DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.
March 11 - 12, 2014
Radisson Fort McDowell Resort, Scottsdale/Fountain Hills, AZ, USA
Medical Device & Biopharma Design and Manufacturing
March 26 - 27, 2014
Convention & Exhibition Center, Boston, MA, USA
DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!
The company strengthened its technology portfolio in late 2011 by acquiring several new, state-of the art technology assets. Now, by combining them with its considerable existing expertise in LCP technology, DYCONEX can fabricate multilayer designs with 20-micron lines and spaces. These designs were initially produced in conjunction with a customer program to develop a new family of active implantable bionic devices. That product line is currently in the early ramp-up phase, where it is being fabricated in moderate volumes with appropriate yields.
© 2013 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland