News & Events

1802_FTS-AGV-591
01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

DYCONEX at S.E.E. 2018

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Scandinavian Electronics Event
April 24 - 26, 2018
Kistamässan Science Citx, Kista/Stockholm, Sweden
Hall C, Booth# C11:33

DYCONEX at EMPS workshop

EMPS-9

Electronic Materials & Processes for Space (EMPS) Workshop

April 25 - 26, 2018
Y-Parc, Yverdon-les-Bains, Switzerland

Presentation by Bernhard Schmuki: 

Ultra-thin rigid PCBs with highly reliable anylayer and HDI build-ups

DYCONEX at ILA 2018

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Trade Show for Aviation, Defense & Security and Space
April 25 - 27, 2018
ExpoCenter Airport, Berlin, Germany
Hall 6 - International Suppliers Center (ISC), Booth# 424 

Details on DYCONEX presence

DYCONEX at SMT 2018

SMT HYBRID PACKAGING 2017

SMT/HYBRID/PACKAGING
June 5 - 7, 2018
Messezentrum Nuremberg, Germany
Hall 5, Booth# 211-C


DYCONEX demonstrates 20-μm line & space capability on multilayer LCP product

DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!

The company strengthened its technology portfolio in late 2011 by acquiring several new, state-of the art technology assets. Now, by combining them with its considerable existing expertise in LCP technology, DYCONEX can fabricate multilayer designs with 20-micron lines and spaces. These designs were initially produced in conjunction with a customer program to develop a new family of active implantable bionic devices. That product line is currently in the early ramp-up phase, where it is being fabricated in moderate volumes with appropriate yields.