DYCONEX has installed a new pre-treatment tunnel machine so it can provide an in-house Multibond process. Today, that process is qualified for flex PCBs and inner layers of rigid products.
Electronic technologies and advanced manufacturing
September 18 - 19, 2014
Marylhurst University, Portland, OR, USA
October 14 - 15, 2014
Town & Country Resort, San Diego, CA, USA
October 20 - 21, 2014
Doubletree San Francisco Airport North, San Francisco, CA, USA
CH - 8303 Bassersdorf
Tel. +41 (43) 266 11 00
Fax +41 (43) 266 11 11
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© 2014 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland