DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.
Scandinavian Electronics Event
April 24 - 26, 2018
Kistamässan Science Citx, Kista/Stockholm, Sweden
Hall C, Booth# C11:33
Electronic Materials & Processes for Space (EMPS) Workshop
April 25 - 26, 2018
Y-Parc, Yverdon-les-Bains, Switzerland
Presentation by Bernhard Schmuki:
Ultra-thin rigid PCBs with highly reliable anylayer and HDI build-ups
Trade Show for Aviation, Defense & Security and Space
April 25 - 27, 2018
ExpoCenter Airport, Berlin, Germany
Hall 6 - International Suppliers Center (ISC), Booth# 424
June 5 - 7, 2018
Messezentrum Nuremberg, Germany
Hall 5, Booth# 211-C
DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.
Embedded-resistor copper foil technology is applied mainly when form-factor reduction is required or if the available space for active components has to be optimized. Furthermore, designs benefit from improved signal routing through the elimination of vias and shorter signal paths.
DYCONEX has applied this technology to a three-layer HDI rigid-flex build-up in the PCB for an innovative Specific Absorption Rate sensor. By doing so, the company has proven its high-yield production and test capabilities for the new material.
Today DYCONEX offers a complete solution from product design support through to testing.
© 2018 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland