DYCONEX is making a new appointment for the position of Director Sales starting October 1, 2014. Following a familiarization phase, Christian Beck will assume the duties of Stefan Hilfiker, who has decided to take an 11-month sabbatical leave.
High tech solutions for medical technology
November 12 - 14, 2014
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03
Workshop on Microelectronics, Systems & Packaging for Medical Applications
December 9 - 11, 2014
Metropole Congress Hotel, Lyon, France
DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.
Embedded-resistor copper foil technology is applied mainly when form-factor reduction is required or if the available space for active components has to be optimized. Furthermore, designs benefit from improved signal routing through the elimination of vias and shorter signal paths.
DYCONEX has applied this technology to a three-layer HDI rigid-flex build-up in the PCB for an innovative Specific Absorption Rate sensor. By doing so, the company has proven its high-yield production and test capabilities for the new material.
Today DYCONEX offers a complete solution from product design support through to testing.
© 2014 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland