DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.
Development, Manufacturing and Use of passive & active implants
April 28 - 29, 2014
Congress Centre Kursaal, Interlaken, Switzerland
May 6- 8, 2014
Messezentrum Nürnberg, Germany
DYCONEX: Hall 9, Booth# 428
DYCONEX AG (Bassersdorf, Switzerland) and the Micro Systems Technologies (MST) Group (Baar, Switzerland) are pleased to announce important changes in their management structure.
The very favorable development of the MST Group as a global provider of mission critical components, services and products for the medical implants industry requires not only investments in technology and capabilities, but also in management capacity to allow for a further increase in customer focus across the organization.
Effective July 1, 2012, Mr. Michael Fink, who has been CEO of DYCONEX AG since 2005, was appointed President Sales & Marketing of the Micro Systems Technologies Group. Relying on many years of international management experience within the electronics industry and his strong personal network, he will focus on taking the Group to the next level of customer intimacy and business success.
Mr. Fink holds a masters degree in optical engineering from the University of Applied Science, Cologne, Germany.
Also effective July 1, 2012, Dr. Hubert Zimmermann will assume Mr. Fink's former role as CEO of DYCONEX AG. Dr. Zimmermann contributes many years of international management experience in the metal-working and composites industry. He will focus on further developing DYCONEX with respect to its technology portfolio and capabilities.
Dr. Zimmermann received a Master of Science in Electrical Engineering from the Swiss Federal Institute of Technology (ETH Zurich). In addition, he was awarded a Master of Business Administration (lic. oec. HSG) and a PhD in economics (Dr. oec. HSG) from the University of St. Gallen, Switzerland.
The Micro Systems Technologies Group comprises five technology companies providing mission critical innovative products and services for medical devices, especially implants, and other high-tech industries that demand exceptional performance and reliability.
Active around the globe, the MST companies DYCONEX AG (Switzerland), Micro Systems Engineering GmbH (Germany), Micro Systems Engineering, Inc. (USA), LITRONIK Batterietechnologie GmbH (Germany) and VascoMed GmbH (Germany) offer their customers integrated solutions that range from conceptual design through series production.
Founded in 1991, Swiss-based DYCONEX AG has been a pioneer in leading-edge HDI/ultra-HDI printed circuit board technology. Applying a unique set of process capabilities, it has become the leading supplier of critical flex and rigid-flex organic substrates for medical implants and the hearing aid industry.
© 2014 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland