DYCONEX AG, an MST company and a world leading supplier of highly complex PCB solutions, opened up new reliability testing laboratories in December 2014 and in doing so further expanded this center of competence.
The new labs unify all the processes needed for the precise monitoring of product reliability.
Exhibition and technology showcase
March 17 - 18, 2015
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
Conference and technical workshops
March 17 - 19, 2015
A presentation will be held at the symposium on 11:15 AM - 11:45 AM about:
Advanced electronic packaging options for miniaturization on complex medical devices
RF and Microwave Packaging (RaMP)
April 16, 2015
Weetwood Hall Conference Centre, Leeds, UK
DYCONEX has installed a new pre-treatment tunnel machine so it can provide an in-house Multibond process. Today, that process is qualified for flex PCBs and inner layers of rigid products.
Multibond is applied to high-reliability multilayer PCBs to improve the bonding between the single layers of a board. The underlying principle is a micro-roughening process in combination with an organic copper conversion coating for PCB inner layers. The new treatment leads to an improved adhesion between them and the prepregs, thus enhances the peel strenghts of the whole circuit board.
Furthermore, Multibond is also applied to roughen copper layers in order to improve CO2 laser drill energy absorption. This leads to better via quality and enhanced throughput.
To gain a deeper understanding on how Multibond can improve your PCB performance, please contact us at: firstname.lastname@example.org
© 2015 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland