DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.
DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.
June 13, 2017
Kursaal, Berne, Switzerland
Medical Design & Manufacturing
June 13 - 15, 2017
Jacob K. Javits Convention Center, New York, NY, USA
Hall 3, Booth# 2163
52nd International Paris Air Show
June 19-25, 2017
Le Bourget, Paris
HAll 4, Booth# D193
DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.
Embedded-resistor copper foil technology is applied mainly when form-factor reduction is required or if the available space for active components has to be optimized. Furthermore, designs benefit from improved signal routing through the elimination of vias and shorter signal paths.
DYCONEX has applied this technology to a three-layer HDI rigid-flex build-up in the PCB for an innovative Specific Absorption Rate sensor. By doing so, the company has proven its high-yield production and test capabilities for the new material.
Today DYCONEX offers a complete solution from product design support through to testing.
© 2016 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland