News & Events

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01.02.2017

DYCONEX installs its fourth IST testing machine

DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.

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08.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

MST at International Symposium on Microelectronics 2017, USA

IMAPS
Microelectronics
October 10 - 11, 2017
Raleigh, NC, USA
Booth# 325

DYCONEX at European Microwave Week 2017

EuMweek_2017

Europe's Premier Microwave, RF, Wireless and Radar Event
October 10 - 12, 2017
Exhibiting Center Nuremberg, Germany
Hall G85, Booth# 307

DYCONEX at Airtec 2017

Airtec

The global aerospace supply chain in one place
October 24 - 26, 2017
AeroExpoPark next to Munich Airport, Germany
Booth# G85


DYCONEX invests in Orbotech LDI equipment

In the first half of 2013, DYCONEX AG invested in several pieces of equipment that will further enhance production technology and provide optimized PCB solutions for customers. The purchase of the field-proven Orbotech ParagonTM-9800 Laser Direct Imaging (LDI) system – as the third LDI system in production – is another step in pursuing the strategy to convert all exposure jobs to direct imaging. This standardization for all imaging steps results in a significantly faster and easier process flow.

For soldermask exposure the ParagonTM-9800 LDI system guarantees with its 16W power high throughput not only for LDI optimized soldermasks but as well for other well-established soldermask materials.

The system offers side-to-side registration and dynamic imaging modes to match the panel's distortion for highest registration accuracy of better than 20 micron.

Furthermore, for high-reliability applications, like medtech implants, full traceability can be obtained by adding serial number stamps, date stamps, 1D or 2D barcodes recording various process parameters to each panel.

After having successfully transferred all artwork printing to LDI in 2012 the implementation of the ParagonTM-9800 LDI system denotes the passing of the next milestone for soldermask imaging.

 

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