) registration from the US Department of State, Directorate of Defense Trade Controls.

DYCONEX AG, a leading manufacturer of high-reliability printed circuit boards, confirmed the 2009 share of its earlier announced multimillion investment program.