DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.
Microelectronics, Systems & Packaging
December 7 - 8, 2016
Metropole Hotel, Lyon, France
Medical Design & Manufacturing
February 7 - 9, 2017
Convention Center Anaheim, CA, USA
Hall E, Booth# 510
DYCONEX has installed a new pre-treatment tunnel machine so it can provide an in-house Multibond process. Today, that process is qualified for flex PCBs and inner layers of rigid products.
Multibond is applied to high-reliability multilayer PCBs to improve the bonding between the single layers of a board. The underlying principle is a micro-roughening process in combination with an organic copper conversion coating for PCB inner layers. The new treatment leads to an improved adhesion between them and the prepregs, thus enhances the peel strenghts of the whole circuit board.
Furthermore, Multibond is also applied to roughen copper layers in order to improve CO2 laser drill energy absorption. This leads to better via quality and enhanced throughput.
To gain a deeper understanding on how Multibond can improve your PCB performance, please contact us at: firstname.lastname@example.org
© 2016 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland