News & Events

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08.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG, an MST company and the world's leading supplier of highly complex solutions in the area of interconnect technology, has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

MST at MD&M West Anaheim 2017

MD&M West

Medical Design & Manufacturing
February 7 - 9, 2017
Convention Center Anaheim, CA, USA
Hall E, Booth# 510

MST at IMAPS Device Packaging 2017 - USA

IMAPS
Device Packaging
March 7 - 8, 2017
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
Booth# 14


DYCONEX demonstrates 20-μm line & space capability on multilayer LCP product

DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!

The company strengthened its technology portfolio in late 2011 by acquiring several new, state-of the art technology assets. Now, by combining them with its considerable existing expertise in LCP technology, DYCONEX can fabricate multilayer designs with 20-micron lines and spaces. These designs were initially produced in conjunction with a customer program to develop a new family of active implantable bionic devices. That product line is currently in the early ramp-up phase, where it is being fabricated in moderate volumes with appropriate yields.