DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.
Microelectronics, Systems & Packaging
December 7 - 8, 2016
Metropole Hotel, Lyon, France
Medical Design & Manufacturing
February 7 - 9, 2017
Convention Center Anaheim, CA, USA
Hall E, Booth# 510
DYCONEX has further enhanced its high-end PCB production with a 25-µm laminate cleaning unit which is capable of processing foils without assisted transport.
The newly installed equipment is a RENA "Höllmüller CLEAN" that processes laminates with thicknesses of down to 25 µm, 2 x 9 µm Cu layers and applications with lines and spaces as small as 20 µm.
RENA's big challenge was to develop a solution capable of handling thin foils and simultaneously minimize mechanical damage and surface residues. Furthermore, chemical drag-out between the separated areas had to be significantly improved. Such problems typically appear when processing 25-µm laminates with a 50-µm equipment, so RENA had to come up with a dedicated thin-laminate solution.
In close cooperation with DYCONEX, RENA mastered all the given challenges. Reinhard Düregger, VP of Operations at DYCONEX states, "For over eight months we have been running our new RENA cleaning unit in production. We use the equipment for the complete DYCONEX product mix, including 25-µm laminates with structures down to 20-µm lines and spaces." Düregger also discloses that "With this new generation of equipment, we were able to increase product traceability and reduce yield loss due to mechanical damage."
With the experience gained during this project, RENA is now certain to have everything it needs to implement all spray- and immersion-type wet applications for 25-µm laminates.
© 2016 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland