News & Events

1802_FTS-AGV-591
01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

MST at IMAPS Device Packaging 2018 - USA

IMAPS
Device Packaging
March 6 - 7, 2018
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, AZ, USA
Booth# 28

DYCONEX at Bodensee Aerospace Meeting 2018

bam-logo

Conference for the German-speaking aviation and space industry 
March 22, 2018
Priora Business Center, Zurich, Switzerland

Please note, the event will mainly be held in German. 


DYCONEX invests in Orbotech LDI equipment

In the first half of 2013, DYCONEX AG invested in several pieces of equipment that will further enhance production technology and provide optimized PCB solutions for customers. The purchase of the field-proven Orbotech ParagonTM-9800 Laser Direct Imaging (LDI) system – as the third LDI system in production – is another step in pursuing the strategy to convert all exposure jobs to direct imaging. This standardization for all imaging steps results in a significantly faster and easier process flow.

For soldermask exposure the ParagonTM-9800 LDI system guarantees with its 16W power high throughput not only for LDI optimized soldermasks but as well for other well-established soldermask materials.

The system offers side-to-side registration and dynamic imaging modes to match the panel's distortion for highest registration accuracy of better than 20 micron.

Furthermore, for high-reliability applications, like medtech implants, full traceability can be obtained by adding serial number stamps, date stamps, 1D or 2D barcodes recording various process parameters to each panel.

After having successfully transferred all artwork printing to LDI in 2012 the implementation of the ParagonTM-9800 LDI system denotes the passing of the next milestone for soldermask imaging.

 

Orbotech_ldi