News & Events

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12.05.2016

DYCONEX celebrates its 25th anniversary

DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.

MST at IMAPS Technology Workshop Lyon 2016 - France

IMAPS
Microelectronics, Systems & Packaging
December 7 - 8, 2016
Metropole Hotel, Lyon, France

MST at MD&M West Anaheim 2017

MD&M West

Medical Design & Manufacturing
February 7 - 9, 2017
Convention Center Anaheim, CA, USA
Hall E, Booth# 510


DYCONEX adds Ticer TCR-HF foils to its range of circuit board technologies

DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.

Embedded-resistor copper foil technology is applied mainly when form-factor reduction is required or if the available space for active components has to be optimized. Furthermore, designs benefit from improved signal routing through the elimination of vias and shorter signal paths.

DYCONEX has applied this technology to a three-layer HDI rigid-flex build-up in the PCB for an innovative Specific Absorption Rate sensor. By doing so, the company has proven its high-yield production and test capabilities for the new material.

Today DYCONEX offers a complete solution from product design support through to testing.

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