EIPC Winter Conference
February 5-6, 2015
Hotel NH Munich Airport, Munich, Germany
Dr. Hans-Peter Klein will give a presentation
about the theme:
Flex PCB Reliability - The proof of evidence
It will take place on Thursday, February 5, 11:25hrs
Medical Design & Manufacturing
February 10 - 12, 2015
Convention Center Anaheim, CA, USA
Hall E, Booth# 518
March 17 - 18, 2015
Radisson Fort McDowell Resort, Scottsdale/Fountain Hills, AZ, USA
DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.
Embedded-resistor copper foil technology is applied mainly when form-factor reduction is required or if the available space for active components has to be optimized. Furthermore, designs benefit from improved signal routing through the elimination of vias and shorter signal paths.
DYCONEX has applied this technology to a three-layer HDI rigid-flex build-up in the PCB for an innovative Specific Absorption Rate sensor. By doing so, the company has proven its high-yield production and test capabilities for the new material.
Today DYCONEX offers a complete solution from product design support through to testing.
© 2015 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland