DYCONEX AG, an MST company and a world leading supplier of highly complex PCB solutions, opened up new reliability testing laboratories in December 2014 and in doing so further expanded this center of competence.
The new labs unify all the processes needed for the precise monitoring of product reliability.
Exhibition and technology showcase
March 17 - 18, 2015
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
Conference and technical workshops
March 17 - 19, 2015
A presentation will be held at the symposium on 11:15 AM - 11:45 AM about:
Advanced electronic packaging options for miniaturization on complex medical devices
RF and Microwave Packaging (RaMP)
April 16, 2015
Weetwood Hall Conference Centre, Leeds, UK
Since 2010, DYCONEX has been actively participating in the FP7-SME-2008-1 IMAGINE Project, which is targeted at strengthening the research capabilities of SMEs and is funded by the European Union (Grant Agreement no.: 231997). This project aims to develop a low-cost/high-performance passive millimeter-wave (MMIC) camera front end that can be put to use in security-screening appli-cations such as airport body scanners.
DYCONEX has leveraged its state-of-the-art high-frequency LCP substrate technology as a re-placement for standard ceramic substrates, thus driving the development of manufacturing methods for compact high-performance broadband mm-wave antennas.
To provide a new platform for information, the consortium is introducing a new project website. It provides information about the IMAGINE Project in general, its participating partners and the tech-nologies being put to use. If you are interest in learning more about the IMAGINE Project and MMIC technology, or if you would like to get in contact with the consortium, please visit the official project website at www.acreo.se/IMAGINE
© 2015 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland