DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.
Measuring, Testing, Monitoring
June 26 - 28, 2018
Messezentrum Nuremberg, Germany
Hall 1, Booth# 538
September 12, 2018
Convention Center, Santa Clara, CA, USA
Conference on electronics and systemintegration technology
September 18 - 20, 2018
The Westin Bellevue Hotel, Dresden, Germany
Presentation by Dr. Eckardt Bihler
Hermetic LCP modules with NFC communication
DYCONEX has installed a new pre-treatment tunnel machine so it can provide an in-house Multibond process. Today, that process is qualified for flex PCBs and inner layers of rigid products.
Multibond is applied to high-reliability multilayer PCBs to improve the bonding between the single layers of a board. The underlying principle is a micro-roughening process in combination with an organic copper conversion coating for PCB inner layers. The new treatment leads to an improved adhesion between them and the prepregs, thus enhances the peel strenghts of the whole circuit board.
Furthermore, Multibond is also applied to roughen copper layers in order to improve CO2 laser drill energy absorption. This leads to better via quality and enhanced throughput.
To gain a deeper understanding on how Multibond can improve your PCB performance, please contact us at: firstname.lastname@example.org
© 2018 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland