News & Events

dyconex_ist_labor
01.02.2017

DYCONEX installs its fourth IST testing machine

DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.

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08.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

MST at International Symposium on Microelectronics 2017, USA

IMAPS
Microelectronics
October 10 - 11, 2017
Raleigh, NC, USA
Booth# 325

DYCONEX at European Microwave Week 2017

EuMweek_2017

Europe's Premier Microwave, RF, Wireless and Radar Event
October 10 - 12, 2017
Exhibiting Center Nuremberg, Germany
Hall G85, Booth# 307

DYCONEX at Airtec 2017

Airtec

The global aerospace supply chain in one place
October 24 - 26, 2017
AeroExpoPark next to Munich Airport, Germany
Booth# G85


DYCONEX demonstrates 20-μm line & space capability on multilayer LCP product

DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!

The company strengthened its technology portfolio in late 2011 by acquiring several new, state-of the art technology assets. Now, by combining them with its considerable existing expertise in LCP technology, DYCONEX can fabricate multilayer designs with 20-micron lines and spaces. These designs were initially produced in conjunction with a customer program to develop a new family of active implantable bionic devices. That product line is currently in the early ramp-up phase, where it is being fabricated in moderate volumes with appropriate yields.