DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.
Electronic Components, Systems and Applications
November 8 - 11, 2016
Messe München, Germany
Hall C4, booth# 610
At the PCB & Components Marketplace Forum, Bernhard Schmuki, Field Application Engineer at DYCONEX, will present a recent product development and its impact on new applications under the theme: “More functionality thanks to ultra-thin materials”.
You are welcome to attend his speech on Thursday, November 10 at 4.30 pm, hall B4, booth# 365.
High tech solutions for medical technology
November 14 - 17, 2016
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03
Microelectronics, Systems & Packaging
December 7 - 8, 2016
Metropole Hotel, Lyon, France
In the first half of 2013, DYCONEX AG invested in several pieces of equipment that will further enhance production technology and provide optimized PCB solutions for customers. The purchase of the field-proven Orbotech ParagonTM-9800 Laser Direct Imaging (LDI) system – as the third LDI system in production – is another step in pursuing the strategy to convert all exposure jobs to direct imaging. This standardization for all imaging steps results in a significantly faster and easier process flow.
For soldermask exposure the ParagonTM-9800 LDI system guarantees with its 16W power high throughput not only for LDI optimized soldermasks but as well for other well-established soldermask materials.
The system offers side-to-side registration and dynamic imaging modes to match the panel's distortion for highest registration accuracy of better than 20 micron.
Furthermore, for high-reliability applications, like medtech implants, full traceability can be obtained by adding serial number stamps, date stamps, 1D or 2D barcodes recording various process parameters to each panel.
After having successfully transferred all artwork printing to LDI in 2012 the implementation of the ParagonTM-9800 LDI system denotes the passing of the next milestone for soldermask imaging.
© 2016 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland