News & Events

27.01.2015

DYCONEX at EIPC 2015


eipc

EIPC Winter Conference
February 5-6, 2015
Hotel NH Munich Airport, Munich, Germany

Dr. Hans-Peter Klein will give a presentation
about the theme:
Flex PCB Reliability - The proof of evidence
It will take place on Thursday, February 5, 11:25hrs

MST at MD&M West Anaheim 2015

MD&M West

Medical Design & Manufacturing
February 10 - 12, 2015
Convention Center Anaheim, CA, USA
Hall E, Booth# 518

DYCONEX & Micro Systems Engineering GmbH (MSE) at IMAPS 2015 - USA

IMAPS
Device Packaging
March 17 - 18, 2015
Radisson Fort McDowell Resort, Scottsdale/Fountain Hills, AZ, USA


DYCONEX demonstrates 20-μm line & space capability on multilayer LCP product

DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!

The company strengthened its technology portfolio in late 2011 by acquiring several new, state-of the art technology assets. Now, by combining them with its considerable existing expertise in LCP technology, DYCONEX can fabricate multilayer designs with 20-micron lines and spaces. These designs were initially produced in conjunction with a customer program to develop a new family of active implantable bionic devices. That product line is currently in the early ramp-up phase, where it is being fabricated in moderate volumes with appropriate yields.