News & Events

1802_FTS-AGV_208
01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

DYCONEX at SENSOR+TEST 2018

SENSOR+TEST

Measuring, Testing, Monitoring
June 26 - 28, 2018
Messezentrum Nuremberg, Germany
Hall 1, Booth# 538

DYCONEX at PCB West 2018

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PCB Industry
September 12, 2018
Convention Center, Santa Clara, CA, USA
Booth# 203

DYCONEX at Electronics System-Integration Technology Conference 2018 (ESTC)

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Conference on electronics and systemintegration technology
September 18 - 20, 2018
The Westin Bellevue Hotel, Dresden, Germany

Presentation by Dr. Eckardt Bihler 
Hermetic LCP modules with NFC communication


DYCONEX demonstrates 20-μm line & space capability on multilayer LCP product

DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!

The company strengthened its technology portfolio in late 2011 by acquiring several new, state-of the art technology assets. Now, by combining them with its considerable existing expertise in LCP technology, DYCONEX can fabricate multilayer designs with 20-micron lines and spaces. These designs were initially produced in conjunction with a customer program to develop a new family of active implantable bionic devices. That product line is currently in the early ramp-up phase, where it is being fabricated in moderate volumes with appropriate yields.