News & Events

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17.02.2015

DYCONEX expands its center of competence for product reliability

DYCONEX AG, an MST company and a world leading supplier of highly complex PCB solutions, opened up new reliability testing laboratories in December 2014 and in doing so further expanded this center of competence.
The new labs unify all the processes needed for the precise monitoring of product reliability.

DYCONEX & Micro Systems Engineering GmbH (MSE) at IMAPS 2015 - USA

IMAPS
Device Packaging

Exhibition and technology showcase
March 17 - 18, 2015
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and technical workshops
March 17 - 19, 2015
A presentation will be held at the symposium on 11:15 AM - 11:45 AM about:
Advanced electronic packaging options for miniaturization on complex medical devices

MST at RF and Microwave Packaging (RaMP) 2015

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RF and Microwave Packaging (RaMP)
April 16, 2015
Weetwood Hall Conference Centre, Leeds, UK


DYCONEX is rated as a No.1 company by Dun & Bradstreet

Dun & Bradstreet is one of the world's most respected sources of business information, enabling companies to make commercial decisions with a high level of confidence.

We are pleased to announce that in March 2012, DYCONEX AG was awarded a No.1 rating by Dun & Bradstreet for our financial strength, creditworthiness and minimum risk of failure.

Consequently, DYCONEX AG finds itself among Switzerland's top-rated companies, which applies to only 2% of the rated group.

DYCONEX AG is very proud of this achievement and will strive to maintain this elite rating in the future.