DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.
Development, Manufacturing and Use of passive & active implants
April 28 - 29, 2014
Congress Centre Kursaal, Interlaken, Switzerland
May 6- 8, 2014
Messezentrum Nürnberg, Germany
DYCONEX: Hall 9, Booth# 428
In the first half of 2013, DYCONEX AG invested in several pieces of equipment that will further enhance production technology and provide optimized PCB solutions for customers. The purchase of the field-proven Orbotech ParagonTM-9800 Laser Direct Imaging (LDI) system – as the third LDI system in production – is another step in pursuing the strategy to convert all exposure jobs to direct imaging. This standardization for all imaging steps results in a significantly faster and easier process flow.
For soldermask exposure the ParagonTM-9800 LDI system guarantees with its 16W power high throughput not only for LDI optimized soldermasks but as well for other well-established soldermask materials.
The system offers side-to-side registration and dynamic imaging modes to match the panel's distortion for highest registration accuracy of better than 20 micron.
Furthermore, for high-reliability applications, like medtech implants, full traceability can be obtained by adding serial number stamps, date stamps, 1D or 2D barcodes recording various process parameters to each panel.
After having successfully transferred all artwork printing to LDI in 2012 the implementation of the ParagonTM-9800 LDI system denotes the passing of the next milestone for soldermask imaging.
© 2014 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland