DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.
Electronic Components, Systems and Applications
November 8 - 11, 2016
Messe München, Germany
Hall C4, booth# 610
At the PCB & Components Marketplace Forum, Bernhard Schmuki, Field Application Engineer at DYCONEX, will present a recent product development and its impact on new applications under the theme: “More functionality thanks to ultra-thin materials”.
You are welcome to attend his speech on Thursday, November 10 at 4.30 pm, hall B4, booth# 365.
High tech solutions for medical technology
November 14 - 17, 2016
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03
Microelectronics, Systems & Packaging
December 7 - 8, 2016
Metropole Hotel, Lyon, France
Since 2010, DYCONEX has been actively participating in the FP7-SME-2008-1 IMAGINE Project, which is targeted at strengthening the research capabilities of SMEs and is funded by the European Union (Grant Agreement no.: 231997). This project aims to develop a low-cost/high-performance passive millimeter-wave (MMIC) camera front end that can be put to use in security-screening appli-cations such as airport body scanners.
DYCONEX has leveraged its state-of-the-art high-frequency LCP substrate technology as a re-placement for standard ceramic substrates, thus driving the development of manufacturing methods for compact high-performance broadband mm-wave antennas.
To provide a new platform for information, the consortium is introducing a new project website. It provides information about the IMAGINE Project in general, its participating partners and the tech-nologies being put to use. If you are interest in learning more about the IMAGINE Project and MMIC technology, or if you would like to get in contact with the consortium, please visit the official project website at www.acreo.se/IMAGINE
© 2016 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland