News & Events

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17.02.2015

DYCONEX expands its center of competence for product reliability

DYCONEX AG, an MST company and a world leading supplier of highly complex PCB solutions, opened up new reliability testing laboratories in December 2014 and in doing so further expanded this center of competence.
The new labs unify all the processes needed for the precise monitoring of product reliability.

DYCONEX & Micro Systems Engineering GmbH (MSE) at IMAPS 2015 - USA

IMAPS
Device Packaging

Exhibition and technology showcase
March 17 - 18, 2015
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and technical workshops
March 17 - 19, 2015
A presentation will be held at the symposium on 11:15 AM - 11:45 AM about:
Advanced electronic packaging options for miniaturization on complex medical devices

MST at RF and Microwave Packaging (RaMP) 2015

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RF and Microwave Packaging (RaMP)
April 16, 2015
Weetwood Hall Conference Centre, Leeds, UK


DYCONEX demonstrates 20-μm line & space capability on multilayer LCP product

DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!

The company strengthened its technology portfolio in late 2011 by acquiring several new, state-of the art technology assets. Now, by combining them with its considerable existing expertise in LCP technology, DYCONEX can fabricate multilayer designs with 20-micron lines and spaces. These designs were initially produced in conjunction with a customer program to develop a new family of active implantable bionic devices. That product line is currently in the early ramp-up phase, where it is being fabricated in moderate volumes with appropriate yields.