News & Events

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17.02.2015

DYCONEX expands its center of competence for product reliability

DYCONEX AG, an MST company and a world leading supplier of highly complex PCB solutions, opened up new reliability testing laboratories in December 2014 and in doing so further expanded this center of competence.
The new labs unify all the processes needed for the precise monitoring of product reliability.

DYCONEX & Micro Systems Engineering GmbH (MSE) at IMAPS 2015 - USA

IMAPS
Device Packaging

Exhibition and technology showcase
March 17 - 18, 2015
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and technical workshops
March 17 - 19, 2015
A presentation will be held at the symposium on 11:15 AM - 11:45 AM about:
Advanced electronic packaging options for miniaturization on complex medical devices

MST at RF and Microwave Packaging (RaMP) 2015

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RF and Microwave Packaging (RaMP)
April 16, 2015
Weetwood Hall Conference Centre, Leeds, UK


DYCONEX successfully running 25 µm laminates in volume using RENA cleaning unit

DYCONEX has further enhanced its high-end PCB production with a 25-µm laminate cleaning unit which is capable of processing foils without assisted transport.

The newly installed equipment is a RENA "Höllmüller CLEAN" that processes laminates with thicknesses of down to 25 µm, 2 x 9 µm Cu layers and applications with lines and spaces as small as 20 µm.

RENA's big challenge was to develop a solution capable of handling thin foils and simultaneously minimize mechanical damage and surface residues. Furthermore, chemical drag-out between the separated areas had to be significantly improved. Such problems typically appear when processing 25-µm laminates with a 50-µm equipment, so RENA had to come up with a dedicated thin-laminate solution.

In close cooperation with DYCONEX, RENA mastered all the given challenges. Reinhard Düregger, VP of Operations at DYCONEX states, "For over eight months we have been running our new RENA cleaning unit in production. We use the equipment for the complete DYCONEX product mix, including 25-µm laminates with structures down to 20-µm lines and spaces." Düregger also discloses that "With this new generation of equipment, we were able to increase product traceability and reduce yield loss due to mechanical damage."

With the experience gained during this project, RENA is now certain to have everything it needs to implement all spray- and immersion-type wet applications for 25-µm laminates.

 

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