DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.
Manufacturing Processes for Medical Technology
August 31 - September 2, 2016
Marina Bay Sands, Singapore
September 14 - 15, 2016
Marylhurst University, Portland, OR, USA
September 13 - 15, 2016
Convention Center, Santa Clara, CA, USA
DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!
The company strengthened its technology portfolio in late 2011 by acquiring several new, state-of the art technology assets. Now, by combining them with its considerable existing expertise in LCP technology, DYCONEX can fabricate multilayer designs with 20-micron lines and spaces. These designs were initially produced in conjunction with a customer program to develop a new family of active implantable bionic devices. That product line is currently in the early ramp-up phase, where it is being fabricated in moderate volumes with appropriate yields.
© 2016 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland