News & Events

1802_FTS-AGV-591
01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

MST at IMAPS Device Packaging 2018 - USA

IMAPS
Device Packaging
March 6 - 7, 2018
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, AZ, USA
Booth# 28

DYCONEX at Bodensee Aerospace Meeting 2018

bam-logo

Conference for the German-speaking aviation and space industry 
March 22, 2018
Priora Business Center, Zurich, Switzerland

Please note, the event will mainly be held in German. 


DYCONEX qualifies new Multibond process for high-reliability PCBs

DYCONEX has installed a new pre-treatment tunnel machine so it can provide an in-house Multibond process. Today, that process is qualified for flex PCBs and inner layers of rigid products.

Multibond is applied to high-reliability multilayer PCBs to improve the bonding between the single layers of a board. The underlying principle is a micro-roughening process in combination with an organic copper conversion coating for PCB inner layers. The new treatment leads to an improved adhesion between them and the prepregs, thus enhances the peel strenghts of the whole circuit board.

Furthermore, Multibond is also applied to roughen copper layers in order to improve CO2 laser drill energy absorption. This leads to better via quality and enhanced throughput.

To gain a deeper understanding on how Multibond can improve your PCB performance, please contact us at: mail.dyconex@mst.com

 multibond