News & Events

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01.02.2017

DYCONEX installs its fourth IST testing machine

DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.

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08.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

MST at IMAPS Device Packaging 2017 - USA

IMAPS
Device Packaging
March 7 - 8, 2017
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
Booth# 14

MST at MEDTEC Europe 2017

MEDTEC Europe

Leading European trade show for medical manufacturing industry
April 4 - 6, 2017
Messe Stuttgart, Germany
Swiss Pavilion Booth# 1L28

MST at MEDTEC Japan 2017

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Medical Device Manufacturing & Design Technology
April 19 - 21, 2017
Tokyo Big Sight, Tokyo, Japan
Swiss Pavilion


DYCONEX qualifies new Multibond process for high-reliability PCBs

DYCONEX has installed a new pre-treatment tunnel machine so it can provide an in-house Multibond process. Today, that process is qualified for flex PCBs and inner layers of rigid products.

Multibond is applied to high-reliability multilayer PCBs to improve the bonding between the single layers of a board. The underlying principle is a micro-roughening process in combination with an organic copper conversion coating for PCB inner layers. The new treatment leads to an improved adhesion between them and the prepregs, thus enhances the peel strenghts of the whole circuit board.

Furthermore, Multibond is also applied to roughen copper layers in order to improve CO2 laser drill energy absorption. This leads to better via quality and enhanced throughput.

To gain a deeper understanding on how Multibond can improve your PCB performance, please contact us at: mail.dyconex@mst.com

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