News & Events

27.01.2015

DYCONEX at EIPC 2015


eipc

EIPC Winter Conference
February 5-6, 2015
Hotel NH Munich Airport, Munich, Germany

Dr. Hans-Peter Klein will give a presentation
about the theme:
Flex PCB Reliability - The proof of evidence
It will take place on Thursday, February 5, 11:25hrs

MST at MD&M West Anaheim 2015

MD&M West

Medical Design & Manufacturing
February 10 - 12, 2015
Convention Center Anaheim, CA, USA
Hall E, Booth# 518

DYCONEX & Micro Systems Engineering GmbH (MSE) at IMAPS 2015 - USA

IMAPS
Device Packaging
March 17 - 18, 2015
Radisson Fort McDowell Resort, Scottsdale/Fountain Hills, AZ, USA


Launch of new information platform for the EC IMAGINE innovation project

Since 2010, DYCONEX has been actively participating in the FP7-SME-2008-1 IMAGINE Project, which is targeted at strengthening the research capabilities of SMEs and is funded by the European Union (Grant Agreement no.: 231997). This project aims to develop a low-cost/high-performance passive millimeter-wave (MMIC) camera front end that can be put to use in security-screening appli-cations such as airport body scanners.

DYCONEX has leveraged its state-of-the-art high-frequency LCP substrate technology as a re-placement for standard ceramic substrates, thus driving the development of manufacturing methods for compact high-performance broadband mm-wave antennas.

To provide a new platform for information, the consortium is introducing a new project website. It provides information about the IMAGINE Project in general, its participating partners and the tech-nologies being put to use. If you are interest in learning more about the IMAGINE Project and MMIC technology, or if you would like to get in contact with the consortium, please visit the official project website at www.acreo.se/IMAGINE