DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.
Measuring, Testing, Monitoring
June 26 - 28, 2018
Messezentrum Nuremberg, Germany
Hall 1, Booth# 538
September 12, 2018
Convention Center, Santa Clara, CA, USA
Conference on electronics and systemintegration technology
September 18 - 20, 2018
The Westin Bellevue Hotel, Dresden, Germany
Presentation by Dr. Eckardt Bihler
Hermetic LCP modules with NFC communication
DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!
The company strengthened its technology portfolio in late 2011 by acquiring several new, state-of the art technology assets. Now, by combining them with its considerable existing expertise in LCP technology, DYCONEX can fabricate multilayer designs with 20-micron lines and spaces. These designs were initially produced in conjunction with a customer program to develop a new family of active implantable bionic devices. That product line is currently in the early ramp-up phase, where it is being fabricated in moderate volumes with appropriate yields.
© 2018 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland