DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!
Dun & Bradstreet is one of the world's most respected sources of business information, enabling companies to make commercial decisions with a high level of confidence. We are pleased to announce that in March 2012, DYCONEX AG was awarded a No.1 rating by Dun & Bradstreet for our financial strength, creditworthiness and minimum risk of failure.
We are proud to announce that DYCONEX is a founding member of a project being set up by the International Electronics Manufacturing Initiative (iNEMI) entitled «Defining Reliability Requirements for Implantable Medical Devices.»

Defense, Security + Sensing
April 24 - 26, 2012
Baltimore Convention Center, Baltimore, MD, USA
Booth# 314

SMT/HYBRID/PACKAGING
May 8 - 10, 2012
Messezentrum Nürnberg, Germany
DYCONEX: Hall 9, Booth#428
Since 2010, DYCONEX has been actively participating in the FP7-SME-2008-1 IMAGINE Project, which is targeted at strengthening the research capabilities of SMEs and is funded by the European Union (Grant Agreement no.: 231997). This project aims to develop a low-cost/high-performance passive millimeter-wave (MMIC) camera front end that can be put to use in security-screening appli-cations such as airport body scanners.
DYCONEX has leveraged its state-of-the-art high-frequency LCP substrate technology as a re-placement for standard ceramic substrates, thus driving the development of manufacturing methods for compact high-performance broadband mm-wave antennas.
To provide a new platform for information, the consortium is introducing a new project website. It provides information about the IMAGINE Project in general, its participating partners and the tech-nologies being put to use. If you are interest in learning more about the IMAGINE Project and MMIC technology, or if you would like to get in contact with the consortium, please visit the official project website at www.acreo.se/IMAGINE
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