News & Events


DYCONEX celebrates its 25th anniversary

DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.

DYCONEX at electronica 2016


Electronic Components, Systems and Applications
November 8 - 11, 2016
Messe München, Germany
Hall C4, booth# 610

At the PCB & Components Marketplace Forum, Bernhard Schmuki, Field Application Engineer at DYCONEX, will present a recent product development and its impact on new applications under the theme: “More functionality thanks to ultra-thin materials”.

You are welcome to attend his speech on Thursday, November 10 at 4.30 pm, hall B4, booth# 365.



High tech solutions for medical technology
November 14 - 17, 2016
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03

MST at IMAPS Technology Workshop Lyon 2016 - France

Microelectronics, Systems & Packaging
December 7 - 8, 2016
Metropole Hotel, Lyon, France

DYCONEX demonstrates 20-μm line & space capability on multilayer LCP product

DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!

The company strengthened its technology portfolio in late 2011 by acquiring several new, state-of the art technology assets. Now, by combining them with its considerable existing expertise in LCP technology, DYCONEX can fabricate multilayer designs with 20-micron lines and spaces. These designs were initially produced in conjunction with a customer program to develop a new family of active implantable bionic devices. That product line is currently in the early ramp-up phase, where it is being fabricated in moderate volumes with appropriate yields.